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A novel method to improve interfacial bonding of compound squeeze cast Al/Al-Cu macrocomposite bimetals:Simulation and experimental studies 被引量:6
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作者 Mohammad Hossein BABAEE Ali MALEKI Behzad NIROUMAND 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2019年第6期1184-1199,共16页
A facile and innovative method to improve bonding between the two parts of compound squeeze cast Al/Al-4.5 wt.%Cu macrocomposite bimetals was developed and its effects on microstructure and mechanical properties of th... A facile and innovative method to improve bonding between the two parts of compound squeeze cast Al/Al-4.5 wt.%Cu macrocomposite bimetals was developed and its effects on microstructure and mechanical properties of the bimetal were investigated.A special concentric groove pattern was machined on the top surface of the insert(squeeze cast Al-4.5 wt.%Cu) and its effects on heat transfer,solidification and distribution of generated stresses along the interface region of the bimetal components were simulated using ProCAST and ANSYS softwares and experimentally verified. Simulation results indicated complete melting of the tips of the surface grooves and local generation of large stress gradient fields along the interface. These are believed to result in rupture of the insert interfacial aluminum oxide layer facilitating diffusion bonding of the bimetal components. Microstructural evaluations confirmed formation of an evident transition zone along the interface region of the bimetal. Average thickness of the transition zone and tensile strength of the bimetal were significantly increased to about 375 μm and 54 MPa, respectively, by applying the surface pattern.The proposed method is an affordable and promising approach for compound squeeze casting of Al-Al macrocomposite bimetals without resort to any prior cost and time intensive chemical or coating treatments of the solid insert. 展开更多
关键词 Al/Al-4.5wt.%Cu macrocomposite bimetal interfacial bonding surface machining pattern microstructure mechanical properties simulation
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室温累积叠轧Mg/Al多层复合板材的界面表征 被引量:8
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作者 常海 郑明毅 +1 位作者 Heinz Guenter Brokmeier 甘为民 《金属学报》 SCIE EI CAS CSCD 北大核心 2017年第2期220-226,共7页
通过室温累积叠轧技术制备了Mg/Al多层复合板材,借助SEM、EDS、TEM和同步辐射CT形貌观察等先进表征手段对累积叠轧Mg/Al金属复合板材界面结合进行表征,揭示累积叠轧Mg/Al金属复合板材界面宏观结合状态以及微观界面结构。结果表明,Mg/Al... 通过室温累积叠轧技术制备了Mg/Al多层复合板材,借助SEM、EDS、TEM和同步辐射CT形貌观察等先进表征手段对累积叠轧Mg/Al金属复合板材界面结合进行表征,揭示累积叠轧Mg/Al金属复合板材界面宏观结合状态以及微观界面结构。结果表明,Mg/Al复合板材界面总体上结合良好,没有明显孔洞和开裂,但板材内部仍然存在一些孔洞和局部微小裂纹。3次循环后Mg/Al界面处形成了厚度为150 nm的Mg_(17)Al_(12)层。Mg和Mg_(17)Al_(12)之间存在一种确定的晶体学位相关系[111]Mg_(17)Al_(12)//[1210]Mg、(110)Mg_(17)Al_(12)//(1011)Mg,而Mg_(17)Al_(12)和Al之间是否有位相关系并不明显。 展开更多
关键词 累积叠轧 Mg/Al多层复合板材 界面宏观结合 界面结构 位相关系
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