The matrix crack evolution of cross-ply ceramic matrix composites under uniaxial tensile loading is investigated using the energy balance method.Under tensile loading,the cross-ply ceramic matrix composites have five ...The matrix crack evolution of cross-ply ceramic matrix composites under uniaxial tensile loading is investigated using the energy balance method.Under tensile loading,the cross-ply ceramic matrix composites have five damage modes.The cracking mode 3 contains transverse cracking,matrix cracking and fiber/matrix interface debonding.The cracking mode 5 only contains matrix cracking and fiber/matrix interface debonding.The cracking stress of modes 3 and 5 appearing between existing transverse cracks is determined.And the multiple matrix crack evolution of mode 3 is determined.The effects of ply thickness,fiber volume fraction,interface shear stress and interface debonding energy on the cracking stress and matrix crack evolution are analyzed.Results indicate that the cracking mode 3 is more likely to appear between transverse cracks for the SiC/CAS material.展开更多
基金Supported by the Graduate Innovation Foundation of Jiangsu Province(CX08B-133Z)the Doctoral Innovation Foundation of Nanjing University of Aeronautics and Astronautics(BCXJ08-05)~~
文摘The matrix crack evolution of cross-ply ceramic matrix composites under uniaxial tensile loading is investigated using the energy balance method.Under tensile loading,the cross-ply ceramic matrix composites have five damage modes.The cracking mode 3 contains transverse cracking,matrix cracking and fiber/matrix interface debonding.The cracking mode 5 only contains matrix cracking and fiber/matrix interface debonding.The cracking stress of modes 3 and 5 appearing between existing transverse cracks is determined.And the multiple matrix crack evolution of mode 3 is determined.The effects of ply thickness,fiber volume fraction,interface shear stress and interface debonding energy on the cracking stress and matrix crack evolution are analyzed.Results indicate that the cracking mode 3 is more likely to appear between transverse cracks for the SiC/CAS material.
