当罗恩·约翰逊(R o n Johnson)30年前开始他的零售生涯时,这个后来创立了如今尽人皆知的苹果商店这一零售经验的男人,其实刚进入一个对他来说"完全陌生的领域"。当时的风险投资者关注的还是零售商而不是科技公司。"...当罗恩·约翰逊(R o n Johnson)30年前开始他的零售生涯时,这个后来创立了如今尽人皆知的苹果商店这一零售经验的男人,其实刚进入一个对他来说"完全陌生的领域"。当时的风险投资者关注的还是零售商而不是科技公司。"当时,米拉德·德雷克斯勒(Millard Drexler)刚由百货公司的一个铺位发展为盖普公司(Gap);展开更多
Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor instruments become more sophisticated. Spin coating is...Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor instruments become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped photoresist scarers outward and reattaches on the film surface. A catch cup is set up outside the wafer in spin coating, and scattered photoresist mist is removed from the wafer edge by the exhaust flow generated at the gap between the wafer edge and the catch cup. In the dry process of a spin coating, it is a serious concern that the film thickness increases near the wafer edge in the case of low rotating speed. The purpose of this study is to make clear the effect of the catch cup geometry on the 3D boundary layer flow over the wafer surface and the drying rate of liquid film.展开更多
文摘当罗恩·约翰逊(R o n Johnson)30年前开始他的零售生涯时,这个后来创立了如今尽人皆知的苹果商店这一零售经验的男人,其实刚进入一个对他来说"完全陌生的领域"。当时的风险投资者关注的还是零售商而不是科技公司。"当时,米拉德·德雷克斯勒(Millard Drexler)刚由百货公司的一个铺位发展为盖普公司(Gap);
基金the 21~(st)Century COE program of Pulse Power Science of Kumamoto University
文摘Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor instruments become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped photoresist scarers outward and reattaches on the film surface. A catch cup is set up outside the wafer in spin coating, and scattered photoresist mist is removed from the wafer edge by the exhaust flow generated at the gap between the wafer edge and the catch cup. In the dry process of a spin coating, it is a serious concern that the film thickness increases near the wafer edge in the case of low rotating speed. The purpose of this study is to make clear the effect of the catch cup geometry on the 3D boundary layer flow over the wafer surface and the drying rate of liquid film.
