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二元羧酸半酯与环氧化合物反应动力学研究 被引量:4
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作者 曾兆华 杨建文 +1 位作者 覃海定 陈用烈 《高等学校化学学报》 SCIE EI CAS CSCD 北大核心 2002年第1期164-166,共3页
The kinetic behavior of reaction of dibasic acid half ester with epoxy compound, which is one of the key reaction occurring in the technology of liquid alkali developing type solder resists, was investigated in this p... The kinetic behavior of reaction of dibasic acid half ester with epoxy compound, which is one of the key reaction occurring in the technology of liquid alkali developing type solder resists, was investigated in this paper, by using the monomethyl esters of maleic acid, succinic acid, phthalic acid, cis 1,2,3,6 tetrahydrophthalic acid and cis hexahydrophthalic acid as model compounds. It was found that for the reaction catalyzed by tetramethyl ammonium bromide(TMAB), the reaction order for dibasic acid half ester and for PGE is 0 5 and 1 respectively when the dibasic acid monomethyl esters with a smaller size and/or with a stronger acitity were used, while it is 0 and 1 respectively when the dibasic acid monomethyl esters with a larger size and a weeker acitity were used. The reaction mechanism has also been discussed, from which a rate equation has been obtained which is in agreement with the experiment results. 展开更多
关键词 二元酸单甲酯 环氧化合物 动力学 反应机理 印制电路板 碱液显影型阻焊油墨
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