离子束诱导转型成结技术是一种可以获得高质量p-n结的新型成结方法,它克服了传统碲镉汞(MCT)离子注入成结工艺中钝化层有损伤的弊病,且工艺相对简单,有希望成为碲镉汞红外焦平面器件的新一代成结技术。本文介绍了以环孔工艺和氢化技术...离子束诱导转型成结技术是一种可以获得高质量p-n结的新型成结方法,它克服了传统碲镉汞(MCT)离子注入成结工艺中钝化层有损伤的弊病,且工艺相对简单,有希望成为碲镉汞红外焦平面器件的新一代成结技术。本文介绍了以环孔工艺和氢化技术为代表的常规离子束刻蚀(Ion Beam Milling)及以H_2/CH_4为代表的反应离子束刻蚀(Reactive Ion Etching)两大类离子束诱导转型(Plasma induced type conversion)成结技术的基本原理、特点及其工艺过程。并以反应离子束刻蚀(RIE)为例,列举了现有报道的典型器件性能。同时还把离子束诱导与离子注入工艺在各方面作了比较。展开更多
Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and th...Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and the deviation in cutoff wavelength is within 0. 1μm at 80K. A variety of surface defects are observed and the formation mechanism is discussed. The average density of surface defects in 75mm HgCdTe epiluyers is found to be less than 300cm^-2. It is found that the surface sticking coefficient of As during HgCdTe growth is very low and is sensitive to growth temperature, being only -1 × 10^-4 at 170℃. The activation energy of As in HgCdTe was determined to be 19.5meV,which decreases as （Na - Nd）^1/3 with a slope of 3.1 × 10^-5 meV · cm. The diffusion coefficients of As in HgCdTe of 1.0 ± 0,9 × 10^-16,8 ± 3 × 10^- is, and 1.5 ± 0.9 × 10^-13 cm^2/s are obtained at temperatures of 240,380, and 440℃, respectively under Hg-saturated pressure. The MBE-grown HgCdTe is incorporated into FPA fabrications,and the preliminary results are presented.展开更多
文摘离子束诱导转型成结技术是一种可以获得高质量p-n结的新型成结方法,它克服了传统碲镉汞(MCT)离子注入成结工艺中钝化层有损伤的弊病,且工艺相对简单,有希望成为碲镉汞红外焦平面器件的新一代成结技术。本文介绍了以环孔工艺和氢化技术为代表的常规离子束刻蚀(Ion Beam Milling)及以H_2/CH_4为代表的反应离子束刻蚀(Reactive Ion Etching)两大类离子束诱导转型(Plasma induced type conversion)成结技术的基本原理、特点及其工艺过程。并以反应离子束刻蚀(RIE)为例,列举了现有报道的典型器件性能。同时还把离子束诱导与离子注入工艺在各方面作了比较。
文摘Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and the deviation in cutoff wavelength is within 0. 1μm at 80K. A variety of surface defects are observed and the formation mechanism is discussed. The average density of surface defects in 75mm HgCdTe epiluyers is found to be less than 300cm^-2. It is found that the surface sticking coefficient of As during HgCdTe growth is very low and is sensitive to growth temperature, being only -1 × 10^-4 at 170℃. The activation energy of As in HgCdTe was determined to be 19.5meV,which decreases as （Na - Nd）^1/3 with a slope of 3.1 × 10^-5 meV · cm. The diffusion coefficients of As in HgCdTe of 1.0 ± 0,9 × 10^-16,8 ± 3 × 10^- is, and 1.5 ± 0.9 × 10^-13 cm^2/s are obtained at temperatures of 240,380, and 440℃, respectively under Hg-saturated pressure. The MBE-grown HgCdTe is incorporated into FPA fabrications,and the preliminary results are presented.
