In order to increase the processability and process window of the selective laser melting(SLM)-fabricated Al−Mn−Mg−Er−Zr alloy,a novel Si-modified Al−Mn−Mg−Er−Zr alloy was designed.The effect of Si alloying on the sur...In order to increase the processability and process window of the selective laser melting(SLM)-fabricated Al−Mn−Mg−Er−Zr alloy,a novel Si-modified Al−Mn−Mg−Er−Zr alloy was designed.The effect of Si alloying on the surface quality,processability,microstructure,and mechanical properties of the SLM-fabricated alloy was studied.The results showed that introducing Si into the Al−Mn−Mg−Er−Zr alloy prevented balling and keyhole formation,refined the grain size,and reduced the solidification temperature,which eliminated cracks and increased the processability and process window of the alloy.The maximum relative density of the SLM-fabricated Si/Al−Mn−Mg−Er−Zr alloy reached 99.6%.The yield strength and ultimate tensile strength of the alloy were(371±7)MPa and(518±6)MPa,respectively.These values were higher than those of the SLM-fabricated Al−Mn−Mg−Er−Zr and other Sc-free Al−Mg-based alloys.展开更多
The effect of thermal exposure at 350 ℃ for 200 h on microstructure and mechanical properties was investigated for Al-Si-Cu-Ni-Mg alloy, which was produced by permanent mold casting(PMC) and high pressure die casting...The effect of thermal exposure at 350 ℃ for 200 h on microstructure and mechanical properties was investigated for Al-Si-Cu-Ni-Mg alloy, which was produced by permanent mold casting(PMC) and high pressure die casting(HPDC). The SEM and IPP software were used to characterize the morphology of Si phase in the studied alloys. The results show that the thermal exposure provokes spheroidization and coarsening of eutectic Si particles. The ultimate tensile strength of the HPDC alloy after thermal exposure is higher than that of the PMC alloy at room temperature. However, the TEPMC and TEHPDC alloys have similar tensile strength around 67 MPa at 350 ℃. Due to the coarsening of eutectic Si, the TEPMC alloy exhibits better creep resistance than the TEHPDC alloy under studied creep conditions. Therefore, the alloys with small size of eutectic Si are not suitably used at 350 ℃.展开更多
基金the National Natural Science Foundation of China(Nos.51801079,52001140)the Portugal National Funds through FCT Project(No.2021.04115).
文摘In order to increase the processability and process window of the selective laser melting(SLM)-fabricated Al−Mn−Mg−Er−Zr alloy,a novel Si-modified Al−Mn−Mg−Er−Zr alloy was designed.The effect of Si alloying on the surface quality,processability,microstructure,and mechanical properties of the SLM-fabricated alloy was studied.The results showed that introducing Si into the Al−Mn−Mg−Er−Zr alloy prevented balling and keyhole formation,refined the grain size,and reduced the solidification temperature,which eliminated cracks and increased the processability and process window of the alloy.The maximum relative density of the SLM-fabricated Si/Al−Mn−Mg−Er−Zr alloy reached 99.6%.The yield strength and ultimate tensile strength of the alloy were(371±7)MPa and(518±6)MPa,respectively.These values were higher than those of the SLM-fabricated Al−Mn−Mg−Er−Zr and other Sc-free Al−Mg-based alloys.
基金Projects(2016YFB0700502,2016YFB0301001)supported by the National Key Research and Development Program of China。
文摘The effect of thermal exposure at 350 ℃ for 200 h on microstructure and mechanical properties was investigated for Al-Si-Cu-Ni-Mg alloy, which was produced by permanent mold casting(PMC) and high pressure die casting(HPDC). The SEM and IPP software were used to characterize the morphology of Si phase in the studied alloys. The results show that the thermal exposure provokes spheroidization and coarsening of eutectic Si particles. The ultimate tensile strength of the HPDC alloy after thermal exposure is higher than that of the PMC alloy at room temperature. However, the TEPMC and TEHPDC alloys have similar tensile strength around 67 MPa at 350 ℃. Due to the coarsening of eutectic Si, the TEPMC alloy exhibits better creep resistance than the TEHPDC alloy under studied creep conditions. Therefore, the alloys with small size of eutectic Si are not suitably used at 350 ℃.
