The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were invest...The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.展开更多
The solvent extraction technology, was applied to recover Cu^2＋ and Ni^2＋ from plating wastewater.Lix984N was chosen as the extractant due to-its gooff extraction performance. The influence parame-ters were examlned...The solvent extraction technology, was applied to recover Cu^2＋ and Ni^2＋ from plating wastewater.Lix984N was chosen as the extractant due to-its gooff extraction performance. The influence parame-ters were examlned. The results show that the separation of Cu^2＋ and Ni＂ from sulphate medium can be realized by adjusting pH value with the help of Lix984N. For extracting Cu^2＋ and Ni^2＋, the optimal pH values are 4 and 10.5, and the maximal extraction percentages are 92.9% and 93.0%, respectively .With recovered Cu^2＋ and Ni^2＋ stripped in 170g.L^ -1 and 200 g.L^-1 H2SO4 medium, the stripping percentages of Cu^2＋ and Ni^2＋ are 92.9% and 93.0%, respectively. This method is simple and can be used to recover Cu^2＋ and Ni^2＋ from plating wastewater. And a flow sheet for separation of Cu^2＋ and Ni^2＋ is presented.展开更多
The studies have been carried out in laboratory on the effect of dyeing,electroplating, pesticide effluents and their intermixture on embryos of lefteye flounder (Paralichthys olivaceus ). The main toxic substances in...The studies have been carried out in laboratory on the effect of dyeing,electroplating, pesticide effluents and their intermixture on embryos of lefteye flounder (Paralichthys olivaceus ). The main toxic substances in dying effluent are aniline ( 20 mg/L ) andphenol ( 24 mg/L ). The main toxic substances in electroplating effluent are Zn ( 1 970 mg/L ). Cu (9 mg/L ) and Pb ( 7.5 mg/L ). The main toxic substances in pesticide effluent are monocrotophos andphosphite. The test results indicate that the lowest concentrations of dyeing, electroplating,pesticide effluents and their intermixture, having significant effect on the hatch rate anddevelopment of P. olivaceus embryos, are 0.5 %, 0.15 %, 0.25 % and 0.25 %, respectively; and theincipient LC_(50) of dyeing, electroplating, pesticide effluents and their intermixture are 3.38 % (2.29 %～3.87 % ), 0.81 % ( 0.71 % ～0. 92 % ). 1.57 % ( 1.37 %～1.82 % ) and 1.48 % ( 1.24 %～1.76% ). Based on the incipient LG_(50) values, the toxicity sequence of the three industrial effluentsis in the order of electroplating effluent > pesticide effluent > dyeing effluent.展开更多
This paper studied the wear characteristics as well as the wear mechanism of the Ni-P alloy brush-plating coating by means of sliding-wear tests, SEM and X Ray analyses. The results show that Ni-Palloy coating has exc...This paper studied the wear characteristics as well as the wear mechanism of the Ni-P alloy brush-plating coating by means of sliding-wear tests, SEM and X Ray analyses. The results show that Ni-Palloy coating has excellent wear-ability in high temperature, and the wear mechanism of the coating is that both the adhesive wear and abrasive wear exist in a boundary lubrication condition. The wear model was built up.展开更多
The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents,paraformaldehyde as reducing agent,and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additive...The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents,paraformaldehyde as reducing agent,and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additives was investigated.The stability of the electroless copper solution was monitored by measuring the absorbance of the solution with a UV-Visible spectrophotometer and the solution was quite stable up to 15 h.The adhesion of copper films on mild steel foil was assessed by standard bend test and exhibited good adhesion.The XRD results indicate that the copper films have a(111) texture.Moreover,the additives suppress the predominant(111) plane crystal growth and increase the rate of(220) texture crystal growth.The crystal size of the copper films was calculated using the Scherrer formula from the predominant peak.SEM and AFM studies reveal that these two additives modify the crystal structure,grain size and surface morphology of the copper films.The cyclic voltammetry studies reveal that the additives are adsorbed on the electrode surface and inhibit the rate of deposition.Potentiodynamic polarization and electrochemical impedance studies reveal that the deposits produced in the presence of additives display higher corrosion resistance.展开更多
The process of obtaining of high quality Mn-Zn, Mn-Cu and Mn-Cu-Zn alloy coatings from complexing ligands--citrate, EDTA （ethylene diaminetetra acetic acid） and nitrilotriacetic acid solutions was studied. Factors a...The process of obtaining of high quality Mn-Zn, Mn-Cu and Mn-Cu-Zn alloy coatings from complexing ligands--citrate, EDTA （ethylene diaminetetra acetic acid） and nitrilotriacetic acid solutions was studied. Factors affecting stability of solutions containing ligand or ligands and influence of electrolysis parameters： electrolyte composition, pH, cathodic current density on chemical composition of the obtained coatings, on their current efficiency, morphology and structure were investigated.展开更多
文摘The effects of additives(polyethylene glycol(PEG),sodium dodecyl sulfate(SDS))and WC nano-powder on the microstructure,relative density,hardness and electrical conductivity of electroplated WC−Cu composite were investigated.The preparation mechanism was also studied.The microstructure of samples was analyzed by XRD,SEM,EDS,TEM and HRTEM.The synergistic effect of PEG and SDS made the WC−Cu composite more compact during the electroplating process.The hardness of WC−Cu composites increased with the increase in WC content,while the electrical conductivity decreased with the increase in WC content.The density of samples tended to increase initially and then decreased with increase in the additive content.When the electroplating solution contained 10 g/L WC nanopowder,0.2 g/L PEG and 0.1 g/L SDS,the WC−Cu composite exhibited hardness of HV 221 and electric conductivity of 53.7 MS/m.Therefore,the results suggest that WC−Cu composite with excellent properties can be obtained by optimizing the content of additives and WC particles.
基金Supported by the National Key Technologies Research and Development Program of China during the 1 lth Five-Year Plan Period （2007BAB22B01） and the Young Science Foundation of Jiangxi Province Education Office （GJJ11124）.
文摘The solvent extraction technology, was applied to recover Cu^2＋ and Ni^2＋ from plating wastewater.Lix984N was chosen as the extractant due to-its gooff extraction performance. The influence parame-ters were examlned. The results show that the separation of Cu^2＋ and Ni＂ from sulphate medium can be realized by adjusting pH value with the help of Lix984N. For extracting Cu^2＋ and Ni^2＋, the optimal pH values are 4 and 10.5, and the maximal extraction percentages are 92.9% and 93.0%, respectively .With recovered Cu^2＋ and Ni^2＋ stripped in 170g.L^ -1 and 200 g.L^-1 H2SO4 medium, the stripping percentages of Cu^2＋ and Ni^2＋ are 92.9% and 93.0%, respectively. This method is simple and can be used to recover Cu^2＋ and Ni^2＋ from plating wastewater. And a flow sheet for separation of Cu^2＋ and Ni^2＋ is presented.
文摘The studies have been carried out in laboratory on the effect of dyeing,electroplating, pesticide effluents and their intermixture on embryos of lefteye flounder (Paralichthys olivaceus ). The main toxic substances in dying effluent are aniline ( 20 mg/L ) andphenol ( 24 mg/L ). The main toxic substances in electroplating effluent are Zn ( 1 970 mg/L ). Cu (9 mg/L ) and Pb ( 7.5 mg/L ). The main toxic substances in pesticide effluent are monocrotophos andphosphite. The test results indicate that the lowest concentrations of dyeing, electroplating,pesticide effluents and their intermixture, having significant effect on the hatch rate anddevelopment of P. olivaceus embryos, are 0.5 %, 0.15 %, 0.25 % and 0.25 %, respectively; and theincipient LC_(50) of dyeing, electroplating, pesticide effluents and their intermixture are 3.38 % (2.29 %～3.87 % ), 0.81 % ( 0.71 % ～0. 92 % ). 1.57 % ( 1.37 %～1.82 % ) and 1.48 % ( 1.24 %～1.76% ). Based on the incipient LG_(50) values, the toxicity sequence of the three industrial effluentsis in the order of electroplating effluent > pesticide effluent > dyeing effluent.
文摘This paper studied the wear characteristics as well as the wear mechanism of the Ni-P alloy brush-plating coating by means of sliding-wear tests, SEM and X Ray analyses. The results show that Ni-Palloy coating has excellent wear-ability in high temperature, and the wear mechanism of the coating is that both the adhesive wear and abrasive wear exist in a boundary lubrication condition. The wear model was built up.
文摘The electroless deposition process of copper plating consisting of TEA and EDTA as complexing agents,paraformaldehyde as reducing agent,and 2-mercaptobenzothiozole as stabilizer and gelatin and animal glue as additives was investigated.The stability of the electroless copper solution was monitored by measuring the absorbance of the solution with a UV-Visible spectrophotometer and the solution was quite stable up to 15 h.The adhesion of copper films on mild steel foil was assessed by standard bend test and exhibited good adhesion.The XRD results indicate that the copper films have a(111) texture.Moreover,the additives suppress the predominant(111) plane crystal growth and increase the rate of(220) texture crystal growth.The crystal size of the copper films was calculated using the Scherrer formula from the predominant peak.SEM and AFM studies reveal that these two additives modify the crystal structure,grain size and surface morphology of the copper films.The cyclic voltammetry studies reveal that the additives are adsorbed on the electrode surface and inhibit the rate of deposition.Potentiodynamic polarization and electrochemical impedance studies reveal that the deposits produced in the presence of additives display higher corrosion resistance.
文摘The process of obtaining of high quality Mn-Zn, Mn-Cu and Mn-Cu-Zn alloy coatings from complexing ligands--citrate, EDTA （ethylene diaminetetra acetic acid） and nitrilotriacetic acid solutions was studied. Factors affecting stability of solutions containing ligand or ligands and influence of electrolysis parameters： electrolyte composition, pH, cathodic current density on chemical composition of the obtained coatings, on their current efficiency, morphology and structure were investigated.
