In this work, new composite membranes were successfully prepared via phase inversion technique using polyvinyl chloride(PVC) and polyvinylpyrrolidone(PVP) as polymers and tetrahydrofuran(THF) and N-methyl-2-pyrrolidon...In this work, new composite membranes were successfully prepared via phase inversion technique using polyvinyl chloride(PVC) and polyvinylpyrrolidone(PVP) as polymers and tetrahydrofuran(THF) and N-methyl-2-pyrrolidone(NMP) as solvents. The prepared membranes have been characterized by scanning electron microscope(SEM), and fourier transforms infrared spectroscopy(FTIR). The scanning electron microscope results prove that the prepared membranes are smooth and their pores are distributed throughout the whole surface and bulk body of the membrane without any visible cracks. The stress–strain mechanical test showed an excellent mechanical behavior enhanced by the presence of PVP in the prepared membranes. The membranes performance results showed that the salt rejection reached 98% with a high flux. This, in turn, makes the prepared membranes can be applied for sea and brackish water treatment through membrane distillation technology.展开更多
Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage...Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage surrounding tissues, causing immune reaction and scarring. In this work, we develop stretchable microelectrode arrays, with the development of a novel soft lithography technology, which are designed and fabricated with a polymer/stretchable metal/polymer sandwich structure. With the great deformability of stretch, compression, bend and twisting, while preserving electrical property, this technology overcomes the fundamental mismatch of mechanical properties between biological tissues and electronic devices, and provides highly-compliant, confonnal and stretchable bio-electronic interfaces. Here we also describe the following three applications of the stretchable electrode arrays： a. monitoring intracranial electroencephalography （EEG）; b. stimulating peripheral nerves to drive muscles; c. monitoring epicardial electrocardiography （ECG）. Stretchable microelectrode arrays create a promising field in biomedical applications for its better modulus match with biological tissues and robust mechanical and electrical properties. They allow for construction of electronic integrated circuits spread over on complex and dynamic curved surfaces, providing a much friendlier bio-electronic interface for diagnosis, treatment and in- telligent bio-control.展开更多
A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y t...A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y table. In addition, the machine vision is implemented to improve the system＇ s flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm. As a resuh, the manipulator＇s absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device＇ s geometry model, which is the base to do off-line programming. A quite ideal trade-off between the system＇ s flexibility and efficiency is got. Finally, some verified motion specification of the manipulator, the bonding experimental results and the verified qualities of the bonded devices are provided.展开更多
The development of modern science and technology has promoted the overlapping and mutual penetration among different disciplines, which led to the technological innovations in the field of mechanical engineering. The ...The development of modern science and technology has promoted the overlapping and mutual penetration among different disciplines, which led to the technological innovations in the field of mechanical engineering. The mechatronics technology conforms to the law of development of science and technology in today, and combines the mechanical technology and electronic technology together to integrate the logistics, energy flow and information flow. This paper briefly describes the concept of mechatronics and the elements of mechatronics technology, and elaborates on the application of mechatronics technology in three different areas of the Machinery Industry in the form of living examples, finally introduces the future developing direction of mechatronics technology.展开更多
The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communica...The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communication, material science, aeronautical and astronautical engineering and et al. Modern photoelectric technology, such as laser technique, conveniently is used to measure geometrical stress field of bimaterial body, quantitatively analyse boundary mechanical behavior with crack-tip and composition of boundary matter element. One has put forward mechanical model, which is used to analyze joint energy, atom transition of matter of medium layer, diffusion and solid solution, by means of energy theory of quasi- continuous body. This paper recommended the theory, technology, and gives the results.展开更多
Silicon deep etching technique is the key fabrication step in the development of MEMS. The mask selectivity and the lateral etching control are the two primary factors that decide the result of deep etching process. T...Silicon deep etching technique is the key fabrication step in the development of MEMS. The mask selectivity and the lateral etching control are the two primary factors that decide the result of deep etching process. These two factors are studied in this paper. The experimental results show that the higher selectivity can be gotten when F - gas is used as etching gas and Al is introduced as mask layer. The lateral etching problems can be solved by adjusting the etching condition, such as increasing the RF power, changing the gas composition and flow volume of etching machine.展开更多
In this paper, we conduct research on the development of mechanical and electrical integration of system function principle and related technologies. Along with the rapid and continuous development of modem science an...In this paper, we conduct research on the development of mechanical and electrical integration of system function principle and related technologies. Along with the rapid and continuous development of modem science and technology, it ＇ s for the penetration and cross of different subjects great push, the more important is caused by technological revolution in the field of engineering and mechanical engineering field under the rapid development of computer technology and microelectronic technology and penetration to the mechanical and electrical integration, which is formed by the mechanical industry lead to trigger a particularly large changes in the mechanical industry management system and mode of production, product and technical structure, composition and function, thus result in industrial production from the previous mechanical electrification progressively electromechanical integration which lead the trend of the current technology.展开更多
文摘In this work, new composite membranes were successfully prepared via phase inversion technique using polyvinyl chloride(PVC) and polyvinylpyrrolidone(PVP) as polymers and tetrahydrofuran(THF) and N-methyl-2-pyrrolidone(NMP) as solvents. The prepared membranes have been characterized by scanning electron microscope(SEM), and fourier transforms infrared spectroscopy(FTIR). The scanning electron microscope results prove that the prepared membranes are smooth and their pores are distributed throughout the whole surface and bulk body of the membrane without any visible cracks. The stress–strain mechanical test showed an excellent mechanical behavior enhanced by the presence of PVP in the prepared membranes. The membranes performance results showed that the salt rejection reached 98% with a high flux. This, in turn, makes the prepared membranes can be applied for sea and brackish water treatment through membrane distillation technology.
基金National Natural Science Foundation of China (No. 61102042)Youth Innovation Foundation of Chinese Academy of SciencesShenzhen"Peacock Plan"to Z.Y.
文摘Most biological tissues are supple and elastic, while current electronic devices fabricated by semiconductors and metals are usually stiff and brittle. As a result, implanted electronic devices can irritate and damage surrounding tissues, causing immune reaction and scarring. In this work, we develop stretchable microelectrode arrays, with the development of a novel soft lithography technology, which are designed and fabricated with a polymer/stretchable metal/polymer sandwich structure. With the great deformability of stretch, compression, bend and twisting, while preserving electrical property, this technology overcomes the fundamental mismatch of mechanical properties between biological tissues and electronic devices, and provides highly-compliant, confonnal and stretchable bio-electronic interfaces. Here we also describe the following three applications of the stretchable electrode arrays： a. monitoring intracranial electroencephalography （EEG）; b. stimulating peripheral nerves to drive muscles; c. monitoring epicardial electrocardiography （ECG）. Stretchable microelectrode arrays create a promising field in biomedical applications for its better modulus match with biological tissues and robust mechanical and electrical properties. They allow for construction of electronic integrated circuits spread over on complex and dynamic curved surfaces, providing a much friendlier bio-electronic interface for diagnosis, treatment and in- telligent bio-control.
基金Supported by the High Technology Research and Development Programme of China （No. 2003AA404060） and the National Natural Science Foundation of China （No.60405008）.
文摘A novel MEMS device boning system is presented. Aiming at the high velocity, high precision and high flexibility requirements, a novel manipulator of planar parallel structure is developed to substitute ordinary X-Y table. In addition, the machine vision is implemented to improve the system＇ s flexibility. The initial angular positions of the joints are estimated by the extended Kalman filter algorithm. As a resuh, the manipulator＇s absolute locating accuracy in its workspace is guaranteed indirectly. For any MEMS device, the bonding system itself can be used as measurement equipment to create the device＇ s geometry model, which is the base to do off-line programming. A quite ideal trade-off between the system＇ s flexibility and efficiency is got. Finally, some verified motion specification of the manipulator, the bonding experimental results and the verified qualities of the bonded devices are provided.
文摘The development of modern science and technology has promoted the overlapping and mutual penetration among different disciplines, which led to the technological innovations in the field of mechanical engineering. The mechatronics technology conforms to the law of development of science and technology in today, and combines the mechanical technology and electronic technology together to integrate the logistics, energy flow and information flow. This paper briefly describes the concept of mechatronics and the elements of mechatronics technology, and elaborates on the application of mechatronics technology in three different areas of the Machinery Industry in the form of living examples, finally introduces the future developing direction of mechatronics technology.
基金supported by National Natural Science Foundation of Shandong, China! Z94A0102
文摘The problem of bimaterial body boundary, especially, microcosmic and macroscopic boundary behavior of bimetallic boundary, ceramic and metal, is paid close attention by many scholars in electronic device and communication, material science, aeronautical and astronautical engineering and et al. Modern photoelectric technology, such as laser technique, conveniently is used to measure geometrical stress field of bimaterial body, quantitatively analyse boundary mechanical behavior with crack-tip and composition of boundary matter element. One has put forward mechanical model, which is used to analyze joint energy, atom transition of matter of medium layer, diffusion and solid solution, by means of energy theory of quasi- continuous body. This paper recommended the theory, technology, and gives the results.
文摘Silicon deep etching technique is the key fabrication step in the development of MEMS. The mask selectivity and the lateral etching control are the two primary factors that decide the result of deep etching process. These two factors are studied in this paper. The experimental results show that the higher selectivity can be gotten when F - gas is used as etching gas and Al is introduced as mask layer. The lateral etching problems can be solved by adjusting the etching condition, such as increasing the RF power, changing the gas composition and flow volume of etching machine.
文摘In this paper, we conduct research on the development of mechanical and electrical integration of system function principle and related technologies. Along with the rapid and continuous development of modem science and technology, it ＇ s for the penetration and cross of different subjects great push, the more important is caused by technological revolution in the field of engineering and mechanical engineering field under the rapid development of computer technology and microelectronic technology and penetration to the mechanical and electrical integration, which is formed by the mechanical industry lead to trigger a particularly large changes in the mechanical industry management system and mode of production, product and technical structure, composition and function, thus result in industrial production from the previous mechanical electrification progressively electromechanical integration which lead the trend of the current technology.
