Heat pipe is always bent in the typical application of electronic heat dissipation at high heat flux,which greatly affects its heat transfer performance. The capillary limit of heat transport in the bent micro-grooved...Heat pipe is always bent in the typical application of electronic heat dissipation at high heat flux,which greatly affects its heat transfer performance. The capillary limit of heat transport in the bent micro-grooved heat pipes was analyzed in the vapor pressure drop,the liquid pressure drop and the interaction of the vapor with wick fluid. The bent heat pipes were fabricated and tested from the bending angle,the bending position and the bending radius. The results show that temperature difference and thermal resistance increase while the heat transfer capacity of the heat pipe decreases,with the increase of the bending angles and the bending position closer to the vapor section. However,the effects of bending radius can be ignored. The result agrees well with the predicted equations.展开更多
This article describes the effective channel length degradation under hot carrier stressing. The extraction is based on the IDs-Vcs characteristics by maximum transconductance （maximum slope of IDs ＆ VGS） in the li...This article describes the effective channel length degradation under hot carrier stressing. The extraction is based on the IDs-Vcs characteristics by maximum transconductance （maximum slope of IDs ＆ VGS） in the linear region. The transconductance characteristics are determine for the several devices of difference drawn channel length. The effective channel length of submicron LDD （Lightly Doped Drain） NMOSFETs （Metal Oxide Semiconductor Field Effect Transistor） under hot carrier stressing was measured at the stress time varying from zero to 10,000 seconds. It is shown that the effective channel length was increased with time. This is caused by charges trapping in the oxide during stress. The increased of effective channel length （△Leff） is seem to be increased sharply as the gate channel length is decrease.展开更多
基金Project(U0834002) supported by the Joint Funds of the National Nature Science Foundation of China and Guangdong ProvinceProject (2009ZM0134) supported by the Foundational Research Funds for the Central Universities in China
文摘Heat pipe is always bent in the typical application of electronic heat dissipation at high heat flux,which greatly affects its heat transfer performance. The capillary limit of heat transport in the bent micro-grooved heat pipes was analyzed in the vapor pressure drop,the liquid pressure drop and the interaction of the vapor with wick fluid. The bent heat pipes were fabricated and tested from the bending angle,the bending position and the bending radius. The results show that temperature difference and thermal resistance increase while the heat transfer capacity of the heat pipe decreases,with the increase of the bending angles and the bending position closer to the vapor section. However,the effects of bending radius can be ignored. The result agrees well with the predicted equations.
文摘This article describes the effective channel length degradation under hot carrier stressing. The extraction is based on the IDs-Vcs characteristics by maximum transconductance （maximum slope of IDs ＆ VGS） in the linear region. The transconductance characteristics are determine for the several devices of difference drawn channel length. The effective channel length of submicron LDD （Lightly Doped Drain） NMOSFETs （Metal Oxide Semiconductor Field Effect Transistor） under hot carrier stressing was measured at the stress time varying from zero to 10,000 seconds. It is shown that the effective channel length was increased with time. This is caused by charges trapping in the oxide during stress. The increased of effective channel length （△Leff） is seem to be increased sharply as the gate channel length is decrease.
