A novel micro-nano Ti−10Cu−10Ni−8Al−8Nb−4Zr−1.5Hf filler was used to vacuum braze Ti−47Al−2Nb−2Cr−0.15B alloy at 1160−1220℃ for 30 min.The interfacial microstructure and formation mechanism of TiAl joints and the rel...A novel micro-nano Ti−10Cu−10Ni−8Al−8Nb−4Zr−1.5Hf filler was used to vacuum braze Ti−47Al−2Nb−2Cr−0.15B alloy at 1160−1220℃ for 30 min.The interfacial microstructure and formation mechanism of TiAl joints and the relationships among brazing temperature,interfacial microstructure and joint strength were emphatically investigated.Results show that the TiAl joints brazed at 1160 and 1180℃ possess three interfacial layers and mainly consist of α_(2)-Ti_(3)Al,τ_(3)-Al_(3)NiTi_(2) and Ti_(2)Ni,but the brazing seams are no longer layered and Ti_(2)Ni is completely replaced by the uniformly distributed τ_(3)-Al_(3)NiTi_(2) at 1200 and 1220℃ due to the destruction of α_(2)-Ti_(3)Al barrier layer.This transformation at 1200℃ obviously improves the tensile strength of the joint and obtains a maximum of 343 MPa.Notably,the outward diffusion of Al atoms from the dissolution of TiAl substrate dominates the microstructure evolution and tensile strength of the TiAl joint at different brazing temperatures.展开更多
The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could inc...The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.展开更多
基金the National Natural Science Foundation of China(No.51865012)the Natural Science Foundation of Jiangxi Province,China(No.20202BABL204040)+3 种基金the Open Foundation of National Engineering Research Center of Near-net-shape Forming for Metallic Materials,China(No.2016005)the Science Foundation of Educational Department of Jiangxi Province,China(No.GJJ170372)the GF Basic Scientific Research Project,China(No.JCKY2020205C002)the Civil Population Supporting Planning and Development Project,China(No.JPPT125GH038).
文摘A novel micro-nano Ti−10Cu−10Ni−8Al−8Nb−4Zr−1.5Hf filler was used to vacuum braze Ti−47Al−2Nb−2Cr−0.15B alloy at 1160−1220℃ for 30 min.The interfacial microstructure and formation mechanism of TiAl joints and the relationships among brazing temperature,interfacial microstructure and joint strength were emphatically investigated.Results show that the TiAl joints brazed at 1160 and 1180℃ possess three interfacial layers and mainly consist of α_(2)-Ti_(3)Al,τ_(3)-Al_(3)NiTi_(2) and Ti_(2)Ni,but the brazing seams are no longer layered and Ti_(2)Ni is completely replaced by the uniformly distributed τ_(3)-Al_(3)NiTi_(2) at 1200 and 1220℃ due to the destruction of α_(2)-Ti_(3)Al barrier layer.This transformation at 1200℃ obviously improves the tensile strength of the joint and obtains a maximum of 343 MPa.Notably,the outward diffusion of Al atoms from the dissolution of TiAl substrate dominates the microstructure evolution and tensile strength of the TiAl joint at different brazing temperatures.
基金supported by the National Natural Science Foundation of China(Nos.52105369,61974070)Natural Science Foundation of the Jiangsu Higher Education Institutions of China(No.20KJB460008)+1 种基金Natural Science Foundation of Jiangsu Province,China(No.BK20200746)NUPTSF(No.NY220077).
文摘The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability.
