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(火积)耗散极值原理的电热模拟实验研究 被引量:44
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作者 朱宏晔 陈泽敬 过增元 《自然科学进展》 北大核心 2007年第12期1692-1698,共7页
建立了具有32×16节点电阻的电热模拟装置.每个节点的4个电阻可以通过并联低阻值电阻模拟在基材中填充高导热材料.实验表明,使导热性能最优的高导热材料分布与数值模拟结果相一致,从而进一步验证了导热优化的(火积)耗散极值(最小热... 建立了具有32×16节点电阻的电热模拟装置.每个节点的4个电阻可以通过并联低阻值电阻模拟在基材中填充高导热材料.实验表明,使导热性能最优的高导热材料分布与数值模拟结果相一致,从而进一步验证了导热优化的(火积)耗散极值(最小热阻)原理.实验还证明在一般情况下导热过程的优化不宜采用最小熵产原理,因为后者属于热力学优化原理,适用于热功转换过程的优化. 展开更多
关键词 [火积] 熵产 导热优化 电热模拟
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ESD电热模拟分析 被引量:2
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作者 李永坤 郝跃 罗宏伟 《半导体技术》 CAS CSCD 北大核心 2007年第1期77-81,共5页
在分析ESD失效机制的基础上,介绍了目前热击穿的研究情况,指出器件失效前所承受的功率与时间的关系对于研究热击穿的重要性;然后介绍了几个关于失效功率的热模型,分析了相关ESD模拟软件工具,提出一套有效的ESD模拟方法。
关键词 静电放电 电热模拟 瞬间崩溃
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在钳位电感负载电路中含相同或相反极性栅和漂移区的SiC GTO闸流管的电热模拟
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《电子产品可靠性与环境试验》 2003年第6期69-69,共1页
关键词 钳位电感负载电路 极性栅 漂移区 SiCGTO闸流管 电热模拟
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基于电热模拟的电迁移可靠性诊断及时钟完整性分析 被引量:1
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作者 王乃龙 张盛 周润德 《清华大学学报(自然科学版)》 EI CAS CSCD 北大核心 2004年第7期984-987,共4页
为诊断大规模集成电路设计过程中电迁移可靠性及分析时钟信号完整性,开发一种用于集成电路片上时钟信号模拟软件Etsim3。该模拟软件考虑了集成电路自热效应,通过电热耦合模拟以及金属连线温度分布解析模型获得更准确的集成电路芯片表面... 为诊断大规模集成电路设计过程中电迁移可靠性及分析时钟信号完整性,开发一种用于集成电路片上时钟信号模拟软件Etsim3。该模拟软件考虑了集成电路自热效应,通过电热耦合模拟以及金属连线温度分布解析模型获得更准确的集成电路芯片表面以及各金属连线网络上的温度分布。模拟结果表明,考虑集成电路自热效应前后,电迁移诊断以及时钟信号完整性分析结果都有了较大程度上的改变,Etsim3可以得到更为精确的分析以及诊断结果。 展开更多
关键词 大规模集成电路 电热耦合模拟 时钟信号完整性 电迁移可靠性诊断
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CMOS集成电路的自热效应和均匀温度分布的电热耦合模拟
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作者 刘淼 周润德 贾松良 《半导体技术》 CAS CSCD 北大核心 2000年第6期26-29,共4页
集成电路实际是由相互耦合的电学子系统和热学子系统共同组成。本文基于具体的封装结构提出集成电路的热学分析模型,分析了温度对集成电路性能和功耗的影响。并且针对均匀温度分布的集成电路,采用解耦法实现了电热耦合模拟软件ETs... 集成电路实际是由相互耦合的电学子系统和热学子系统共同组成。本文基于具体的封装结构提出集成电路的热学分析模型,分析了温度对集成电路性能和功耗的影响。并且针对均匀温度分布的集成电路,采用解耦法实现了电热耦合模拟软件ETsim。 展开更多
关键词 CMOS集成电路 自热效应 电热耦合模拟 温度分布
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固体电热化学炮一维模型的耦合研究
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作者 孙江生 刘志明 +1 位作者 王莹 吕艳梅 《弹道学报》 CSCD 北大核心 2000年第3期46-49,54,共5页
在固体电热化学炮 ( SPETCG)的内弹道计算过程中 ,人们多把等离子体源以电能的形式或以带修正系数的内能项直接结合到火炮内弹道零维模型上进行简化计算 .本文从固体电热化学炮内弹道一维模型出发 ,在适当假设的前提下推导出了一维耦合... 在固体电热化学炮 ( SPETCG)的内弹道计算过程中 ,人们多把等离子体源以电能的形式或以带修正系数的内能项直接结合到火炮内弹道零维模型上进行简化计算 .本文从固体电热化学炮内弹道一维模型出发 ,在适当假设的前提下推导出了一维耦合模型 ,使其对内弹道耦合过程以更精确的描述 ,并对其该模型计算的结果进行了讨论 . 展开更多
关键词 电热发射 内弹道 数值模拟 等离子体
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国家大学生创新实验项目的实践与思考 被引量:4
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作者 李文博 尹爽 +1 位作者 陈培焱 金英爱 《中国教育技术装备》 2014年第12期128-129,共2页
为了培养我国大学生的创新能力,教育部在各大高校推广实施"国家大学生创新实验计划"。通过自主思考、动手实施,调动学生的创新意识以及团队精神,训练学生的主观能动性和自我管理能力,既提高学生素质,又为将来就业打下良好基础。
关键词 创新实验 电热模拟 大学生 实践能力
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跨学科大学生创新实验培养与研究 被引量:1
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作者 尹爽 李文博 +2 位作者 李丹丹 郭立刚 金英爱 《科教文汇》 2014年第31期69-70,共2页
目前在各大高校开展的"国家大学生创新实验与实践计划项目"激发了众多学子的创新实践热情,而各大高校在鼓励学生积极参与本学科不同方向的选题的同时,也支持推动学生跨学科合作,以达到各学院大学生之间互相交流合作、碰撞出... 目前在各大高校开展的"国家大学生创新实验与实践计划项目"激发了众多学子的创新实践热情,而各大高校在鼓励学生积极参与本学科不同方向的选题的同时,也支持推动学生跨学科合作,以达到各学院大学生之间互相交流合作、碰撞出更多创新点的目的。而在跨学科学习工作中,学生也能提高自主学习能力,了解不同学科的专业知识,拓展思路,为今后发展起到良好的积极推动作用。 展开更多
关键词 跨学科 创新实验 电热模拟 复合型人才
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半导体器件电热耦合模拟程序的开发与应用
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作者 田立林 郝明 《清华大学学报(自然科学版)》 EI CAS CSCD 北大核心 1999年第S1期116-119,共4页
开发了一个半导体器件的电热耦合器件模拟程序。它以双重能量传输模型为基础,包括了晶格中的热扩散以及载流子的产生、复合所造成的能量变化,考虑了载流子能流对整个热系统的影响。根据电热耦合模拟的特点,本程序采用了组解耦法和异... 开发了一个半导体器件的电热耦合器件模拟程序。它以双重能量传输模型为基础,包括了晶格中的热扩散以及载流子的产生、复合所造成的能量变化,考虑了载流子能流对整个热系统的影响。根据电热耦合模拟的特点,本程序采用了组解耦法和异时间步长法两种算法。组解耦法的运算速度是传统算法(全Newton法)的2~3倍而内存空间可节省一半。本程序已被集成到器件模拟软件PISCES-2H中。对一个SOI结构的负阻效应和瞬态特性的模拟结果表明,该程序能够正确模拟器件发热情况以及自热对器件特性的主要影响。 展开更多
关键词 电热耦合模拟 自热 热平衡方程 组解耦法 异时间步长法
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Historic Monuments of Martial Sage Guan Yu
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作者 Feng Lin 《China & The World Cultural Exchange》 2014年第4期32-35,共4页
Guan Yu is one of the most prominent figures in Chinese traditional culture and revered as"Martial Sage",enjoyin the equal status as Confucius who is hailed as"Literary Sage".Sacrificial practices ... Guan Yu is one of the most prominent figures in Chinese traditional culture and revered as"Martial Sage",enjoyin the equal status as Confucius who is hailed as"Literary Sage".Sacrificial practices showing respect for Guan Yu have always been carried out since ancient times and have had broad and far-reaching impacts on the sphere of the Oriental Civilization and in particular,the Chinese community worldwide. 展开更多
关键词 历史遗迹 传统文化 电热模拟
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大功率固态继电器热阻计算研究
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作者 周育坤 《机电元件》 1998年第2期31-34,共4页
文章分析了大功率固态继电器内部热传递通路,以热传导定律和电热模拟法为基础,运用45°扩散法导出了大功率固态继电器热阻计算的公式。
关键词 固态继电器 电热模拟 继电器 热阻计算
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Temperature Distribution in Ridge Structure InGaN Laser Diodes and Its Influence on Device Characteristics 被引量:1
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作者 李德尧 黄永箴 +7 位作者 张书明 种明 叶晓军 朱建军 赵德刚 陈良惠 杨辉 梁骏吾 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第3期499-505,共7页
Time-dependent thermal simulation of ridge-geometry InGaN laser diodes is carried out with a two-dimensional model. A high temperature in the waveguide layer and a large temperature step between the regions under and ... Time-dependent thermal simulation of ridge-geometry InGaN laser diodes is carried out with a two-dimensional model. A high temperature in the waveguide layer and a large temperature step between the regions under and outside the ridge are generated due to the poor thermal conductivity of the sapphire substrate and the large threshold current and voltage. The temperature step is thought to have a strong influence on the characteristics of the laser diodes. Time-resolved measurements of light-current curves,spectra, and the far-field pattern of the InGaN laser diodes under pulsed operation are performed. The results show that the thermal lensing effect improves the confinement of the higher order modes and leads to a lower threshold current and a higher slope efficiency of the device while the high temperature in the active layer results in a drastic decrease in the slope efficiency. 展开更多
关键词 InGaN laser diodes ridge waveguide thermal simulation threshold current slope efficiency
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Numerical simulation of coupled thermo-electrical field for 20 kA new rare earth reduction cell 被引量:5
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作者 Xiao-jun Lü Heng-xing ZHANG +5 位作者 Ze-xun HAN Kang-jie WANG Chao-hong GUAN Qi-dong SUN Wei-wei WANG Min-ren WEI 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2020年第4期1124-1134,共11页
To solve the problems of high energy consumption,low efficiency and short service life of conventional rare earth reduction cells,a 20 kA new rare earth reduction cell(NRERC)was presented.The effects of the anode-cath... To solve the problems of high energy consumption,low efficiency and short service life of conventional rare earth reduction cells,a 20 kA new rare earth reduction cell(NRERC)was presented.The effects of the anode-cathode distance(ACD)and electrolyte height(EH)on the thermo-electrical behavior of the NRERC were studied by ANSYS.The results illustrate that the cell voltage drop(CVD)and the temperature will rise with a similar tendency when the ACD increases.Also,the temperature rises gradually with EH,but the CVD decreases.Ultimately,when the ACD is 115 mm and the EH is 380 mm,the CVD is 4.61 V and the temperature is 1109.8℃.Under these conditions,the thermal field distribution is more reasonable and the CVD is lower,which is beneficial to the long service life and low energy consumption of the NRERC. 展开更多
关键词 rare earth reduction cell anode-cathode distance electrolyte height thermo-electrical field numerical simulation
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Microstructure evolution of 7050 aluminum alloy during hot deformation 被引量:17
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作者 李俊鹏 沈健 +2 位作者 闫晓东 毛柏平 闫亮明 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2010年第2期189-194,共6页
Hot compression of 7050 aluminum alloy was performed on Gleeble 1500D thermo-mechanical simulator at 350 ℃ and 450 ℃ with a constant strain rate of 0.1 s-1 to different nominal strains of 0.1, 0.3 and 0.7. Microstru... Hot compression of 7050 aluminum alloy was performed on Gleeble 1500D thermo-mechanical simulator at 350 ℃ and 450 ℃ with a constant strain rate of 0.1 s-1 to different nominal strains of 0.1, 0.3 and 0.7. Microstructures of 7050 alloy under various compression conditions were observed by TEM to investigate the microstructure evolution process of the alloy deformed at various temperatures. The microstructure evolves from dislocation tangles to cell structure and subgrain structure when being deformed at 350 ℃, of which dynamic recovery is the softening mechanism. However, continuous dynamic recrystallization (DRX) occurs during hot deformation at 450 ℃, in which the main nucleation mechanisms of DRX are subgrain growth and subgrain coalescence rather than particle-simulated nucleation (PSN). 展开更多
关键词 microstructure evolution dynamic recovery dynamic recrystallization hot deformation 7050 alloy
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Thermal Characteristics of Optoelectronic Modules with DIP and BGA Package
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作者 GAO Hong-xia YU jian-zu XIE Yong-qi 《Semiconductor Photonics and Technology》 CAS 2006年第1期43-46,共4页
In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are model... In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are modeled and thermally simulated, their thermal characterizations are compared and discussed by using the temperature contours and the simulated heating characterization curves in free air and forced air ambient. The results show that BGA has superior inside and outside total performances, and has the promising future in the highly integrated optoelectronics. 展开更多
关键词 Thermal performance DIP BGA Heating characterization Numerical simulation
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Modeling, Simulation, and Implementation of a Solar Thermoelectric Energy Harvesting System
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作者 Yacouba Moumouni R. Jacob Baker 《Journal of Energy and Power Engineering》 2016年第5期296-312,共17页
New alternatives and inventive renewable energy techniques which encompass both generation and power management solutions are fundamental for meeting remote residential energy supply and demand today, especially if th... New alternatives and inventive renewable energy techniques which encompass both generation and power management solutions are fundamental for meeting remote residential energy supply and demand today, especially if the grid is quasi-inexistent. Solar thermoelectric generators mounted on a dual-axis sun tracker can be a cost-effective alternative to photovoltaics for remote residential household power generation. A complete solar thermoelectric energy harvesting system is presented in this paper for energy delivery to remote residential areas in developing regions. To this end, the entire system was built, modeled, and then validated with the LTspice simulator software via the thermal-to-electrical analogy schemes. Valuable data in conjunction with a novel LTspice circuit were obtained, showing the achievability of analyzing transient heat transfer with the SPICE simulator; however a few of the problems to be solved remain at the practical level. Despite the unusual operation of the thermoelectric modules with the solar radiation, the simulation and measurements were in good agreement, thus validating the new modeling strategy. 展开更多
关键词 Solar thermoelectric generator developing regions LTspice DC-DC converter thermal-to-electrical analogy.
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Temperature Distributions in Single Cell of Polymer Electrolyte Fuel Cell Simulated by an 1D Multi-plate Heat-Transfer Model and a 3D Numerical Simulation Model
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作者 Akira Nishimura Masashi Baba +3 位作者 Kotaro Osada Takenori Fukuoka MasafumiHirota Eric Hu 《Journal of Energy and Power Engineering》 2015年第8期687-704,共18页
The purpose of this study is to verify an 1D multi-plate heat-transfer model estimating the temperature distribution on the interface between polymer electrolyte membrane and catalyst layer at cathode in single cell o... The purpose of this study is to verify an 1D multi-plate heat-transfer model estimating the temperature distribution on the interface between polymer electrolyte membrane and catalyst layer at cathode in single cell of polymer electrolyte fuel cell, which is named as reaction surface in this study, with a 3D numerical simulation model solving many governing equations on the coupling phenomena in the cell. The results from both models/simulations agreed well. The effects of initial operation temperature, flow rate, and relative humidity of supply gas on temperature distribution on the reaction surface were also investigated. It was found in both 1D and 3D simulations that, the temperature rise (i.e., Treact-Tini) of the reaction surface from initial operation temperature at 70℃ was higher than that at 80℃ irrespective of flow rate of supply gas. The effect of relative humidity of supply gas on Treact- Tini near the inlet of the cell was small. Compared to the previous studies conducted under the similar operation conditions, the Treact - Tini calculated by 1D multi-plate heat-transfer model in this study as well as numerical simulation using 3D model was reasonable. 展开更多
关键词 Polymer electrolyte fuel cell 1D multi-plate heat-transfer model 3D numerical simulation model temperaturedistribution.
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新型节能墙体热工性能测量方法的研究 被引量:5
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作者 耿欣 林中达 龚伟 《能源研究与利用》 2010年第3期14-16,26,共4页
介绍了国内建筑节能的发展情况,归纳国内外测量墙体材料热工性能的主要方法,从而合理精确地计算出墙体的导热系数,并总结归纳出几套简洁实用的测量方案。最后,将通过实验来研讨的方案综合评定,设计最为简便可行的方案。
关键词 热流计 建筑节能 热工性能 电热模拟 动态传热
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采用解耦法和热点法研究集成电路的自热效应
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作者 刘淼 周润德 +3 位作者 贾松良 顾毓沁 梁新刚 张荣海 《清华大学学报(自然科学版)》 EI CAS CSCD 北大核心 2001年第4期194-198,共5页
自热效应对集成电路的性能和功耗有很大的影响。该文以 HSPICE电路模拟程序为电路模拟的基础 ,以改进的热点温度估算方法为热学模拟的基础 ,采用解耦法实现了集成电路的电热耦合时序模拟软件。给定芯片的版图信息和输入信号模式 ,该软... 自热效应对集成电路的性能和功耗有很大的影响。该文以 HSPICE电路模拟程序为电路模拟的基础 ,以改进的热点温度估算方法为热学模拟的基础 ,采用解耦法实现了集成电路的电热耦合时序模拟软件。给定芯片的版图信息和输入信号模式 ,该软件能够计算芯片的工作温度分布 ,并得到该温度分布下的电路性能 ,与传统的数值方法比较 ,速度快一个数量级以上。采用红外热成像方法测量 THF930 5传真机热印头驱动专用集成电路芯片的工作温度分布 。 展开更多
关键词 集成电路 电热耦合模拟 红外热成像系统 解耦法 热点法 百热效应
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Classification and reduction manipulation of fractures in Chinese traditional Mongolian osteopathy 被引量:7
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作者 Mei Wang Zhanhong Bao Namula Zhao 《Journal of Traditional Chinese Medicine》 SCIE CAS CSCD 2014年第1期122-126,共5页
OBJECTIVE:To explore the concept of classification and reduction manipulation of fractures in Chinese traditional Mongolian osteopathy.METHODS:Based on the linear classification of fractures in Chinese traditional Mon... OBJECTIVE:To explore the concept of classification and reduction manipulation of fractures in Chinese traditional Mongolian osteopathy.METHODS:Based on the linear classification of fractures in Chinese traditional Mongolian osteopathy and the practice of reduction manipulation,a dynamic classification and reduction manipulation concept of fractures was established with the use of modern biomechanical principles and methods.RESULTS:We classified the linear classification and reduction manipulation of fractures in Chinese traditional Mongolian osteopathy based on the achievement of fracture line and used the cause of the formation of the fracture line for our dynamic classification and reduction manipulation of fractures concept.CONCLUSION:The etiology of the formation of fracture lines can be used to decrease diagnostic error,increase therapeutic effects of manipulation,and further provide a new concept and method for the development of the reduction concept of fractures. 展开更多
关键词 FRACTURES BONE Traditional Mongolian osteopathy Linear classification Dynamic classifica-tion Reduction manipulation
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