The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling meth...The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling method but unfortunately water is often undesired due to high voltages or costumer requirements. Two-phase cooling is a promising technology for electronics cooling. It allows using dielectric fluids in passive systems and still benefits from very high heat transfer coefficients. Thermosyphons are a particularly interesting technology in the field of power electronics because it is entirely passive and a simple equipment. ABB has developed a compact thermosyphon heat exchanger based on automotive technology, which uses numerous multi-port extruded tubes with capillary sized channels disposed in parallel and brazed to a heated base plate in order to achieve the desired compactness. The experimental performances of this novel power electronics cooling system are presented with R134a as a working fluid. The influence of several parameters on the performances was studied experimentally： coolant flow rate, coolant temperature, heat load and fluid filling.展开更多
During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- in...During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- ing techniques for electronic and microelectronic devices.This paper provides a review and summary of the programs with emphasis on direct liquid cooling.Included in this review are the heat transfer investigations related to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowing liquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convection air-cooling.展开更多
A frequency mixing and phase locking system is designed, in which electromagnetic shielding, microwave coupling, and intermediate frequency (IF) measurement arrangements are in- cluded. In lieu of liquid nitrogen, a p...A frequency mixing and phase locking system is designed, in which electromagnetic shielding, microwave coupling, and intermediate frequency (IF) measurement arrangements are in- cluded. In lieu of liquid nitrogen, a pulse tube cryo- cooler is used to cool the whole system. With Jo- sephson grain boundary junction as the mixing ele- ment, the 96th harmonic frequency mixing at 3 mm waveband is obtained, and phase-locked voltage- controlled oscillator (VCO) is realized.展开更多
This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be pos...This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas waspresented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd-size module have been tested also. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations.展开更多
文摘The heat losses density in power electronics products follows an ever increasing trend. Nowadays they reach 200 W/cmz at chip level and 50 W/cm2 at heatsink base level. Water cooling is the most effective cooling method but unfortunately water is often undesired due to high voltages or costumer requirements. Two-phase cooling is a promising technology for electronics cooling. It allows using dielectric fluids in passive systems and still benefits from very high heat transfer coefficients. Thermosyphons are a particularly interesting technology in the field of power electronics because it is entirely passive and a simple equipment. ABB has developed a compact thermosyphon heat exchanger based on automotive technology, which uses numerous multi-port extruded tubes with capillary sized channels disposed in parallel and brazed to a heated base plate in order to achieve the desired compactness. The experimental performances of this novel power electronics cooling system are presented with R134a as a working fluid. The influence of several parameters on the performances was studied experimentally： coolant flow rate, coolant temperature, heat load and fluid filling.
文摘During the past six years comprehensive research programs have been conducted at the Beijing Polytechnic University to provide a better understanding of heat transfer characteristics of existing and condidate cool- ing techniques for electronic and microelectronic devices.This paper provides a review and summary of the programs with emphasis on direct liquid cooling.Included in this review are the heat transfer investigations related to the following cooling modes:liquid free,mixed and forced convection,liquid jet impingement,flowing liquid film cooling,pool boiling,spray cooling,foreign gas jet impingement in liquid pool,and forced convection air-cooling.
基金supported by the National Natural Science Foundation of China(Grant Nos.10474036&10534060)the National Basic Research Program of China(2006CB601006).
文摘A frequency mixing and phase locking system is designed, in which electromagnetic shielding, microwave coupling, and intermediate frequency (IF) measurement arrangements are in- cluded. In lieu of liquid nitrogen, a pulse tube cryo- cooler is used to cool the whole system. With Jo- sephson grain boundary junction as the mixing ele- ment, the 96th harmonic frequency mixing at 3 mm waveband is obtained, and phase-locked voltage- controlled oscillator (VCO) is realized.
文摘This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas waspresented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd-size module have been tested also. Experimental results show that blocks near the entrance and behind the odd-size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations.
