The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid...The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.展开更多
The IEEE Standard 1149.1 boundary scan (BS) implementation provides the internal access required for testing the digital printed circuit board (PCB). However, the integrity of the boundary scan test infrastructure sh...The IEEE Standard 1149.1 boundary scan (BS) implementation provides the internal access required for testing the digital printed circuit board (PCB). However, the integrity of the boundary scan test infrastructure should be tested first to guarantee the validation of the results of the rest functional test and diagnosis. This paper describes the fault models and test principles of the BS test access port (TAP) lines on PCBs. A test algorithm with high fault coverage and short time is then presented for the PCB on which all ICs are BS ones.展开更多
基金Project(51271032)supported by the National Natural Science Foundation of China
文摘The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.
文摘The IEEE Standard 1149.1 boundary scan (BS) implementation provides the internal access required for testing the digital printed circuit board (PCB). However, the integrity of the boundary scan test infrastructure should be tested first to guarantee the validation of the results of the rest functional test and diagnosis. This paper describes the fault models and test principles of the BS test access port (TAP) lines on PCBs. A test algorithm with high fault coverage and short time is then presented for the PCB on which all ICs are BS ones.
