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经编方平组织效应的设计
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作者 焦晓宁 《针织工业》 北大核心 1990年第4期5-6,共2页
将左斜纹和右斜纹以一定的组合配置而成的组织叫方平组织,如图1所示。图1a为由2条左斜纹2条右斜纹组成的方平组织效应,图1b为由3条左斜纹3条右斜纹组成的方平组织效应。具有方平组织效应的纬编织物已屡见不鲜,而这类经编织物却不常见到... 将左斜纹和右斜纹以一定的组合配置而成的组织叫方平组织,如图1所示。图1a为由2条左斜纹2条右斜纹组成的方平组织效应,图1b为由3条左斜纹3条右斜纹组成的方平组织效应。具有方平组织效应的纬编织物已屡见不鲜,而这类经编织物却不常见到,现介绍如下。 展开更多
关键词 针织工艺 经编设计 方平组织效应
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经编生产工艺设计中的工作针数
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作者 吴昊 《江苏纺织》 2002年第3期43-45,共3页
经编生产工艺中,工作针数是其中的一项设计内容,本篇主要介绍了经编在工作针数初定、确定、试产及调整中的操作问题。
关键词 经编生产工艺设计 工作针数 针织
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Design of 3D Active Multichannel Silicon Neural Microelectrode
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作者 王頔 张国雄 李醒飞 《Transactions of Tianjin University》 EI CAS 2006年第6期446-451,共6页
To find a design method for 3D active multichannel silicon microelectrode, a microstructure of active neural recording system is presented, where two 2D probes, two integrated circuits and two spacers are microassembl... To find a design method for 3D active multichannel silicon microelectrode, a microstructure of active neural recording system is presented, where two 2D probes, two integrated circuits and two spacers are microassembled on a 5 mm×7 mm silicon platform, and 32 sites neural signals can be operated simultaneously. A theoretical model for measuring the neural signal by the silicon microelectrode is proposed based on the structure and fabrication process of a single-shank probe. The method of determining the dimensional parameters of the probe shank is discussed in the following three aspects, i.e. the structures of pallium and endocranium, coupled interconnecters noise, and strength characteristic of neural probe. The design criterion is to minimize the size of the neural probe as well as that the probe has enough stiffness to pierce the endocranium. The on-chip unity-gain bandpass amplifier has an overall gain of 42 dB over a bandwidth from 60 Hz to 10 kHz; and the DC-baseline stability circuit is of high input resistance above 30 MΩ to guarantee a cutoff frequency below 100 Hz. The circuit works in stimulating or recording modes. The conversion of the modes depends on the stimulating control signal. 展开更多
关键词 MICROELECTRODES neural chips application specific integrated circuits microelectromechanical devices MICROSTRUCTURE
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