相变温控应用于电子设备的抗热冲击性能研究

相变温控是利用相变材料的相变过程以实现对物体温度控制的方法。以高热导率和储热密度的膨胀石墨/石蜡复合材料制作储热材料器件,构建了基于相变温控的电子器件散热模拟实验系统。研究在3种波动热负荷条件下,模拟芯片的表面温度随时间的变化情况,并与同型号传统散热器比较,分析相变温控对电子器件瞬态热管理的影响规律。实验结果表明,在同等条件下,相变温控散热实验系统的抗热冲击性能约为传统散热系统的1.4倍。将复合相变材料应用于电子器件的瞬态热管理中,可以降低电子设备的表面温度、减小温度波动幅度,保证电子电器设备运行的可靠性和稳定性。

Transient Thermal Management Comparison of a Microprocessor Using PCMs in Various Configurations

There has been a strong interest in the use of Phase Change Materials (PCMs) for the transient thermal abatement of high powered microprocessor.This paper presents a set of transient computational analysis for selected IC packages with the purpose of calibrating the merits of PCM in different configurations.The transient analysis of high powered microprocessors with heat sinks was performed as a benchmark for comparison with the same microprocessors fitted with PCM in the following configurations:a) PCM imbedded into the finned region of the heat sink,b) PCM mounted between the microprocessor and heat sink,c) sealed PCM underfill to the microprocessor and d) PCM fitted to the underside of the printed circuit board directly beneath the microprocessor.The analysis was performed using a commercial CFD tool together with an approximation to the phase change mechanism using the slope method.Results indicate the merit of each configuration.