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芯片级PHEMT热特性等效方法 被引量:2
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作者 徐秀琴 莫炯炯 +3 位作者 王志宇 尚永衡 郭丽丽 郁发新 《浙江大学学报(工学版)》 EI CAS CSCD 北大核心 2016年第10期2002-2008,共7页
为了准确估计砷化镓赝配高电子迁移率晶体管(PHEMT)的单片微波集成电路(MMIC)的热特性,提出芯片级PHEMT的热特性等效方法.该方法通过PHEMT管芯结构等效,引入芯片版图和过孔的热扩散效应,建立芯片级热仿真模型,可以在不改变管芯横向热分... 为了准确估计砷化镓赝配高电子迁移率晶体管(PHEMT)的单片微波集成电路(MMIC)的热特性,提出芯片级PHEMT的热特性等效方法.该方法通过PHEMT管芯结构等效,引入芯片版图和过孔的热扩散效应,建立芯片级热仿真模型,可以在不改变管芯横向热分布的情况下,大幅简化仿真模型的网格,有效提高芯片级管芯峰值温度的仿真精度和仿真速度.基于该热特性等效方法,在ANSYS ICEPAK中对一颗GaAs PHEMT MMIC(单片微波集成电路)功率放大器芯片和一颗GaAs PHEMT MMIC驱动放大器芯片进行建模和仿真.运用红外热成像仪对两颗芯片温度进行实测,仿真与实测的芯片PHEMT峰值温度具有良好的一致性.基于该芯片级PHEMT热特性等效方法可知,芯片热仿真所得的峰值温度与实测结果的误差控制在2%之内. 展开更多
关键词 等效热分析 峰值温度 GaAsPHEMTMMIC ANSYSICEPAK 红外成像技术
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300MW机组蒸汽冷却器热经济性分析 被引量:2
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作者 刘志真 《长沙电力学院学报(自然科学版)》 2003年第3期63-66,共4页
利用等效热降局部定量分析方法,分析了蒸汽冷却器的热经济性,得出了重要结果,可为进一步提高机组热经济性提供理论依据.
关键词 300MW机组 蒸汽冷却器 经济性 等效降局部定量分析 火电机组 系统
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Thermal analysis of laser diode module by an equivalent electrical network method
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作者 YANG Ming-wei XU Wen-hai TANG Wen-yan 《Optoelectronics Letters》 EI 2006年第4期273-277,共5页
An equivalent electrical network method is presented in this paper to analyze the cooling characteristics of a laser diode module (LDM).And a modified equivalent model of a thermoelectric cooler (TEC) with an adjuncti... An equivalent electrical network method is presented in this paper to analyze the cooling characteristics of a laser diode module (LDM).And a modified equivalent model of a thermoelectric cooler (TEC) with an adjunctive thermal resistance and a contact resistance is proposed.The performance of a commercial TEC has been simulated.The thermal analysis of a LDM incorporated with a TEC has been performed by using an equivalent circuit model of the LDM.In the analysis the change of LD current,TEC current,and the ambient temperature are all considered.It shows that the equivalent circuit approach is an effective tool for the qualitative analysis of TEC and LDM. 展开更多
关键词 激光二极管 分析 等效电网 电冷却器
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Modelling of Transduction Heaters Using Transformer Equivalent Circuit and Finite Element Analysis
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作者 Lisiate Takau Pat Bodger 《Journal of Energy and Power Engineering》 2014年第6期1085-1092,共8页
This paper presents the modelling of transduction heaters using the TEC (transformer equivalent circuit) model and FEA (finite element analysis). Each model was used to simulate a set oftransduction heating experi... This paper presents the modelling of transduction heaters using the TEC (transformer equivalent circuit) model and FEA (finite element analysis). Each model was used to simulate a set oftransduction heating experiments and the results compared. Analysis of the TEC calculated results suggested modification of three parameters: the secondary resistance, the core tube eddy current resistance and the core tube magnetizing reactance. The improved TEC model was then used to design, build and test a 6 kW transduction heater. The measured results are compared with calculated results from the TEC and FEA models. The TEC model accurately predicts the performance of the heater. 展开更多
关键词 Induction heating transduction heating transformer equivalent circuit finite element analysis.
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