随着星载嵌入式计算机向高性能、高集成、小型化方向发展,系统内热流密度急剧增加,常规星上散热设计已无法满足系统对高效散热的迫切需求。文中以某星上数据处理机热设计需求为例,提出了以石墨散热片为主的全路径高效热传导方法,并开展...随着星载嵌入式计算机向高性能、高集成、小型化方向发展,系统内热流密度急剧增加,常规星上散热设计已无法满足系统对高效散热的迫切需求。文中以某星上数据处理机热设计需求为例,提出了以石墨散热片为主的全路径高效热传导方法,并开展了整机热仿真分析和试验测试。仿真分析和试验结果均表明热设计满足要求。为进一步验证石墨散热片对导热性能的提升程度,对粘贴石墨散热片和采用常规金属两种散热方法进行了模拟仿真和对比。结果表明,与采用常规金属散热相比,在热源集中的计算模块框架上贴石墨散热片,可使数字信号处理(Digital Signal Processor, DSP)芯片的节温低4℃左右。该结论可为后续以传导为主的星上高性能计算机热设计提供参考。展开更多
The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly ther...The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly thermal conductive h-BN and graphite gives rise to large increase (about 2 times) of thermal conductivity of individual polymer. In PPS/graphite system, the higher conductivity value was obtained when smaller graphites were added. Meanwhile, the tensile and flexural strength are reduced upon increasing filler loading.展开更多
文摘随着星载嵌入式计算机向高性能、高集成、小型化方向发展,系统内热流密度急剧增加,常规星上散热设计已无法满足系统对高效散热的迫切需求。文中以某星上数据处理机热设计需求为例,提出了以石墨散热片为主的全路径高效热传导方法,并开展了整机热仿真分析和试验测试。仿真分析和试验结果均表明热设计满足要求。为进一步验证石墨散热片对导热性能的提升程度,对粘贴石墨散热片和采用常规金属两种散热方法进行了模拟仿真和对比。结果表明,与采用常规金属散热相比,在热源集中的计算模块框架上贴石墨散热片,可使数字信号处理(Digital Signal Processor, DSP)芯片的节温低4℃左右。该结论可为后续以传导为主的星上高性能计算机热设计提供参考。
文摘The thermal and mechanical properties of the polyamide 6/boron nitride and polyphenylene sulfide/graphite composites have been investigated as a function of composition and size of fillers. The addition of highly thermal conductive h-BN and graphite gives rise to large increase (about 2 times) of thermal conductivity of individual polymer. In PPS/graphite system, the higher conductivity value was obtained when smaller graphites were added. Meanwhile, the tensile and flexural strength are reduced upon increasing filler loading.