The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(...The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.展开更多
The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that t...The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that the interface between the solid Fe and Al formed by heat-treatment consisted of Fe2Al5 and FeAl3 intermetallic compound layers, which deteriorated the interfacial bonding strength. Fractures occurred in the intermetallic compound layer during the shear testing. The location of the fracture depended on the defects of microcracks or voids in the intermetallic compound layers. The microcracks in the intermetallic compound layer were caused by the mismatch of thermal expansion coefficients of materials during cooling, and the voids were consistent with the Kirkendall effect. The work will lay an important foundation for welding and joining of aluminum and steel, especially for fabrication of Al-Fe clad materials.展开更多
The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic co...The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.展开更多
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu...A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.展开更多
Material flow and phase transformation were studied at the interface of dissimilar joint between Al 6013 and Mg, produced by stir friction welding （FSW） experiments. Defect-free weld was obtained when aluminum and m...Material flow and phase transformation were studied at the interface of dissimilar joint between Al 6013 and Mg, produced by stir friction welding （FSW） experiments. Defect-free weld was obtained when aluminum and magnesium were placed in the advancing side and retreating side respectively and the tool was placed 1 mm off the weld centerline into the aluminum side. In order to understand the material flow during FSW, steel shots were implanted as indexes into the welding path. After welding, using X-ray images, secondary positions of the steel shots were evaluated. It was revealed that steel shots implanted in advancing side were penetrated from the advancing side into the retreating side, whereas the shots implanted in the retreating side remained in the retreating side, without penetrating into the advancing side. The welded specimens were also heat treated. The effects of heat treatment on the mechanical properties of the welds and the formation of new intermetallic layers were investigated. Two intermetallic compounds, Al3Mg2 and Al12Mg17, were formed sequentially at Al6013/Mg interface.展开更多
The microstructures of the brazed joints for commercially pure Ti and stainless steel were investigated by the applications of various filler alloys including Ag-, Ti-, Zr- and Ni-based alloys. Generally, the dissimil...The microstructures of the brazed joints for commercially pure Ti and stainless steel were investigated by the applications of various filler alloys including Ag-, Ti-, Zr- and Ni-based alloys. Generally, the dissimilar joints between Ti and stainless steel were dominated by the Ti-based intermetallic compounds （IMCs）, e.g. （Ti, Zr）2（Fe, Ni）, TiFe, TiCu, and Ti2（Fe, Ni）, due to a significant dissolution of Ti from the base metal. The （Fe-Cr） cr phase was also observed near the stainless steel due to a segregation of Cr into the interface region. This research demonstrates empirically that the brittleness of the Ti and stainless steel joint can not be avoided only by applying single braze alloy or single insert metal, and thus an introduction of additional suitable interlayer between the filler alloy and the base metal is necessary to prevent the brittleness of the joint.展开更多
Al 7075 and Mg AZ31 alloys were joined by diffusion bonding method. Joining process was performed in pressure range of 10-35 MPa at temperatures of 430-450 ℃ for 60 min under a vacuum of 13.3 MPa. The microstructure ...Al 7075 and Mg AZ31 alloys were joined by diffusion bonding method. Joining process was performed in pressure range of 10-35 MPa at temperatures of 430-450 ℃ for 60 min under a vacuum of 13.3 MPa. The microstructure evaluation, phase analysis and distribution of elements at the interface were done using scanning electron microscopy （SEM）, energy-dispersive X-ray spectroscopy （EDS） and X-ray diffraction （XRD）. The pressure of 25 MPa was determined as the optimum pressure in which the minimum amount of plastic deformation takes place at the joint. Different reaction layers containing intermetallic compounds, such as Al12Mg17, Al3Mg2 andα（Al） solid solution, were observed, in interfacial transition zone （ITZ）. Thickness of layers was increased with increasing the operating temperature. According to the results, diffusion of aluminum atoms into magnesium alloy was more and the interface movement towards the Al alloy was observed. The maximum bond strength of 38 MPa was achieved at the temperature of 440 ℃ and pressure of 25 MPa. Fractography studies indicated that the brittle fracture originated from Al3Mg2 phase.展开更多
TIG welding-brazing process with high frequency induction hot wire technology was presented to create joints between 5A06 aluminum alloy and SUS32! stainless steel using ER1100 filler wire with different temperature. ...TIG welding-brazing process with high frequency induction hot wire technology was presented to create joints between 5A06 aluminum alloy and SUS32! stainless steel using ER1100 filler wire with different temperature. The joints were evaluated by mechanical test and microstructural analyses. The welding procedure using hot fiUer wire （400 ℃ ） significantly increases strength stability by 71% and average value of tensile strength by 30. 8 % of the joints, compared with cold wire. The research of microstructures in interfaces and welded seams reveals that using 400 ℃ hot filler wire can decrease the thickness of intermetallic compounds （ IMCs ） from 6 to 3.5 txm approximately, which is the main reason of mechanical property improvement.展开更多
The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indica...The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges.The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.展开更多
文摘The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.
基金Project(2011DFR50630)sponsored by the International S&T Cooperation of China
文摘The growth of intermetallic compounds at the interface between solid Al and Fe and the effects of intermetallic compound layers on the interfacial bonding of clad materials were investigated. The results showed that the interface between the solid Fe and Al formed by heat-treatment consisted of Fe2Al5 and FeAl3 intermetallic compound layers, which deteriorated the interfacial bonding strength. Fractures occurred in the intermetallic compound layer during the shear testing. The location of the fracture depended on the defects of microcracks or voids in the intermetallic compound layers. The microcracks in the intermetallic compound layer were caused by the mismatch of thermal expansion coefficients of materials during cooling, and the voids were consistent with the Kirkendall effect. The work will lay an important foundation for welding and joining of aluminum and steel, especially for fabrication of Al-Fe clad materials.
基金Project (CDJRC10130011) supported by the Fundamental Research Funds for the Central Universities, China
文摘The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.
基金Projects (51274054,51375070,51271042) supported by the National Natural Science Foundation of ChinaProjects (2013M530913) supported by the China Postdoctoral Science Foundation
文摘A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa.
文摘Material flow and phase transformation were studied at the interface of dissimilar joint between Al 6013 and Mg, produced by stir friction welding （FSW） experiments. Defect-free weld was obtained when aluminum and magnesium were placed in the advancing side and retreating side respectively and the tool was placed 1 mm off the weld centerline into the aluminum side. In order to understand the material flow during FSW, steel shots were implanted as indexes into the welding path. After welding, using X-ray images, secondary positions of the steel shots were evaluated. It was revealed that steel shots implanted in advancing side were penetrated from the advancing side into the retreating side, whereas the shots implanted in the retreating side remained in the retreating side, without penetrating into the advancing side. The welded specimens were also heat treated. The effects of heat treatment on the mechanical properties of the welds and the formation of new intermetallic layers were investigated. Two intermetallic compounds, Al3Mg2 and Al12Mg17, were formed sequentially at Al6013/Mg interface.
基金supported by the Korea Atomic Energy Research Institute (KAERI) R&D Program
文摘The microstructures of the brazed joints for commercially pure Ti and stainless steel were investigated by the applications of various filler alloys including Ag-, Ti-, Zr- and Ni-based alloys. Generally, the dissimilar joints between Ti and stainless steel were dominated by the Ti-based intermetallic compounds （IMCs）, e.g. （Ti, Zr）2（Fe, Ni）, TiFe, TiCu, and Ti2（Fe, Ni）, due to a significant dissolution of Ti from the base metal. The （Fe-Cr） cr phase was also observed near the stainless steel due to a segregation of Cr into the interface region. This research demonstrates empirically that the brittleness of the Ti and stainless steel joint can not be avoided only by applying single braze alloy or single insert metal, and thus an introduction of additional suitable interlayer between the filler alloy and the base metal is necessary to prevent the brittleness of the joint.
文摘Al 7075 and Mg AZ31 alloys were joined by diffusion bonding method. Joining process was performed in pressure range of 10-35 MPa at temperatures of 430-450 ℃ for 60 min under a vacuum of 13.3 MPa. The microstructure evaluation, phase analysis and distribution of elements at the interface were done using scanning electron microscopy （SEM）, energy-dispersive X-ray spectroscopy （EDS） and X-ray diffraction （XRD）. The pressure of 25 MPa was determined as the optimum pressure in which the minimum amount of plastic deformation takes place at the joint. Different reaction layers containing intermetallic compounds, such as Al12Mg17, Al3Mg2 andα（Al） solid solution, were observed, in interfacial transition zone （ITZ）. Thickness of layers was increased with increasing the operating temperature. According to the results, diffusion of aluminum atoms into magnesium alloy was more and the interface movement towards the Al alloy was observed. The maximum bond strength of 38 MPa was achieved at the temperature of 440 ℃ and pressure of 25 MPa. Fractography studies indicated that the brittle fracture originated from Al3Mg2 phase.
基金Acknowledgement The authors would like to appreciate the financial support from the National Natural Science Foundation of China （Grant No. 50874033 ）.
文摘TIG welding-brazing process with high frequency induction hot wire technology was presented to create joints between 5A06 aluminum alloy and SUS32! stainless steel using ER1100 filler wire with different temperature. The joints were evaluated by mechanical test and microstructural analyses. The welding procedure using hot fiUer wire （400 ℃ ） significantly increases strength stability by 71% and average value of tensile strength by 30. 8 % of the joints, compared with cold wire. The research of microstructures in interfaces and welded seams reveals that using 400 ℃ hot filler wire can decrease the thickness of intermetallic compounds （ IMCs ） from 6 to 3.5 txm approximately, which is the main reason of mechanical property improvement.
文摘The intermetallic compound (IMC) is hard and brittle,and its forming and growth at soldering joint interface is an important issue in joint reliability.The data obtained by digital optical electronic microscope indicate that the addition of element Co changes the IMC morphology from ball-like and bar-like to distinct and sharp in crest lines and edges.The addition of elements Ni and Co in Sn-3Ag-0.5Cu solder promotes the nucleation and makes the IMC size finer.The electron probe microanalysis (EPMA) determines the chemical compositions and confirms that the IMC is changed into the (Cu,Co,Ni)6Sn5+(Cu,Co,Ni)3Sn4 mixed type from the type of Cu6Sn5 with the elements Ni and Co in the solder.
