In order to improve the brittleness of high-strength cement mortar,calcium carbonate(CaCO3) whiskers are incorporated to strengthen and toughen the high-strength cement mortar.The compressive strength,flexural stren...In order to improve the brittleness of high-strength cement mortar,calcium carbonate(CaCO3) whiskers are incorporated to strengthen and toughen the high-strength cement mortar.The compressive strength,flexural strength,split tensile strength and work of fracture are measured.Microstructures and micromechanical behaviors are investigated using scanning electron microscopy.The strengthening and toughening mechanisms and the efficiency of whisker-reinforced high-strength cement mortar are discussed.The results show that the addition of CaCO3 whiskers brings positive effects on the high-strength cement mortar.The strengthening and toughening mechanisms are whisker-cement coalition debonding,whisker peeling,whisker impact breakage and whisker bridging.Crack deflection is one efficient mechanism,but it is hard to be achieved in high-strength cement mortar.And the interfacial bonding strength between whiskers and the cement mortar matrix should be appropriately weak to introduce more crack deflection mechanisms to strengthen and toughen the cement mortar efficiently.展开更多
Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results ...Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.展开更多
The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wh...The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.展开更多
基金The National Natural Science Foundation of China (No.51102035)
文摘In order to improve the brittleness of high-strength cement mortar,calcium carbonate(CaCO3) whiskers are incorporated to strengthen and toughen the high-strength cement mortar.The compressive strength,flexural strength,split tensile strength and work of fracture are measured.Microstructures and micromechanical behaviors are investigated using scanning electron microscopy.The strengthening and toughening mechanisms and the efficiency of whisker-reinforced high-strength cement mortar are discussed.The results show that the addition of CaCO3 whiskers brings positive effects on the high-strength cement mortar.The strengthening and toughening mechanisms are whisker-cement coalition debonding,whisker peeling,whisker impact breakage and whisker bridging.Crack deflection is one efficient mechanism,but it is hard to be achieved in high-strength cement mortar.And the interfacial bonding strength between whiskers and the cement mortar matrix should be appropriately weak to introduce more crack deflection mechanisms to strengthen and toughen the cement mortar efficiently.
基金Project (50975040) supported by the National Natural Science Foundation of China
文摘Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.
基金Supported by the Open L ab.Foundation of Educational Ministryof China
文摘The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.