Developing lightweight and flexible thin films for electromagnetic interference(EMI)shielding is of great importance.Porous thin films of reduced graphene oxide containing SiC whiskers(SiC@RGO)for EMI shielding were p...Developing lightweight and flexible thin films for electromagnetic interference(EMI)shielding is of great importance.Porous thin films of reduced graphene oxide containing SiC whiskers(SiC@RGO)for EMI shielding were prepared by a two-step reduction of graphene oxide(GO),in which the two steps were chemical reduction by HI and the solid phase microwave irradiation.A significant increase of the film thickness from around 20 to 200μm was achieved due to the formation of a porous structure by gases released during the 3 s of solid phase microwave irradiation.The total shielding effectiveness(SET)and the reflective SE(SE_(R))of the SiC@RGO porous thin films depended on the GO/SiC mass ratio.The highest SET achieved was 35.6 dB while the SE_(R) was only 2.8 dB,when the GO/SiC mass ratio was 4∶1.The addition of SiC whiskers was critical for the multi-reflection,interfacial po-larization and dielectric attenuation of EM waves.A multilayer film with a gradient change of SE values was constructed using SiC@RGO porous films and multi-walled carbon nanotubes buckypapers.The highest SET of the multilayer films reached 75.1 dB with a SE_(R) of 2.7 dB for a film thickness of about 1.5 mm.These porous SiC@RGO thin films should find use in multilayer or sand-wich structures for EMI absorption in packaging or lining.展开更多
Photoconductive semiconductor switch(PCSS)can be applied in pulsed high power systems and microwave techniques.However,reducing the damage and increasing the lifetime of silicon carbide(SiC)PCSS are still faced severe...Photoconductive semiconductor switch(PCSS)can be applied in pulsed high power systems and microwave techniques.However,reducing the damage and increasing the lifetime of silicon carbide(SiC)PCSS are still faced severe challenges.In this study,PCSSs with various structures were prepared on 4-inch diameter,500μm thick high-purity semi-insulating 4H-SiC substrates and their on-state resistance and damage mechanisms were investigated.It was found that the PCSS of an Au/TiW/Ni electrode system annealed at 950℃had a minimum on-state resistance of 6.0Ωat 1 kV bias voltage with a 532 nm and 170 mJ pulsed laser by backside illumination single trigger.The backside illumination single trigger could reduce on-state resistance and alleviate the damage of PCSS compared to the frontside trigger when the diameter of the laser spot was larger than the channel length of PCSS.For the 200 s trigger test by a 10 Hz laser,the black branch-like ablation on Au/TiW/Ni PCSS was mainly caused by thermal stress owing to hot carriers.Replacing metal Ni with boron gallium co-doped zinc oxide(BGZO)thin films annealed at 400℃,black branch-like ablation was alleviated while concentric arc damage was obvious at the anode.The major causes of concentric arc are both pulsed laser diffraction and thermal effect.展开更多
During the operation of electronic devices,a considerable amount of heat and electromagnetic radiation is emitted.Therefore,the investigation of materials with electromagnetic shielding and thermal management abilitie...During the operation of electronic devices,a considerable amount of heat and electromagnetic radiation is emitted.Therefore,the investigation of materials with electromagnetic shielding and thermal management abilities has significant importance.Hybrid materials of three-dimensional graphene networks containing both carbon nanotubes(CNTs)and SiC whiskers(3D graphene-CNT-SiC)were synthesized.Using an aqueous-phase reduction method for the self-assembly of the graphene oxide,a three-dimen-sional porous graphene structure was fabricated.SiC whiskers,inserted between the graphene layers,formed a framework for longit-udinal thermal conduction,while CNTs attached to the SiC surface,created a dendritic structure that increased the bonding between the SiC whiskers and graphene,improving dielectric loss and thermal conductivity.It was found that the thermal conductivity of the hybrid material reached 123 W·m^(-1)·K^(-1),with a shielding effectiveness of 29.3 dB when the SiC addition was 2%.This result indic-ates that 3D graphene-CNT-SiC has excellent thermal conductivity and electromagnetic shielding performance.展开更多
A SiC MESFET structure is successfully prepared on a semi-insulated 50mm SiC substrate using a hotwall SiC reactor. The doping concentration for the channel layer is about 1.7 × 10^17 cm^-3 , and the thickness is...A SiC MESFET structure is successfully prepared on a semi-insulated 50mm SiC substrate using a hotwall SiC reactor. The doping concentration for the channel layer is about 1.7 × 10^17 cm^-3 , and the thickness is about 0.35μm. An unintentionally n-doped buffer layer is employed between the substrate and the channel layer. A cap layer for Ohmic contact is doped to 10^19cm^-3. MESFET devices are fabricated using inductively coupled plasma etching and other conventional tools. Power devices with a 1mm gate width are measured and a 2W output at 2GHz is obtained.展开更多
The yttrium as a sintering aid was introduced into polycarbosilane(PCS) to prepare yttrium-containing PCS(PYCS).Two types of yttrium-containing SiC fibres,the SiC(OY) fibres and the SiC(Y) fibres,were fabricat...The yttrium as a sintering aid was introduced into polycarbosilane(PCS) to prepare yttrium-containing PCS(PYCS).Two types of yttrium-containing SiC fibres,the SiC(OY) fibres and the SiC(Y) fibres,were fabricated with PYCS.The structural evolution and the associated properties on changing from SiC(OY) to SiC(Y) fibres during the sintering process were studied.The chemical composition of the SiC(OY) fibres is SiC1.53O0.22Y0.005 with an amorphous structure.The composition of SiC(Y) fibres is SiC1.23O0.05Y0.005.The fibres are composed of a large number of β-SiC crystallites with a size of 50 nm and a small amount of α-SiC crystalline.The tensile strength and fracture toughness of the SiC(OY) fibres are 2.25 GPa and 2.37 MPa·m1/2,respectively,and 1.61 GPa,1.91 MPa·m1/2,respectively for SiC(Y) fibres.The SiC(Y) fibres have a higher thermal stability than the SiC(OY) fibres.展开更多
Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results ...Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.展开更多
AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with a high-mobility GaN thin layer as a channel are grown on high resistive 6H-SiC substrates by metalorganic chemical vapor deposition. The HEMT st...AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with a high-mobility GaN thin layer as a channel are grown on high resistive 6H-SiC substrates by metalorganic chemical vapor deposition. The HEMT structure exhibits a typical two-dimensional electron gas (2DEG) mobility of 1944cm^2/(V·s) at room temperature and 11588cm^2/(V ·s) at 80K with almost equal 2DEG concentrations of about 1.03 × 10^13 cm^-2. High crystal quality of the HEMT structures is confirmed by triple-crystal X-ray diffraction analysis. Atomic force microscopy measurements reveal a smooth AlGaN surface with a root-mean-square roughness of 0.27nm for a scan area of 10μm × 10μm. HEMT devices with 0.8μm gate length and 1.2mm gate width are fabricated using the structures. A maximum drain current density of 957mA/mm and an extrinsic transconductance of 267mS/mm are obtained.展开更多
The core-shell structure silicon-resin precursor powders were synthesized through coat-mix process and addition of Al2O3-SiO2-Y2O3 composite additives.A series of porous silicon carbide ceramics were produced after mo...The core-shell structure silicon-resin precursor powders were synthesized through coat-mix process and addition of Al2O3-SiO2-Y2O3 composite additives.A series of porous silicon carbide ceramics were produced after molding,carbonization and sintering.The phase,morphology,porosity,thermal conductivity,thermal expansion coefficient,and thermal shock resistance were analyzed.The results show that porous silicon carbide ceramics can be produced at low temperature.The grain size of porous silicon carbide ceramic is small,and the thermal conductivity is enhanced significantly.Composite additives also improve the thermal shock resistance of porous ceramics.The bending strength loss rate after 30 times of thermal shock test of the porous ceramics which were added Al2O3-SiO2-Y2O3 and sintered at 1 650 ℃ is only 6.5%.Moreover,the pore inside of the sample is smooth,and the pore size distribution is uniform.Composite additives make little effect on the thermal expansion coefficient of the porous silicon carbide ceramics.展开更多
Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements a...Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films.Electrical properties of the epitaxial 3C-SiC layers with thickness of 1~3μm are measured by Van der Pauw method.The improved Hall mobility reaches the highest value of 470cm 2/(V·s) at the carrier concentration of 7.7×10 17 cm -3 .展开更多
4H-SiC MESFETs are fabricated on semi-insulating SiC substrates. Key processes are optimized to obtain better device performance. A microwave power amplifier is demonstrated from a 1mm SiC MESFET for S band operation....4H-SiC MESFETs are fabricated on semi-insulating SiC substrates. Key processes are optimized to obtain better device performance. A microwave power amplifier is demonstrated from a 1mm SiC MESFET for S band operation. When operated at a drain voltage of 64V, the amplifier shows an output power of 4.09W, a gain of 9.3dB,and a power added efficiency of 31.3%.展开更多
文摘Developing lightweight and flexible thin films for electromagnetic interference(EMI)shielding is of great importance.Porous thin films of reduced graphene oxide containing SiC whiskers(SiC@RGO)for EMI shielding were prepared by a two-step reduction of graphene oxide(GO),in which the two steps were chemical reduction by HI and the solid phase microwave irradiation.A significant increase of the film thickness from around 20 to 200μm was achieved due to the formation of a porous structure by gases released during the 3 s of solid phase microwave irradiation.The total shielding effectiveness(SET)and the reflective SE(SE_(R))of the SiC@RGO porous thin films depended on the GO/SiC mass ratio.The highest SET achieved was 35.6 dB while the SE_(R) was only 2.8 dB,when the GO/SiC mass ratio was 4∶1.The addition of SiC whiskers was critical for the multi-reflection,interfacial po-larization and dielectric attenuation of EM waves.A multilayer film with a gradient change of SE values was constructed using SiC@RGO porous films and multi-walled carbon nanotubes buckypapers.The highest SET of the multilayer films reached 75.1 dB with a SE_(R) of 2.7 dB for a film thickness of about 1.5 mm.These porous SiC@RGO thin films should find use in multilayer or sand-wich structures for EMI absorption in packaging or lining.
基金National Key R&D Program of China(2021YFA0716304)Shanghai Science and Technology Programs(22511100300,23DZ2201500)。
文摘Photoconductive semiconductor switch(PCSS)can be applied in pulsed high power systems and microwave techniques.However,reducing the damage and increasing the lifetime of silicon carbide(SiC)PCSS are still faced severe challenges.In this study,PCSSs with various structures were prepared on 4-inch diameter,500μm thick high-purity semi-insulating 4H-SiC substrates and their on-state resistance and damage mechanisms were investigated.It was found that the PCSS of an Au/TiW/Ni electrode system annealed at 950℃had a minimum on-state resistance of 6.0Ωat 1 kV bias voltage with a 532 nm and 170 mJ pulsed laser by backside illumination single trigger.The backside illumination single trigger could reduce on-state resistance and alleviate the damage of PCSS compared to the frontside trigger when the diameter of the laser spot was larger than the channel length of PCSS.For the 200 s trigger test by a 10 Hz laser,the black branch-like ablation on Au/TiW/Ni PCSS was mainly caused by thermal stress owing to hot carriers.Replacing metal Ni with boron gallium co-doped zinc oxide(BGZO)thin films annealed at 400℃,black branch-like ablation was alleviated while concentric arc damage was obvious at the anode.The major causes of concentric arc are both pulsed laser diffraction and thermal effect.
文摘During the operation of electronic devices,a considerable amount of heat and electromagnetic radiation is emitted.Therefore,the investigation of materials with electromagnetic shielding and thermal management abilities has significant importance.Hybrid materials of three-dimensional graphene networks containing both carbon nanotubes(CNTs)and SiC whiskers(3D graphene-CNT-SiC)were synthesized.Using an aqueous-phase reduction method for the self-assembly of the graphene oxide,a three-dimen-sional porous graphene structure was fabricated.SiC whiskers,inserted between the graphene layers,formed a framework for longit-udinal thermal conduction,while CNTs attached to the SiC surface,created a dendritic structure that increased the bonding between the SiC whiskers and graphene,improving dielectric loss and thermal conductivity.It was found that the thermal conductivity of the hybrid material reached 123 W·m^(-1)·K^(-1),with a shielding effectiveness of 29.3 dB when the SiC addition was 2%.This result indic-ates that 3D graphene-CNT-SiC has excellent thermal conductivity and electromagnetic shielding performance.
文摘A SiC MESFET structure is successfully prepared on a semi-insulated 50mm SiC substrate using a hotwall SiC reactor. The doping concentration for the channel layer is about 1.7 × 10^17 cm^-3 , and the thickness is about 0.35μm. An unintentionally n-doped buffer layer is employed between the substrate and the channel layer. A cap layer for Ohmic contact is doped to 10^19cm^-3. MESFET devices are fabricated using inductively coupled plasma etching and other conventional tools. Power devices with a 1mm gate width are measured and a 2W output at 2GHz is obtained.
基金Projects (51175444,50532010) supported by the National Natural Science Foundation of ChinaProject (2011121002) supported by the Fundamental Research Funds for the Central Universities, ChinaProject (2009J1009) supported by Scientific and Technological Innovation Platform of Fujian Province,China
文摘The yttrium as a sintering aid was introduced into polycarbosilane(PCS) to prepare yttrium-containing PCS(PYCS).Two types of yttrium-containing SiC fibres,the SiC(OY) fibres and the SiC(Y) fibres,were fabricated with PYCS.The structural evolution and the associated properties on changing from SiC(OY) to SiC(Y) fibres during the sintering process were studied.The chemical composition of the SiC(OY) fibres is SiC1.53O0.22Y0.005 with an amorphous structure.The composition of SiC(Y) fibres is SiC1.23O0.05Y0.005.The fibres are composed of a large number of β-SiC crystallites with a size of 50 nm and a small amount of α-SiC crystalline.The tensile strength and fracture toughness of the SiC(OY) fibres are 2.25 GPa and 2.37 MPa·m1/2,respectively,and 1.61 GPa,1.91 MPa·m1/2,respectively for SiC(Y) fibres.The SiC(Y) fibres have a higher thermal stability than the SiC(OY) fibres.
基金Project (50975040) supported by the National Natural Science Foundation of China
文摘Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.
文摘AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with a high-mobility GaN thin layer as a channel are grown on high resistive 6H-SiC substrates by metalorganic chemical vapor deposition. The HEMT structure exhibits a typical two-dimensional electron gas (2DEG) mobility of 1944cm^2/(V·s) at room temperature and 11588cm^2/(V ·s) at 80K with almost equal 2DEG concentrations of about 1.03 × 10^13 cm^-2. High crystal quality of the HEMT structures is confirmed by triple-crystal X-ray diffraction analysis. Atomic force microscopy measurements reveal a smooth AlGaN surface with a root-mean-square roughness of 0.27nm for a scan area of 10μm × 10μm. HEMT devices with 0.8μm gate length and 1.2mm gate width are fabricated using the structures. A maximum drain current density of 957mA/mm and an extrinsic transconductance of 267mS/mm are obtained.
基金Project(50802052)supported by the National Natural Science Foundation of China
文摘The core-shell structure silicon-resin precursor powders were synthesized through coat-mix process and addition of Al2O3-SiO2-Y2O3 composite additives.A series of porous silicon carbide ceramics were produced after molding,carbonization and sintering.The phase,morphology,porosity,thermal conductivity,thermal expansion coefficient,and thermal shock resistance were analyzed.The results show that porous silicon carbide ceramics can be produced at low temperature.The grain size of porous silicon carbide ceramic is small,and the thermal conductivity is enhanced significantly.Composite additives also improve the thermal shock resistance of porous ceramics.The bending strength loss rate after 30 times of thermal shock test of the porous ceramics which were added Al2O3-SiO2-Y2O3 and sintered at 1 650 ℃ is only 6.5%.Moreover,the pore inside of the sample is smooth,and the pore size distribution is uniform.Composite additives make little effect on the thermal expansion coefficient of the porous silicon carbide ceramics.
文摘Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films.Electrical properties of the epitaxial 3C-SiC layers with thickness of 1~3μm are measured by Van der Pauw method.The improved Hall mobility reaches the highest value of 470cm 2/(V·s) at the carrier concentration of 7.7×10 17 cm -3 .
文摘4H-SiC MESFETs are fabricated on semi-insulating SiC substrates. Key processes are optimized to obtain better device performance. A microwave power amplifier is demonstrated from a 1mm SiC MESFET for S band operation. When operated at a drain voltage of 64V, the amplifier shows an output power of 4.09W, a gain of 9.3dB,and a power added efficiency of 31.3%.