The corrosion behavior of the Cu-Ti alloys with different Ti contents in 3.5%(mass fraction)NaCl solution was investigated using electrochemical measurements,immersion tests,mass loss measurements and SEM observation....The corrosion behavior of the Cu-Ti alloys with different Ti contents in 3.5%(mass fraction)NaCl solution was investigated using electrochemical measurements,immersion tests,mass loss measurements and SEM observation.The results show that Ti dissolved in the Cu matrix changes the corrosion process of the alloys.Pure Cu sample exhibits a typical active–passive-transpassive corrosion behavior.The anodic polarization current densities of the Cu-Ti alloys steadily increase with increasing applied potential,indicating that active dissolution of copper proceeds due to the potential difference in the galvanic coupling of Cu and Ti.The increase of Ti content decreases the corrosion resistance of the Cu-Ti alloys.展开更多
金属化聚丙烯薄膜电容器(metallized polypropylene film capacitors, MPPFC)在充电条件下的自愈击穿可能造成电极和介质膜的永久性损伤,导致其电容减少和介电损耗增加。基于此,本文研究了MPPFC充电过程中的宏观特征量—自愈电压、自愈...金属化聚丙烯薄膜电容器(metallized polypropylene film capacitors, MPPFC)在充电条件下的自愈击穿可能造成电极和介质膜的永久性损伤,导致其电容减少和介电损耗增加。基于此,本文研究了MPPFC充电过程中的宏观特征量—自愈电压、自愈能量、电极损失面积等的演变规律并结合仿真分析了介质膜表面微观结构的变化特性。结果显示,自愈能量随自愈电压增加呈幂函数增长,与电极损失面积正相关,受电弧放电的影响,高压电极损失面积大于地电极且形状较地电极规则,其边界分形维数平均值(1.525)小于地电极(1.665)。此外,电极孔洞缺口轴向边缘的电流密度高于切向边缘,致使金属化聚丙烯薄膜自愈击穿过程中金属化电极轴向损伤高于切向。了解这些特性对全面揭示多场耦合复杂工况下MPPFC物性演化规律具有重要意义。展开更多
基金Project(51374151)supported by the National Natural Science Foundation of China
文摘The corrosion behavior of the Cu-Ti alloys with different Ti contents in 3.5%(mass fraction)NaCl solution was investigated using electrochemical measurements,immersion tests,mass loss measurements and SEM observation.The results show that Ti dissolved in the Cu matrix changes the corrosion process of the alloys.Pure Cu sample exhibits a typical active–passive-transpassive corrosion behavior.The anodic polarization current densities of the Cu-Ti alloys steadily increase with increasing applied potential,indicating that active dissolution of copper proceeds due to the potential difference in the galvanic coupling of Cu and Ti.The increase of Ti content decreases the corrosion resistance of the Cu-Ti alloys.
文摘金属化聚丙烯薄膜电容器(metallized polypropylene film capacitors, MPPFC)在充电条件下的自愈击穿可能造成电极和介质膜的永久性损伤,导致其电容减少和介电损耗增加。基于此,本文研究了MPPFC充电过程中的宏观特征量—自愈电压、自愈能量、电极损失面积等的演变规律并结合仿真分析了介质膜表面微观结构的变化特性。结果显示,自愈能量随自愈电压增加呈幂函数增长,与电极损失面积正相关,受电弧放电的影响,高压电极损失面积大于地电极且形状较地电极规则,其边界分形维数平均值(1.525)小于地电极(1.665)。此外,电极孔洞缺口轴向边缘的电流密度高于切向边缘,致使金属化聚丙烯薄膜自愈击穿过程中金属化电极轴向损伤高于切向。了解这些特性对全面揭示多场耦合复杂工况下MPPFC物性演化规律具有重要意义。
