The barrier to the copper diffusion is one of the key technologies in copper metallization. A novel barrier has been presented, which is a thin film of silicon oxynitride formed by implanting nitrogen into PECVD silic...The barrier to the copper diffusion is one of the key technologies in copper metallization. A novel barrier has been presented, which is a thin film of silicon oxynitride formed by implanting nitrogen into PECVD silicon dioxide. The method proved highly effective to block the copper diffusion after high frequency C V measurements at different BTS (Bias Thermal Stress) conditions and the XPS (X ray Photoelectron Spectroscopy) analysis. Furthermore, this method has the advantage of simplifying the damascene process of copper metallization, which has also been analyzed and discussed in detail.展开更多
The Balanced Truncation Method (BTM) is applied to an even distributed RC interconnect case by using Wang's closed-forms of even distributed RC interconnect models. The results show that extremely high order RC in...The Balanced Truncation Method (BTM) is applied to an even distributed RC interconnect case by using Wang's closed-forms of even distributed RC interconnect models. The results show that extremely high order RC interconnect can be high-accurately approximated by only third order balanced model. Related simulations are executed in both time domain and frequency domain. The results may be applied to VLSI interconnect model reduction and design.展开更多
ABC95 array computer is a multi-function network computer based on FPGA technology. A notable feature of ABC95 array computer is the support of complex interconnection, which determines that the computer must have eno...ABC95 array computer is a multi-function network computer based on FPGA technology. A notable feature of ABC95 array computer is the support of complex interconnection, which determines that the computer must have enough I/O band and flexible communications between Pes. The authors designed the interconnecting network chips of ABC95 and realized a form of multi-function interconnection. The multi-function interconnecting network supports conflict-free access from processors to memory matrix and the MESH network of enhanced processors to processor communications. The design scheme has been proved feasible by experiment.展开更多
文摘The barrier to the copper diffusion is one of the key technologies in copper metallization. A novel barrier has been presented, which is a thin film of silicon oxynitride formed by implanting nitrogen into PECVD silicon dioxide. The method proved highly effective to block the copper diffusion after high frequency C V measurements at different BTS (Bias Thermal Stress) conditions and the XPS (X ray Photoelectron Spectroscopy) analysis. Furthermore, this method has the advantage of simplifying the damascene process of copper metallization, which has also been analyzed and discussed in detail.
基金Supported in part by the National Science Foundation (US) under Grant CCR 0098275
文摘The Balanced Truncation Method (BTM) is applied to an even distributed RC interconnect case by using Wang's closed-forms of even distributed RC interconnect models. The results show that extremely high order RC interconnect can be high-accurately approximated by only third order balanced model. Related simulations are executed in both time domain and frequency domain. The results may be applied to VLSI interconnect model reduction and design.
文摘ABC95 array computer is a multi-function network computer based on FPGA technology. A notable feature of ABC95 array computer is the support of complex interconnection, which determines that the computer must have enough I/O band and flexible communications between Pes. The authors designed the interconnecting network chips of ABC95 and realized a form of multi-function interconnection. The multi-function interconnecting network supports conflict-free access from processors to memory matrix and the MESH network of enhanced processors to processor communications. The design scheme has been proved feasible by experiment.
