Numerous non-cyanide leaching lixiviants have been developed,among which thiosulfate is considered the most promising alternative to cyanide due to its non-toxicity,low price,high leaching rate and excellent character...Numerous non-cyanide leaching lixiviants have been developed,among which thiosulfate is considered the most promising alternative to cyanide due to its non-toxicity,low price,high leaching rate and excellent characteristics in dealing with carbonaceous and copper-bearing gold ores.The traditional copper−ammonia−thiosulfate system has been studied extensively.However,with many years of process development,there are still some problems and challenges with this gold leaching system.A series of studies using nickel-,cobalt-and ferric-based catalyst to substitute copper have been conducted with the purpose of reducing the consumption of thiosulfate.A variety of non-ammonia thiosulfate leaching systems including oxygen−thiosulfate,copper−thiosulfate,copper−EDA−thiosulfate,ferric−EDTA−thiosulfate,and ferric−oxalate−thiosulfate leaching systems have been also developed to eliminate the potential side-effect of ammonia.In this review,the basic theory and process development of some main gold leaching systems based on thiosulfate solutions were systematically summarized to illustrate the research status on thiosulfate leaching process.The potential effects of various additives such as organic ligands containing amino,carboxyl or hydroxy functional groups on gold thiosulfate leaching were described in detail.The potential opportunity and challenge for promoting the industrial development of thiosulfate-based gold leaching systems were also discussed.展开更多
Electrodeposition of acid copper plating on mild steel substrate is tedious due to the galvanic displacement reaction ofcopper on mild steel.This can be avoided by using a proper complexing agent,because the complexin...Electrodeposition of acid copper plating on mild steel substrate is tedious due to the galvanic displacement reaction ofcopper on mild steel.This can be avoided by using a proper complexing agent,because the complexing agent tuned the potential ofnoble direction to less noble direction by complex formation.In this paper,environment friendly electrodeposition of copper fromnon-cyanide electrolyte using sodium gluconate as complexing agent was investigated in alkaline medium.The effects of additivessuch as1,2,3-benzotriazole,sodium lauryl sulphate,PEG8000and saccharin were studied.These additives are found to reduce thegrain size,grain boundaries and improve surface morphology of the copper deposits.Also they improve the throwing power of thedepositing electrolytes and hardness of deposits.The electrodeposited copper coatings were characterized by X-ray diffractiontechnique.XRD results indicate that the electrodeposited copper shows polycrystalline and face centered cubic structure.The crystalsize was calculated by XRD and AFM analysis.Among these additives studied,the mixture of benzotriazole and sodium laurylsulphate acts as the best additive.A uniform pore-free surface observed under SEM and AFM results reveal the grain refining broughtabout by the additives.展开更多
Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition.Theelectrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate,sodiu...Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition.Theelectrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate,sodium acetate and methanesulphonic acid was dealt.Thamine hydrochloride(THC),saccharin and4-amino-3-hydroxynaphthalene1-suphonic acid were used asadditives in depositing electrolytes.The cathode current efficiency was calculated using the Faraday’s law.Metal distrbution ratio ofthe solutions was determined using Haring?Blum cell.These additives impact the surface morphology of deposited copper films bydowngrading,the grain size was analyzed by scanning electron microscopy(SEM)and X-ray diffiraction technique.XRD patternacquired for electrodeposited copper film shows polycrystalline and face centered cubic structure(FCC).The crystal size of thecopper film was calculated using the Debye?Scherrer’s equation.The crystal size revealed that deposits produced from additivecontaining electrolytes exhibited the lowest grain size.Texture coefficient analysis studies revealed that all copper film deposits arepolycrystalline and the crystals are preferentially oriented and parallel to the surface.A uniform and pin-hole free surfacemorphology and grain refining were brought about by the additives.展开更多
The effects of additives on the surface and cross-sectional morphologies of zinc deposits on iron substrate from alkalinezincate solution were characterized by scanning electron microscope(SEM).The cathodic reaction m...The effects of additives on the surface and cross-sectional morphologies of zinc deposits on iron substrate from alkalinezincate solution were characterized by scanning electron microscope(SEM).The cathodic reaction mechanisms under variousconcentrations of additives were investigated using cyclic voltammetry(CV)and electrochemical impedance spectroscopy(EIS)techniques.It is found that with increasing the additive A content in the bath solution,the nucleation overpotential(NOP)value isobviously increased and the inhibition effect is strengthened.This may be mainly due to the adsorption of additive A on the cathodicelectrode surface,which can cover the active sites and block the discharge reduction.The results of EIS analysis indicate that therate-determining step of zinc electrodeposition process is changed from mixed control step into electrochemical reduction step in thepresence of additive A.However,any quantity of additive B has little effect on the NOP value and the inhibition effect is not obvious.Furthermore,addition of additive A and additive B at the same time displays the strongest inhibition effect and shows a strongsynergism because of their co-adsorption on the cathodic electrode surface.展开更多
The stability of ionic liquid additive 1-butyl-3-methylimidazolium hydrogen sulfate ([BMIM]HSO4) during zinc electrowinning from acidic sulfate solution was investigated by cyclic voltammetry, electrochemical impeda...The stability of ionic liquid additive 1-butyl-3-methylimidazolium hydrogen sulfate ([BMIM]HSO4) during zinc electrowinning from acidic sulfate solution was investigated by cyclic voltammetry, electrochemical impedance spectroscopy and scanning electron microscopy. Compared with the traditional industrial additives, gelatine and gum arabic, [BMIM]HSO4 has more excellent chemical and thermal stabilities. The inhibition effects of gelatine and gum arabic on the zinc electrocrystallization are observed to markedly weaken due to their part degradation after 12 h longtime successive electrolysis and high temperature (90 ℃) treatments. In contrast, the activity of [BMIM]HSO4 is practically unaffected after 24 h longtime successive electrolysis and high temperature treatments. These results are corroborated with the corresponding morphological analysis of the cathodic deposits.展开更多
基金financial supports from the Fundamental Research Funds for Central Universities of China (No. N182502044)。
文摘Numerous non-cyanide leaching lixiviants have been developed,among which thiosulfate is considered the most promising alternative to cyanide due to its non-toxicity,low price,high leaching rate and excellent characteristics in dealing with carbonaceous and copper-bearing gold ores.The traditional copper−ammonia−thiosulfate system has been studied extensively.However,with many years of process development,there are still some problems and challenges with this gold leaching system.A series of studies using nickel-,cobalt-and ferric-based catalyst to substitute copper have been conducted with the purpose of reducing the consumption of thiosulfate.A variety of non-ammonia thiosulfate leaching systems including oxygen−thiosulfate,copper−thiosulfate,copper−EDA−thiosulfate,ferric−EDTA−thiosulfate,and ferric−oxalate−thiosulfate leaching systems have been also developed to eliminate the potential side-effect of ammonia.In this review,the basic theory and process development of some main gold leaching systems based on thiosulfate solutions were systematically summarized to illustrate the research status on thiosulfate leaching process.The potential effects of various additives such as organic ligands containing amino,carboxyl or hydroxy functional groups on gold thiosulfate leaching were described in detail.The potential opportunity and challenge for promoting the industrial development of thiosulfate-based gold leaching systems were also discussed.
文摘Electrodeposition of acid copper plating on mild steel substrate is tedious due to the galvanic displacement reaction ofcopper on mild steel.This can be avoided by using a proper complexing agent,because the complexing agent tuned the potential ofnoble direction to less noble direction by complex formation.In this paper,environment friendly electrodeposition of copper fromnon-cyanide electrolyte using sodium gluconate as complexing agent was investigated in alkaline medium.The effects of additivessuch as1,2,3-benzotriazole,sodium lauryl sulphate,PEG8000and saccharin were studied.These additives are found to reduce thegrain size,grain boundaries and improve surface morphology of the copper deposits.Also they improve the throwing power of thedepositing electrolytes and hardness of deposits.The electrodeposited copper coatings were characterized by X-ray diffractiontechnique.XRD results indicate that the electrodeposited copper shows polycrystalline and face centered cubic structure.The crystalsize was calculated by XRD and AFM analysis.Among these additives studied,the mixture of benzotriazole and sodium laurylsulphate acts as the best additive.A uniform pore-free surface observed under SEM and AFM results reveal the grain refining broughtabout by the additives.
文摘Methane sulphonic acid is an alternative electrolyte for conventional sulphuric acid for copper deposition.Theelectrodeposition of copper from eco-friendly acetate-based electrolytes consisting of copper acetate,sodium acetate and methanesulphonic acid was dealt.Thamine hydrochloride(THC),saccharin and4-amino-3-hydroxynaphthalene1-suphonic acid were used asadditives in depositing electrolytes.The cathode current efficiency was calculated using the Faraday’s law.Metal distrbution ratio ofthe solutions was determined using Haring?Blum cell.These additives impact the surface morphology of deposited copper films bydowngrading,the grain size was analyzed by scanning electron microscopy(SEM)and X-ray diffiraction technique.XRD patternacquired for electrodeposited copper film shows polycrystalline and face centered cubic structure(FCC).The crystal size of thecopper film was calculated using the Debye?Scherrer’s equation.The crystal size revealed that deposits produced from additivecontaining electrolytes exhibited the lowest grain size.Texture coefficient analysis studies revealed that all copper film deposits arepolycrystalline and the crystals are preferentially oriented and parallel to the surface.A uniform and pin-hole free surfacemorphology and grain refining were brought about by the additives.
基金Project(2014CB643401)supported by the National Basic Research Program of ChinaProjects(51134007,51404299)supported by the National Natural Science Foundation of China
文摘The effects of additives on the surface and cross-sectional morphologies of zinc deposits on iron substrate from alkalinezincate solution were characterized by scanning electron microscope(SEM).The cathodic reaction mechanisms under variousconcentrations of additives were investigated using cyclic voltammetry(CV)and electrochemical impedance spectroscopy(EIS)techniques.It is found that with increasing the additive A content in the bath solution,the nucleation overpotential(NOP)value isobviously increased and the inhibition effect is strengthened.This may be mainly due to the adsorption of additive A on the cathodicelectrode surface,which can cover the active sites and block the discharge reduction.The results of EIS analysis indicate that therate-determining step of zinc electrodeposition process is changed from mixed control step into electrochemical reduction step in thepresence of additive A.However,any quantity of additive B has little effect on the NOP value and the inhibition effect is not obvious.Furthermore,addition of additive A and additive B at the same time displays the strongest inhibition effect and shows a strongsynergism because of their co-adsorption on the cathodic electrode surface.
基金Project(2011FA009) supported by the Natural Science Foundation of Yunnan Province,ChinaProject(2011FZ020) supported by the Application Foundation Research of Yunnan Province,China
文摘The stability of ionic liquid additive 1-butyl-3-methylimidazolium hydrogen sulfate ([BMIM]HSO4) during zinc electrowinning from acidic sulfate solution was investigated by cyclic voltammetry, electrochemical impedance spectroscopy and scanning electron microscopy. Compared with the traditional industrial additives, gelatine and gum arabic, [BMIM]HSO4 has more excellent chemical and thermal stabilities. The inhibition effects of gelatine and gum arabic on the zinc electrocrystallization are observed to markedly weaken due to their part degradation after 12 h longtime successive electrolysis and high temperature (90 ℃) treatments. In contrast, the activity of [BMIM]HSO4 is practically unaffected after 24 h longtime successive electrolysis and high temperature treatments. These results are corroborated with the corresponding morphological analysis of the cathodic deposits.