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混合电压I/O电路的ESD保护结构研究
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作者 岳震 谢俊玲 徐玲 《微处理机》 2002年第1期19-22,共4页
给出了混合电压 I/O电路坚固的 ESD保护结构,它是由放大器结构的 NMOS晶体管组合而成。这个保护电路由硅化物和硅化物隔离两种工艺研制而成。为了确保硅化物器件指状触发的一致性,增加了栅电压调节电路,研究电路的设计规... 给出了混合电压 I/O电路坚固的 ESD保护结构,它是由放大器结构的 NMOS晶体管组合而成。这个保护电路由硅化物和硅化物隔离两种工艺研制而成。为了确保硅化物器件指状触发的一致性,增加了栅电压调节电路,研究电路的设计规则以避免产生寄生的击穿路径。 展开更多
关键词 静电放电 混合电压I/O电路 硅化物工艺 ESD保护结构 集成电路
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Preparation of pure SbCl_3 from lead anode slime bearing high antimony and low silver 被引量:7
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作者 曹华珍 陈进中 +1 位作者 袁海军 郑国渠 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2010年第12期2397-2403,共7页
A novel treatment process of lead anode slime bearing high antimony and low silver was developed by a potential-controlled chloridization leaching and continuous distillation.The experimental results show a high Sb 3+... A novel treatment process of lead anode slime bearing high antimony and low silver was developed by a potential-controlled chloridization leaching and continuous distillation.The experimental results show a high Sb 3+ concentration,489.2 g/L,in the leaching solution for two-stage countercurrent leaching process,and the leaching rates of Sb,Cu,Bi more than 99% when the potential is controlled at 450 mV.When the leaching solution is distillated and concentrated at 120°C,almost all the silicon compound is evaporated into the concentration distillate and exists as amorphous hydrated silica.By the continuous distillation,high pure SbCl3 could be prepared,and AsCl3 is enriched in the distillate while metals Bi,Cu are enriched in the continuous distillation residue.As a result,the recovery rate of Sb is more than 95%. 展开更多
关键词 lead anode slime potential-controlled chloridization leaching continuous distillation antimony trichloride
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热处理与表面处理工艺
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《电子科技文摘》 2000年第12期41-43,共3页
Y2000-62135-152 0020165高纵横比175nm 技术用低再沉淀速率高密度等离子体 CVD 工艺=A low redeposition rate high density plas-ma CVD process for high aspect ratio 175nm technologyand beyond[会,英]/Lee,G.Y.& Ivers,T.H./... Y2000-62135-152 0020165高纵横比175nm 技术用低再沉淀速率高密度等离子体 CVD 工艺=A low redeposition rate high density plas-ma CVD process for high aspect ratio 175nm technologyand beyond[会,英]/Lee,G.Y.& Ivers,T.H.//1999 IEEE Proceedizips of International InterconnectTechnology Conference.-152~154(EC) 展开更多
关键词 表面处理工艺 后热处理 高密度等离子体 沉淀速率 高纵横比 技术研究 涂层 硅化物工艺 等离子体化学气相沉积 真空科学
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