Aluminum was electrodeposited with constant current on AZ31 magnesium alloy pretreated under optimized conditions from trimethyl-phenyl-ammonium chloride and anhydrous aluminum chloride （TMPAC-AlCl3） quaternary ammo...Aluminum was electrodeposited with constant current on AZ31 magnesium alloy pretreated under optimized conditions from trimethyl-phenyl-ammonium chloride and anhydrous aluminum chloride （TMPAC-AlCl3） quaternary ammonium room temperature ionic liquids with benzene as a co-solvent. The corrosion resistance of the as-deposited Al layers was evaluated in 3.5% NaCl solution by the electrochemical technologies. The Al depositions were characterized by scanning electron microscopy equipped with energy dispersion X-ray. The results show that the microstructures of the Al depositions have spherical equiaxed grains obtained at a high current density, and bulk grains at a low current density. The Al deposition obtained at 12.3 mA/cm2 has a smooth and compact surface. The electrochemical measurements indicate that the thicker Al deposition can more effectively protect the Mg substrate. The Al deposition with bulk grains hardly protects the AZ31 Mg substrate from corrosion owing to its porosity.展开更多
The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from a...The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.展开更多
文摘Aluminum was electrodeposited with constant current on AZ31 magnesium alloy pretreated under optimized conditions from trimethyl-phenyl-ammonium chloride and anhydrous aluminum chloride （TMPAC-AlCl3） quaternary ammonium room temperature ionic liquids with benzene as a co-solvent. The corrosion resistance of the as-deposited Al layers was evaluated in 3.5% NaCl solution by the electrochemical technologies. The Al depositions were characterized by scanning electron microscopy equipped with energy dispersion X-ray. The results show that the microstructures of the Al depositions have spherical equiaxed grains obtained at a high current density, and bulk grains at a low current density. The Al deposition obtained at 12.3 mA/cm2 has a smooth and compact surface. The electrochemical measurements indicate that the thicker Al deposition can more effectively protect the Mg substrate. The Al deposition with bulk grains hardly protects the AZ31 Mg substrate from corrosion owing to its porosity.
基金Projects(51204080, 51274108) supported by the National Natural Science Foundation of ChinaProject(2011FA009) supported by the Natural Science Foundation of Yunnan Province, ChinaProject(2011FZ020) supported by the Application Research Foundation of Yunnan Province, China
文摘The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.
