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同步顶升系统在结构大片建造中的应用 被引量:1
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作者 杨伟旗 杨成鹏 曹志光 《科技资讯》 2010年第33期64-64,66,共2页
传统建造工艺中,在结构大片完成预制后采用多台大型履带式起重机进行联机作业,将结构大片抬升到一定高度然后放置到大型平板运输车上以便进行运输作业,存在占用设备资源多、作业难度和风险大等诸多不利因素。本文中设计了同步抬升系统,... 传统建造工艺中,在结构大片完成预制后采用多台大型履带式起重机进行联机作业,将结构大片抬升到一定高度然后放置到大型平板运输车上以便进行运输作业,存在占用设备资源多、作业难度和风险大等诸多不利因素。本文中设计了同步抬升系统,分多次将结构大片同步抬升到适当高度,实现运输设备能方便进出,达到降低作业成本和难度,减少作业风险,同时实现节能减排效应。 展开更多
关键词 结构大片 同步抬升系统 节能减排 工程应用
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STRUCTURAL RESPONSE OF SOYBEAN LEAF TO ELEVATED CO_2 CONCENTRATION 被引量:26
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作者 林金星 胡玉熹 《Acta Botanica Sinica》 CSCD 1996年第1期31-34,共4页
The effects of CO 2 concentration on the morphological and anatomical characters of soybean (Glycine max) leaf were investigated by means of light microscopy and SEM.It was noticed that exomorphology did not show dra... The effects of CO 2 concentration on the morphological and anatomical characters of soybean (Glycine max) leaf were investigated by means of light microscopy and SEM.It was noticed that exomorphology did not show dramatic change,while stomatal density decreased with increasing CO 2 concentration.Under SEM,no epicuticular wax was observed on both abaxial and adaxial sides of the control group as well as on adaxial side of the treatment group.However,leaf surface of abaxial side was noticed to be densely covered with microasterisk epicuticular wax when they were exposed to CO 2 enriched environment.The epicuticular wax deposition was present in equal abundance on both stomatal and nonstomatal areas.Furthermore,leaf thickness increased significantly due largely to the origin of an extra layer of palisade in the treatment group.The results confirmed that CO 2 enrichment might enhance cell division and induce greater quantity of epicuticular wax. 展开更多
关键词 SOYBEAN Foliar structure CO 2 concentration
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Challenges to Data-Path Physical Design Inside SOC 被引量:2
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作者 经彤 洪先龙 +5 位作者 蔡懿慈 许静宇 杨长旗 张轶谦 周强 吴为民 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第8期785-793,共9页
Previously,a single data-path stack was adequate for data-path chips,and the complexity and size of the data-path was comparatively small.As current data-path chips,such as system-on-a-chip (SOC),become more complex,m... Previously,a single data-path stack was adequate for data-path chips,and the complexity and size of the data-path was comparatively small.As current data-path chips,such as system-on-a-chip (SOC),become more complex,multiple data-path stacks are required to implement the entire data-path.As more data-path stacks are integrated into SOC,data-path is becoming a critical part of the whole giga-scale integrated circuits (GSI) design.The traditional physical design methodology can not satisfy the data-path performance requirements,because it can not accommodate the data-path bit-sliced structure and the strict performance (such as timing,coupling,and crosstalk) constraints.Challenges in the data-path physical design are addressed.The fundamental problems and key technologies in data-path physical design are analysed.The corresponding researches and solutions in this research field are also discussed. 展开更多
关键词 physical design data-path bit-sliced structure SYSTEM-ON-A-CHIP giga-scale integrated circuits very-deep-submicron
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Evolution of lamellar structure in Ti-47Al-2Nb-2Cr-0.2W alloy sheet
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作者 卢斌 黄岚 +4 位作者 刘咏 梁宵鹏 刘彬 贺跃辉 李慧中 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第5期1293-1298,共6页
The Ti-47Al-2Nb-2Cr-0.2W alloy sheets were obtained by hot pack rolling. The as-rolled sheet has an inhomogeneous duplex microstructure composed of elongated gamma grains and lamellar colonies. Heat treatments were co... The Ti-47Al-2Nb-2Cr-0.2W alloy sheets were obtained by hot pack rolling. The as-rolled sheet has an inhomogeneous duplex microstructure composed of elongated gamma grains and lamellar colonies. Heat treatments were conducted on the as-rolled sheets. The results show that the microstructures with different sizes and grain boundary morphologies were developed after different heat treatments. A coarse fully lamellar structure can be refined if the heating time, together with the cooling rate, is appropriately controlled. The grain growth exponent is found to be approximately 0.2, and the activation energy of grain boundary migration of the alloy is around 225 kJ/mol. 展开更多
关键词 TiAl alloy heat treatment lamellar structure grain growth
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