The principle and application of lighting protection technology are presented in this paper. The protection treatment should be designed in multi-sided and in stereo. The design and its application show that a valid l...The principle and application of lighting protection technology are presented in this paper. The protection treatment should be designed in multi-sided and in stereo. The design and its application show that a valid lighting protection system should realize directly lighting protection, sensor lighting protection and single-point grounding. The correct connecting and grounding are the key techniques of an application.展开更多
A novel type of leakage current protector chip,implemented in the mixed-signal 0.6μm CMOS process,is presented. This chip has the advantages of low power dissipation （10mW）, accurate protection control based on dig...A novel type of leakage current protector chip,implemented in the mixed-signal 0.6μm CMOS process,is presented. This chip has the advantages of low power dissipation （10mW）, accurate protection control based on digital response delay time and integration of multi-functions such as leakage current/over-voltage/over-load detection and protection,auto switch-on and so forth. Additionally, the chip is programmable to suit different three-level protection applications with a high anti-interference ability.展开更多
This technical paper presents the resolution of high leakage current failures on QFN-mr （Quad-Flat No-leads Multi-Row） LF （leadframe） devices by optimizing the waterjet deflash process and eliminating the ESD （el...This technical paper presents the resolution of high leakage current failures on QFN-mr （Quad-Flat No-leads Multi-Row） LF （leadframe） devices by optimizing the waterjet deflash process and eliminating the ESD （electrostatic discharge） events. ESD damage to units can cause permanent or latent product failures which results in low final test yield, and worse, possible external customer complaints. The use of CO2 （carbon dioxide） bubbler was able to reduce the DI （deionized） water’s equivalent resistivity from 17 M？ to 0.30 M？, minimizing the tribocharging effect produced during the waterjet deflash process. Moreover, ESD events were eliminated by grounding the floating assembly equipment parts and installing appropriate ESD controls. It is of high importance to reduce or eliminate the leakage current failures to ensure the product quality, especially as the market becomes more demanding. After the optimization and implementation of the corrective and improvement actions, high leakage current occurrence was significantly reduced from baseline of 5,784 ppm to 20 ppm.展开更多
文摘The principle and application of lighting protection technology are presented in this paper. The protection treatment should be designed in multi-sided and in stereo. The design and its application show that a valid lighting protection system should realize directly lighting protection, sensor lighting protection and single-point grounding. The correct connecting and grounding are the key techniques of an application.
文摘A novel type of leakage current protector chip,implemented in the mixed-signal 0.6μm CMOS process,is presented. This chip has the advantages of low power dissipation （10mW）, accurate protection control based on digital response delay time and integration of multi-functions such as leakage current/over-voltage/over-load detection and protection,auto switch-on and so forth. Additionally, the chip is programmable to suit different three-level protection applications with a high anti-interference ability.
文摘This technical paper presents the resolution of high leakage current failures on QFN-mr （Quad-Flat No-leads Multi-Row） LF （leadframe） devices by optimizing the waterjet deflash process and eliminating the ESD （electrostatic discharge） events. ESD damage to units can cause permanent or latent product failures which results in low final test yield, and worse, possible external customer complaints. The use of CO2 （carbon dioxide） bubbler was able to reduce the DI （deionized） water’s equivalent resistivity from 17 M？ to 0.30 M？, minimizing the tribocharging effect produced during the waterjet deflash process. Moreover, ESD events were eliminated by grounding the floating assembly equipment parts and installing appropriate ESD controls. It is of high importance to reduce or eliminate the leakage current failures to ensure the product quality, especially as the market becomes more demanding. After the optimization and implementation of the corrective and improvement actions, high leakage current occurrence was significantly reduced from baseline of 5,784 ppm to 20 ppm.
