The surfaces of metallic thin films are never flat. The resistivity in thin films is very different from that in bulk because of the unavoidable rough surfaces. In this study, we apply a quantum-mechanical method to s...The surfaces of metallic thin films are never flat. The resistivity in thin films is very different from that in bulk because of the unavoidable rough surfaces. In this study, we apply a quantum-mechanical method to study the resistivity in metallic thin films.The resulting resistivity formula for metallic thin films merely involves two parameters: bulk relaxation time and surface roughness. We use the formula to fit a large number of experimental data sets for copper thin films obtained using different growing methods. With an additional tuning parameter for calibrating the film thickness, the quantum formula can provide a universal fitting to most data with a satisfactory precision, regardless of their growing methods or data source.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.11722430,11734004,61774017,21421003,and11474065)the National Key Research Program of China(Grant Nos.2016YFA0300702,and 2017YFA0303300)the National Basic Research Program of China(Grant No.2014CB921600)
文摘The surfaces of metallic thin films are never flat. The resistivity in thin films is very different from that in bulk because of the unavoidable rough surfaces. In this study, we apply a quantum-mechanical method to study the resistivity in metallic thin films.The resulting resistivity formula for metallic thin films merely involves two parameters: bulk relaxation time and surface roughness. We use the formula to fit a large number of experimental data sets for copper thin films obtained using different growing methods. With an additional tuning parameter for calibrating the film thickness, the quantum formula can provide a universal fitting to most data with a satisfactory precision, regardless of their growing methods or data source.
