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喷射沉积铝合金材料研究现状与发展趋势 被引量:6
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作者 马力 陈伟 +2 位作者 翟景 郭安振 秦占民 《兵器材料科学与工程》 CAS CSCD 2009年第2期120-124,共5页
介绍喷射沉积技术的起源和发展,着重对Osprey工艺在国内外的研究状况进行较深入的讨论。根据目前喷射沉积技术的研究热点,主要介绍喷射沉积铝合金材料,如超高强/高韧铝合金、耐热铝合金、过共晶硅铝合金、电子封装Si-Al合金等新型高性... 介绍喷射沉积技术的起源和发展,着重对Osprey工艺在国内外的研究状况进行较深入的讨论。根据目前喷射沉积技术的研究热点,主要介绍喷射沉积铝合金材料,如超高强/高韧铝合金、耐热铝合金、过共晶硅铝合金、电子封装Si-Al合金等新型高性能轻质材料的一些研究现状。展望了喷射沉积技术今后的发展趋势。 展开更多
关键词 喷射沉积 超高强/高韧铝合金 耐热铝合金 过共晶硅铝合金 电子封装合金
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Microstructure and properties of electronic packaging box with high silicon aluminum-base alloy by semi-solid thixoforming 被引量:10
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作者 贾琪瑾 刘俊友 +1 位作者 李艳霞 王文韶 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第1期80-85,共6页
The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the b... The electronic packaging box with high silicon aluminum-base alloy was prepared by semi-solid thixoforming technique.The flow characteristic of the Si phase was analyzed.The microstructures of different parts of the box were observed by optical microscopy and scanning electron microscopy,and the thermophysical and mechanical properties of the box were tested.The results show that there exists the segregation phenomenon between the primary Si phase and the liquid phase during thixoforming,the liquid phase flows from the box,and the primary Si phase accumulates at the bottom of the box.The volume fraction of primary Si phase decreases gradually from the bottom to the walls.Accordingly,the thermal conductivities of bottom center and walls are 107.6 and 131.5 W/(m·K),the coefficients of thermal expansion(CTE) are 7.9×10-6 and 10.6×10-6 K-1,respectively.The flexural strength increases slightly from 167 to 180 MPa.The microstructures and properties of the box show gradient distribution overall. 展开更多
关键词 high silicon aluminum-base alloy electronic packaging semi-solid thixoforming thermal conductivity coefficient of thermal expansion
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