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电渣重熔结晶器焊接工艺的研究 被引量:1
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作者 张鸿俭 刘志明 +1 位作者 吴永江 张鹤 《焊接技术》 北大核心 1998年第1期14-16,共3页
为了提高电渣重熔结晶器的质量,延长其使用寿命,降低成本,在进行了一系列试验的基础上,对电渣重熔结晶器的焊接工艺进行了探讨,推荐了适于单件小批量生产采用的既经济实用,效果又较好的几种工艺方法,供生产中参考选用。
关键词 渣重熔结晶器 焊接 异种金属焊接 渣精炼
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电渣液态浇注新工艺制备高质量低成本复合轧辊 被引量:1
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作者 李万明 姜周华 +2 位作者 耿鑫 易高松 张腾方 《特殊钢》 北大核心 2012年第6期12-15,共4页
电渣液态浇注技术(ESS LM)是基于特殊结构的导电结晶器,采用向结晶器中浇入液态金属进行电渣复合的方式生产复合轧辊的新工艺。叙述和介绍了目前国内轧辊行业的现状和发展趋势以及电渣液态浇注技术的原理和特点。通过比较离心浇注法、... 电渣液态浇注技术(ESS LM)是基于特殊结构的导电结晶器,采用向结晶器中浇入液态金属进行电渣复合的方式生产复合轧辊的新工艺。叙述和介绍了目前国内轧辊行业的现状和发展趋势以及电渣液态浇注技术的原理和特点。通过比较离心浇注法、连续浇注复合铸造法(CPC)和电渣液态浇注法,分析了电渣液态浇注法的优势和潜力,并介绍了电渣液态浇注方法生产复合轧辊的开发应用情况。 展开更多
关键词 复合轧辊 渣液态浇注导 电结晶器
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结晶器电磁搅拌对轴承钢小方坯碳偏析影响 被引量:3
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作者 刘泳 王恭亮 刘瑞宁 《连铸》 2012年第5期43-46,共4页
以150mm×150mm GCr15小方坯的试验数据为依据,分析了结晶器电磁搅拌电流参数和连铸工艺参数对连铸坯中心碳偏析以及低倍组织的影响。
关键词 轴承钢 结晶器 优化
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Low phase noise LC VCO design in CMOS technology 被引量:2
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作者 李智群 王志功 +1 位作者 张立国 徐勇 《Journal of Southeast University(English Edition)》 EI CAS 2004年第1期6-9,共4页
This paper presents the design and the experimental measurements of two complementary metal-oxide-semiconductor (CMOS) LC-tuned voltage controlled oscillators (VCO) implemented in a 0.18 μm 6-metal-layer mixed-signal... This paper presents the design and the experimental measurements of two complementary metal-oxide-semiconductor (CMOS) LC-tuned voltage controlled oscillators (VCO) implemented in a 0.18 μm 6-metal-layer mixed-signal/RF CMOS technology. The design methodologies and approaches for the optimization of the ICs are presented. The first design is optimized for mixed-signal transistor, oscillated at 2.64 GHz with a phase noise of -93.5 dBc/Hz at 500 kHz offset. The second one optimized for RF transistor, using the same architecture, oscillated at 2.61 GHz with a phase noise of -95.8 dBc/Hz at 500 kHz offset. Under a 2 V supply, the power dissipation is 8 mW, and the maximum buffered output power for mixed-signal and RF transistor are -7 dBm and -5.4 dBm, respectively. Both kinds of oscillators make use of on-chip components only, allowing for simple and robust integration. 展开更多
关键词 CMOS integrated circuits Integrated circuit layout TRANSISTORS
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Numerical Simulation and Analysis of Bipolar Junction Photogate Transistor for CMOS Image Sensor
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作者 金湘亮 陈杰 仇玉林 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第3期250-254,共5页
A new photodetector--bipolar junction photogate transistor is presented for CMOS image sensor and its analytical model is also established.With the technical parameter of the 0.6μm CMOS process,the bipolar junction p... A new photodetector--bipolar junction photogate transistor is presented for CMOS image sensor and its analytical model is also established.With the technical parameter of the 0.6μm CMOS process,the bipolar junction photogate transistor is analyzed and simulated.The simulated results illustrate that the bipolar junction photogate transistor has the similar characteristics of the traditional photogate transistor.The photocurrent density of the bipolar junction photogate transistor increases exponentially with the incidence light power due to introducing the injection p+n junction.Its characteristic of blue response is rather improved compared to the traditional photogate transistor that benefits to increase the color photograph made up of the red,the green,and the blue. 展开更多
关键词 bipolar junction photogate transistor PHOTODETECTOR CMOS image sensor
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Development of Ferroelectric RAM (FRAM) for Mass Production
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作者 Takashi Eshita Wensheng Wang +9 位作者 Kou Nakamura Souichirou Ozawa Youichi Okita Satoru Mihara Yukinobu Hikosaka Hitoshi Saito Junichi Watanabe Ken'ichi Inoue Hideshi Yamaguchi KenjiNomura 《Journal of Physical Science and Application》 2015年第1期29-32,共4页
we have developed ferroelectric capacitor fabrication technique to realize low-voltage and high-density ferroelectric random access memory (FRAM). High temperature deposited IrOxtop electrode reveals high crystallin... we have developed ferroelectric capacitor fabrication technique to realize low-voltage and high-density ferroelectric random access memory (FRAM). High temperature deposited IrOxtop electrode reveals high crystalline quality which drastically reduces the degradation of ferroelectric film by preventing hydrogen diffusion into ferroelectric film. This improvement enables us to commercialize highly-reliable 1T 1C FRAM with memory density of 4 Mb or larger. 展开更多
关键词 FERROELECTRIC PZT LCSPZT lrO.
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