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Microstructure and electric properties of Si_p/Al composites for electronic packaging applications
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作者 修子扬 武高辉 +2 位作者 张强 宋美慧 田首夫 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期1034-1038,共5页
Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,p... Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,particle volume fraction,particle size,matrix alloy and heat treatment on the electrical properties of composites were discussed,and the electrical conductivity was calculated by theoretical models. It is shown that the Si/Al interfaces are clean and do not have interface reaction products. For the same matrix alloy,the electrical conductivity of composites decreases with increasing the reinforcement volume fraction. As for the same particle content,the electrical conductivity of composites decreases with increasing the alloying element content of matrix. Particle size has little effects on the electrical conductivity. Electrical conductivity of composites increases slightly after annealing treatment. The electrical conductivity of composites calculated by P.G model is consistent with the experimental results. 展开更多
关键词 电子封装 硅铝复合物 微观结构 导电性
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