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SiGe合金氧化层中的纳米结构 被引量:1
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作者 黄伟其 蔡绍洪 +1 位作者 龙超云 刘世荣 《贵州大学学报(自然科学版)》 2002年第3期202-207,共6页
在硅锗合金衬底上采用氧化等制膜方式生成零维和二维的纳米结构样品 ,用高精度椭偏仪 (HPE)、卢瑟福背散射谱仪 (RBS)和高分辨率扫描透射电子显微镜 (HR -STEM)测量样品的纳米结构 ,并采用美国威思康新州立大学开发的Rump模拟软件对卢... 在硅锗合金衬底上采用氧化等制膜方式生成零维和二维的纳米结构样品 ,用高精度椭偏仪 (HPE)、卢瑟福背散射谱仪 (RBS)和高分辨率扫描透射电子显微镜 (HR -STEM)测量样品的纳米结构 ,并采用美国威思康新州立大学开发的Rump模拟软件对卢瑟福背散射谱 (RBS)中的CHANNEL谱和RANDOM谱分别进行精细结构模拟 ,测量并计算出纳米氧化层与锗的纳米薄膜结构分布 ,并且反馈控制加工过程 ,优化硅锗半导体材料纳米结构样品的加工条件 .在硅锗合金的氧化层表面中首次发现纳米锗量子点组成的纳米盖帽薄膜 ( 2nm) 。 展开更多
关键词 SiGe合金氧化层 纳米结构 纳米团簇 纳米层 合金薄膜 光电特性 硅锗半导体材料
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Comparison of Ge_xSi_(1- x) Grown by UHV/CVD from Si_2H_6/GeH_4 and SiH_4/GeH_4 被引量:1
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作者 LI Dai-zong, YU Zhuo, CHEN Bu-wen, HUANG Chang-jun, LEI Zhen-lin, YU Jin-zhong, WANG Qi-ming (State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083,CHN) 《Semiconductor Photonics and Technology》 CAS 1999年第3期134-138,共5页
Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-fa... Using double crystal X-rays diffraction (DCXRD) and atomic force microscopy (AFM), the results of Ge x Si 1- x grown by UHV/CVD from Si 2H 6 and SiH 4 are analyzed and compared. Adsorbates can migrate to the energy-favoring position due to the slow growth rate from SiH 4. In this case, a Si buffer that isolates the effect of substrate on epilayer could not be grown, which results in a pit penetrating into epilayer and buffer. The FWHM is 0.055° in DCXRD from SiH 4. The presence of diffraction fringes is an indication of an excellent crystalline quality. The roughness of the surface is improved if grown by Si 2H 6; however, the crystal quality of the Ge x Si 1- x material became worse than that from SiH 4 due to much larger growth rate from Si 2H 6. The content of Ge is obtained from DCXRD, which indicates the growth rate from Si 2H 6 is largest, then GeH 4, and that from SiH 4 is least. 展开更多
关键词 Semiconductor Materials GESI UHV/CVD CLC number:TN304.054 Document code:A
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