在电子设备及电子产品中,屏蔽是最好的抗电磁干扰辐射危害的措施。在抑制EMI(Electro Magnetic Interference)信号的传导干扰方面,利用磁性材料制作的滤波器是极有效的器件。因此该文以各种电感的磁芯材料为对象,研究其在频率不高(低于1...在电子设备及电子产品中,屏蔽是最好的抗电磁干扰辐射危害的措施。在抑制EMI(Electro Magnetic Interference)信号的传导干扰方面,利用磁性材料制作的滤波器是极有效的器件。因此该文以各种电感的磁芯材料为对象,研究其在频率不高(低于1MHZ)时的线圈间分布电容的影响。首先,推导出了磁芯绕制分布电容的测试原理及方法;在此基础上对影响分布电容的各种因素进行了分析;最后经过测试结果及分析给出了最佳设计方案。展开更多
Two micromachined solenoid-type inductors with different electroplated core structures, ellipse and rectangle, were fabricated, tested and compared in order to reach optimum designs for integrated induetoes and transf...Two micromachined solenoid-type inductors with different electroplated core structures, ellipse and rectangle, were fabricated, tested and compared in order to reach optimum designs for integrated induetoes and transformers. In the process of fabrication, UV-LIGA, dry. etching technique, fine polishing and eleetroplating techniques have been adopted to achieve high performance mieminduetor. Experimental results show that both types of the induetors are characterized by high inductance, Q-factor and low electrical resistance. While the inductance of the inductor with rectangular magnetic core is slightly higher than that with elliptical magnetic core, the quality factor of the latter is larger than that of the former.展开更多
Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in...Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in plating affect these components, and the effects are different for Ni- and Sn-plating： （1） Plating layers exert stresses and react with the residual stress of components to change the inductance level, and the effect of the tin layer is greater than that of the nickel one; （2） The plating current induces a magnetic field inside the components directly and indirectly, and this remains as remanence inside the components and reduces the inductance level, and the effect level of Ni-plating is greater than that of Sn-plating; （3） The plating solution corrodes the interface of the termination and ferrite core of the components to release the residual stress, and causes an increase in inductance, and the effect of Sn-plating is greater than that of Ni-plating. In addition, the inductance level is the result of the net effect of these three factors, and if the sintering temperature is increased to change in the type of residual stress, the net effect will be changed.展开更多
文摘在电子设备及电子产品中,屏蔽是最好的抗电磁干扰辐射危害的措施。在抑制EMI(Electro Magnetic Interference)信号的传导干扰方面,利用磁性材料制作的滤波器是极有效的器件。因此该文以各种电感的磁芯材料为对象,研究其在频率不高(低于1MHZ)时的线圈间分布电容的影响。首先,推导出了磁芯绕制分布电容的测试原理及方法;在此基础上对影响分布电容的各种因素进行了分析;最后经过测试结果及分析给出了最佳设计方案。
基金Supported by High Technology. Research and Development Program （No. 2004AA302042）, the Nanotechnology Program of Shanghai Science ＆ Technology Committee （No. 0352nm014）, the National Natural Science Foundation of China （No. 50275096）, Samsung Advanced Institute of Technology. （SALT）, Sansung Electronics Co., Ltd., and Shanghai-Applied Materials Research and Development Fund （No.0515）.
文摘Two micromachined solenoid-type inductors with different electroplated core structures, ellipse and rectangle, were fabricated, tested and compared in order to reach optimum designs for integrated induetoes and transformers. In the process of fabrication, UV-LIGA, dry. etching technique, fine polishing and eleetroplating techniques have been adopted to achieve high performance mieminduetor. Experimental results show that both types of the induetors are characterized by high inductance, Q-factor and low electrical resistance. While the inductance of the inductor with rectangular magnetic core is slightly higher than that with elliptical magnetic core, the quality factor of the latter is larger than that of the former.
文摘Although plating is a necessary process for SMT components, it alters the magnetic characteristics and inductance level of Ni-Cu-Zn ferrite components. The results of this work show that the following three factors in plating affect these components, and the effects are different for Ni- and Sn-plating： （1） Plating layers exert stresses and react with the residual stress of components to change the inductance level, and the effect of the tin layer is greater than that of the nickel one; （2） The plating current induces a magnetic field inside the components directly and indirectly, and this remains as remanence inside the components and reduces the inductance level, and the effect level of Ni-plating is greater than that of Sn-plating; （3） The plating solution corrodes the interface of the termination and ferrite core of the components to release the residual stress, and causes an increase in inductance, and the effect of Sn-plating is greater than that of Ni-plating. In addition, the inductance level is the result of the net effect of these three factors, and if the sintering temperature is increased to change in the type of residual stress, the net effect will be changed.
