Nanoindentation tests performed in a commercial atomic force microscope have been utilized to directly measure the elastic modulus and the hardness of single crystal copper thin films fabricated by the vacuum vapor de...Nanoindentation tests performed in a commercial atomic force microscope have been utilized to directly measure the elastic modulus and the hardness of single crystal copper thin films fabricated by the vacuum vapor deposition technique. Nanoindentation tests were conducted at various indentation depths to study the effect of indentation depths on the mechanical properties of thin films. The results were interpreted by using the Oliver-Pharr method with which direct observation and measurement of the contact area are not required. The elastic modulus of the single crystal copper film at various indentation depths was determined as (67.0±(6.9) GPa) on average which is in reasonable agreement with the results reported in literature. The indentation hardness constantly increases with decreasing indentation depth, indicating a strong size effect.展开更多
Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron mic...Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy(FESEM) and atomic force microscopy(AFM). The results indicate that the copper films have a(111) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer(F-S),Mayadas-Shatzkes(M-S) theory and a combined model,the grain boundary reflection coefficient(R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.展开更多
The n-type semiconducting titanium oxide thin films are well-known as electron transporting interlayer in photovoltaic cells. The favorable characteristics of interlayers in photovoltaics are high optical transmittan...The n-type semiconducting titanium oxide thin films are well-known as electron transporting interlayer in photovoltaic cells. The favorable characteristics of interlayers in photovoltaics are high optical transmittance （T%）, wide band gap energy （Eg） and high electrical conductivity （σ）. Modifying titanium oxide films with metal nanoparticles would increase electrical conductivity but reduce optical band gap energy. We developed the sol-gel derived titanium suboxide （TiOx） films modified with silver （Ag） or gold （Au） or copper （Cu） nanoparticles （NPs）. This study explores a tradeoff between narrowing optical band gap and enhancing electrical conductivity of nanostructured TiOx films by controlling the Au- or Ag- or Cu-NPs loading concentrations （mol%） in titania. The Au- and Cu-NPs loading concentration of 4 mol% should meet a tradeoff which yields the higher T%, wider Eg and higher compared to those of pure TiOx films. In addition, since the pure Cu is not thermodynamically stable in ambience as compared to Au and Ag, the stability of as-obtained colloidal CuNPs is also examined. A careful examination of the time evolution of surface plasmon resonance （SPR） bands of CuNPs indicates that their stability is only up to 4 h.展开更多
文摘Nanoindentation tests performed in a commercial atomic force microscope have been utilized to directly measure the elastic modulus and the hardness of single crystal copper thin films fabricated by the vacuum vapor deposition technique. Nanoindentation tests were conducted at various indentation depths to study the effect of indentation depths on the mechanical properties of thin films. The results were interpreted by using the Oliver-Pharr method with which direct observation and measurement of the contact area are not required. The elastic modulus of the single crystal copper film at various indentation depths was determined as (67.0±(6.9) GPa) on average which is in reasonable agreement with the results reported in literature. The indentation hardness constantly increases with decreasing indentation depth, indicating a strong size effect.
基金Project (2004CB619301) supported by the National Basic Research and Development Program and Project 985-Automotive Engineering of Jilin University
文摘Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy(FESEM) and atomic force microscopy(AFM). The results indicate that the copper films have a(111) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer(F-S),Mayadas-Shatzkes(M-S) theory and a combined model,the grain boundary reflection coefficient(R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.
文摘The n-type semiconducting titanium oxide thin films are well-known as electron transporting interlayer in photovoltaic cells. The favorable characteristics of interlayers in photovoltaics are high optical transmittance （T%）, wide band gap energy （Eg） and high electrical conductivity （σ）. Modifying titanium oxide films with metal nanoparticles would increase electrical conductivity but reduce optical band gap energy. We developed the sol-gel derived titanium suboxide （TiOx） films modified with silver （Ag） or gold （Au） or copper （Cu） nanoparticles （NPs）. This study explores a tradeoff between narrowing optical band gap and enhancing electrical conductivity of nanostructured TiOx films by controlling the Au- or Ag- or Cu-NPs loading concentrations （mol%） in titania. The Au- and Cu-NPs loading concentration of 4 mol% should meet a tradeoff which yields the higher T%, wider Eg and higher compared to those of pure TiOx films. In addition, since the pure Cu is not thermodynamically stable in ambience as compared to Au and Ag, the stability of as-obtained colloidal CuNPs is also examined. A careful examination of the time evolution of surface plasmon resonance （SPR） bands of CuNPs indicates that their stability is only up to 4 h.
