考虑由扰动数据重构原函数的导数问题.基于L-广义解正则化理论,提出了一个新的磨光方法的框架.给出一个具体的求解前3阶导数的算法,其中正则化策略选择了一种改进的TSVD(truncated singular value decomposition)方法(典则TSVD方法).数...考虑由扰动数据重构原函数的导数问题.基于L-广义解正则化理论,提出了一个新的磨光方法的框架.给出一个具体的求解前3阶导数的算法,其中正则化策略选择了一种改进的TSVD(truncated singular value decomposition)方法(典则TSVD方法).数值结果进一步验证了理论结果及新方法的有效性.展开更多
The adsorption characteristics of cationic polyelectrolyte poly dimethyl diallyl ammonium chloride （PDADMAC） and anionic polyelectrolyte poly （sodium-p-styrenesulfonate） （PSS） on benzoguanamine formal- dehyde （...The adsorption characteristics of cationic polyelectrolyte poly dimethyl diallyl ammonium chloride （PDADMAC） and anionic polyelectrolyte poly （sodium-p-styrenesulfonate） （PSS） on benzoguanamine formal- dehyde （BGF） particles are investigated. The charging characteristics of BGF particles are changed and con- trolled using electrostatic self-assembly method. A variety of PE,-BGF/SiO2 composite abrasives are obtained. The as-prepared samples are analyzed by zeta potential analysis, transmission electron microscope （TEM） and thermogravimetric （TG） analysis. The composite abrasive slurries are prepared for copper polishing. The poli- shing results indicate that it is SiO2 abrasives, not only coated SiO2 abrasive on polymer particles but also free SiO2 abrasive in slurry, that offer the polishing action. The material removal rates of copper polishing are 264 nm/min, 348 nm/min and 476 nm/min using single SiO2 abrasive slurry, PE0-BGF/SiO2 mixed abrasive slur- ry and PE3-BGF/SiO2 composite abrasive slurry, respectively. The surface roughness Ra of copper wafer （with 5μm×5μm district） is decreased from 0.166 μm to 3.7 nm, 2.6 nm and 1.5 nm, and the surface peak-valley values Rrv are less than 20 nm, 14 nm and 10 nm using these kinds of slurries, respectively. Key words ： chemico-mechanical polishing; polishing slurry; composite abrasives ; polyelectrolyte ; copper展开更多
With the development of superlubricity, the requirement for the accuracy of measuring super low friction force becomes more and more high. In this study, a novel micro-tribometer has been designed. The resolution and ...With the development of superlubricity, the requirement for the accuracy of measuring super low friction force becomes more and more high. In this study, a novel micro-tribometer has been designed. The resolution and accuracy of friction force are 0.01 m N by using the dual frequency laser interferometer. Experiments were performed to investigate the ability of measuring friction force from different aspects. The interference signal mixed in the measured friction force curve was analyzed and can be removed by a designed filter. The results of experiment show that the tribometer is capable of measuring a super low friction force in the order of magnitude of 0.01 m N with an applied load up to 1 N.展开更多
文摘考虑由扰动数据重构原函数的导数问题.基于L-广义解正则化理论,提出了一个新的磨光方法的框架.给出一个具体的求解前3阶导数的算法,其中正则化策略选择了一种改进的TSVD(truncated singular value decomposition)方法(典则TSVD方法).数值结果进一步验证了理论结果及新方法的有效性.
基金Natural Science Foundation of Zhejiang Province(No.Z1080625)
文摘The adsorption characteristics of cationic polyelectrolyte poly dimethyl diallyl ammonium chloride （PDADMAC） and anionic polyelectrolyte poly （sodium-p-styrenesulfonate） （PSS） on benzoguanamine formal- dehyde （BGF） particles are investigated. The charging characteristics of BGF particles are changed and con- trolled using electrostatic self-assembly method. A variety of PE,-BGF/SiO2 composite abrasives are obtained. The as-prepared samples are analyzed by zeta potential analysis, transmission electron microscope （TEM） and thermogravimetric （TG） analysis. The composite abrasive slurries are prepared for copper polishing. The poli- shing results indicate that it is SiO2 abrasives, not only coated SiO2 abrasive on polymer particles but also free SiO2 abrasive in slurry, that offer the polishing action. The material removal rates of copper polishing are 264 nm/min, 348 nm/min and 476 nm/min using single SiO2 abrasive slurry, PE0-BGF/SiO2 mixed abrasive slur- ry and PE3-BGF/SiO2 composite abrasive slurry, respectively. The surface roughness Ra of copper wafer （with 5μm×5μm district） is decreased from 0.166 μm to 3.7 nm, 2.6 nm and 1.5 nm, and the surface peak-valley values Rrv are less than 20 nm, 14 nm and 10 nm using these kinds of slurries, respectively. Key words ： chemico-mechanical polishing; polishing slurry; composite abrasives ; polyelectrolyte ; copper
基金supported by National Natural Scienceof China(Grant Nos.51527901,51335005&51321092)National Basic Research Program of China(Grant No.2013CB934200)
文摘With the development of superlubricity, the requirement for the accuracy of measuring super low friction force becomes more and more high. In this study, a novel micro-tribometer has been designed. The resolution and accuracy of friction force are 0.01 m N by using the dual frequency laser interferometer. Experiments were performed to investigate the ability of measuring friction force from different aspects. The interference signal mixed in the measured friction force curve was analyzed and can be removed by a designed filter. The results of experiment show that the tribometer is capable of measuring a super low friction force in the order of magnitude of 0.01 m N with an applied load up to 1 N.
