A novel into-plane rotating rnicromirror actuated by a hybrid electrostatic driving structure is presented. The hybrid driving structure is made up of a planar plate drive and a vertical comb drive. The device is fabr...A novel into-plane rotating rnicromirror actuated by a hybrid electrostatic driving structure is presented. The hybrid driving structure is made up of a planar plate drive and a vertical comb drive. The device is fabricated in SOI substrate by using a bulk-and-surface mixed silicon micromachining process. As demonstrated by experiment, the novel driving structure can actuate the mirror to achieve large-range continuous rotation as well as spontaneous 90°rotation induced by the pull-in effect. The continuous rotating range of the micromirror is increased to about 46° at an increased yielding voltage. The measured yielding voltages of the mirrors with torsional springs of 1 and 0.5μm in thickness are 390 - 410V and 140 - 160V, respectively. The optical insertion loss has also been measured to be --1.98dB when the mirror serves as an optical switch.展开更多
An integrated micro positioning xy-stage with a 2mm × 2mm-area shuttle is fabricated for application in nano- meter-scale operation and nanometric positioning precision. It is mainly composed of a silicon-based x...An integrated micro positioning xy-stage with a 2mm × 2mm-area shuttle is fabricated for application in nano- meter-scale operation and nanometric positioning precision. It is mainly composed of a silicon-based xy-stage,electrostatics comb actuator,and a displacement sensor based on a vertical sidewall surface piezoresistor. They are all in a monolithic chip and developed using double-sided bulk-micromachining technology. The high-aspect-ratio comb-driven xy-stage is achieved by deep reactive ion etching （DRIE） in both sides of the wafer. The detecting piezoresistor is located at the vertical sidewall surface of the detecting beam to improve the sensitivity and displacement resolution of the piezoresistive sensors using the DRIE technology combined with the ion implantation technology. The experimental results verify the integrated micro positioning xy-stage design including the micro xy-stage, electrostatics comb actuator,and the vertical sidewall surface piezoresistor technique. The sensitivity of the fabricated piezoresistive sensors is better than 1.17mV/μm without amplification and the linearity is better than 0. 814%. Under 30V driving voltage, a ± 10vm single-axis displacement is measured without crosstalk and the resonant frequency is measured at 983Hz in air.展开更多
文摘A novel into-plane rotating rnicromirror actuated by a hybrid electrostatic driving structure is presented. The hybrid driving structure is made up of a planar plate drive and a vertical comb drive. The device is fabricated in SOI substrate by using a bulk-and-surface mixed silicon micromachining process. As demonstrated by experiment, the novel driving structure can actuate the mirror to achieve large-range continuous rotation as well as spontaneous 90°rotation induced by the pull-in effect. The continuous rotating range of the micromirror is increased to about 46° at an increased yielding voltage. The measured yielding voltages of the mirrors with torsional springs of 1 and 0.5μm in thickness are 390 - 410V and 140 - 160V, respectively. The optical insertion loss has also been measured to be --1.98dB when the mirror serves as an optical switch.
文摘An integrated micro positioning xy-stage with a 2mm × 2mm-area shuttle is fabricated for application in nano- meter-scale operation and nanometric positioning precision. It is mainly composed of a silicon-based xy-stage,electrostatics comb actuator,and a displacement sensor based on a vertical sidewall surface piezoresistor. They are all in a monolithic chip and developed using double-sided bulk-micromachining technology. The high-aspect-ratio comb-driven xy-stage is achieved by deep reactive ion etching （DRIE） in both sides of the wafer. The detecting piezoresistor is located at the vertical sidewall surface of the detecting beam to improve the sensitivity and displacement resolution of the piezoresistive sensors using the DRIE technology combined with the ion implantation technology. The experimental results verify the integrated micro positioning xy-stage design including the micro xy-stage, electrostatics comb actuator,and the vertical sidewall surface piezoresistor technique. The sensitivity of the fabricated piezoresistive sensors is better than 1.17mV/μm without amplification and the linearity is better than 0. 814%. Under 30V driving voltage, a ± 10vm single-axis displacement is measured without crosstalk and the resonant frequency is measured at 983Hz in air.
