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Si-Ge异质结基区混合模式晶体管的提出和模拟
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作者 郭维廉 毛陆虹 +3 位作者 李树荣 郑云光 王静 吴霞宛 《固体电子学研究与进展》 CAS CSCD 北大核心 2001年第3期306-312,共7页
在常规混合模式晶体管的基础上提出一种新结构的器件—— Si- Ge异质结基区混合模式晶体管。由于基区采用禁带宽度较窄的 Si- Ge合金材料 ,引起空穴向发射区反注入势垒的提高 ,使 IB空穴电流减小 ,从而提高了注入效率 ;迁移率增高 ,从... 在常规混合模式晶体管的基础上提出一种新结构的器件—— Si- Ge异质结基区混合模式晶体管。由于基区采用禁带宽度较窄的 Si- Ge合金材料 ,引起空穴向发射区反注入势垒的提高 ,使 IB空穴电流减小 ,从而提高了注入效率 ;迁移率增高 ,从而提高特征频率。因而这种器件具有 β高、基区电阻低、基区渡越时间短等优点。通过器件模拟证实了该器件具有输出电流大、低温放大倍数极高、常温放大倍数较高、特征频率高等优点 ,是下一代 展开更多
关键词 基区 混合模式晶体管 硅-锗异质结 器件模拟
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Analysis, Design and Implementation of SiGe Wideband Dual-Feedback Low Noise Amplifier
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作者 张为 宋博 +5 位作者 付军 王玉东 崔杰 李高庆 张伟 刘志宏 《Transactions of Tianjin University》 EI CAS 2014年第4期299-309,共11页
A wideband dual-feedback low noise amplifier (LNA) was analyzed, designed and implemented using SiGe heterojunction bipolar transistor (HBT) technology. The design analysis in terms of gain, input and output match... A wideband dual-feedback low noise amplifier (LNA) was analyzed, designed and implemented using SiGe heterojunction bipolar transistor (HBT) technology. The design analysis in terms of gain, input and output matching, noise and poles for the amplifier was presented in detail. The area of the complete chip die, including bonding pads and seal ring, was 655 μm × 495 μm. The on-wafer measurements on the fabricated wideband LNA sample demonstrated good performance: a small-signal power gain of 33 dB with 3-dB bandwidth at 3.3 GHz was achieved; the input and output return losses were better than - 10 dB from 100 MHz to 4 GHz and to 6 GHz, respectively; the noise figure was lower than 4.25 dB from 100 MHz to 6 GHz; with a 5 V supply, the values of OPtdB and OIP3 were 1.7 dBm and 11 dBm at 3-dB bandwidth, respectively. 展开更多
关键词 WIDEBAND dual-feedback low noise amplifier (LNA) SiGe heterojunction bipolar transistor
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Polysilicon Emitter Double Mesa Microwave P ower SiGe HBT 被引量:3
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作者 刘志农 熊小义 +8 位作者 黄文韬 李高庆 张伟 许军 刘志弘 林惠旺 许平 陈培毅 钱佩信 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2003年第9期897-902,共6页
A new 125mm UHV/CVD SiGe/Si epitaxy equipment SGE500 capable of commercialization is constructed and device-level SiGe HBT material is grown.A polysilicon emitter (PolyE) double mesa microwave power SiGe HBT showing e... A new 125mm UHV/CVD SiGe/Si epitaxy equipment SGE500 capable of commercialization is constructed and device-level SiGe HBT material is grown.A polysilicon emitter (PolyE) double mesa microwave power SiGe HBT showing excellent low current DC characteristics with β=60@V CE/I C=9.0V/300μA,β=100@5V/50mA,BV CBO=22V,f t/f max=5.4GHz/7.7GHz@3V/10mA is demonstrated.The PolyE SiGe HBT needs only 6 lithographical steps and cancels the growth of the thick emitter epitaxy layer,both of which show great potential for volume production.A 60-finger class-A SiGe linear power amplifer (PA) w ith 22dBm of 1dB compress point output power (P 1dB),11dB of power gain (G p) and 26.1% of power added efficiency (PAE) @900MHz,3.5V/0.2A is demonstrated.Another 120-finger class-A SiGe PA with 33.3dBm (2.1W) of P out,10.3dB of G p and 33.9% of PAE @900MHz,11V/0.52A is also demonstrated. 展开更多
关键词 SIGE HBT microwave power amplifer
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SiGe HBT Class AB Power Amplifier for Wireless Communications 被引量:1
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作者 贾宏勇 刘志农 +1 位作者 李高庆 钱佩信 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第9期921-924,共4页
Good performance SiGe power amplifiers applicable to wireless communications are demonstrated.The output power can reach more than 30dBm in class B mode.And in class AB mode,the output power at 1dB compression point (... Good performance SiGe power amplifiers applicable to wireless communications are demonstrated.The output power can reach more than 30dBm in class B mode.And in class AB mode,the output power at 1dB compression point ( P 1dB ) is 24dBm,the output third order intercept (TOI) power is 39dBm under V cc of 4V.The highest power added efficiency (PAE) and PAE at 1dB compression point are 34% and 25%,respectively.The adjacent channel power rejection for CDMA signal is more than 42dBc,which complies with IS95 specification. 展开更多
关键词 SIGE HBT microwave power amplifier
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Low Voltage Class C SiGe Microwave Power HBTs
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作者 贾宏勇 陈培毅 +4 位作者 钱佩信 潘宏菽 黄杰 杨增敏 李明月 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第9期1188-1190,共3页
The structure and microwave characteristics of low-voltage SiGe power HBTs are given.With this structure,the device can operate in a low-voltage and high-current state.By using an interdigital emitter strip layout and... The structure and microwave characteristics of low-voltage SiGe power HBTs are given.With this structure,the device can operate in a low-voltage and high-current state.By using an interdigital emitter strip layout and the operating voltage ranging from 3 to 4V,the output power in Class C operation can reach 1 65W at 1GHz,with the gain of 8dB.The highest collector efficiency is 67 8% under 3V. 展开更多
关键词 SIGE HBT microwave power transistor
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