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旱坡地聚流沟种植技术效应研究初报 被引量:3
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作者 刘和斌 《甘肃农业科技》 1998年第3期25-26,共2页
在旱坡地以糜子为指示作物采用聚流沟种植技术的研究结果表明,地表径流可减少33.8%,0~30cm土层土壤含水量提高3.23~3.56个百分点,较传统种植方式增产40.29%。秸秆覆盖栽培可使产沙量下降59.32%,径... 在旱坡地以糜子为指示作物采用聚流沟种植技术的研究结果表明,地表径流可减少33.8%,0~30cm土层土壤含水量提高3.23~3.56个百分点,较传统种植方式增产40.29%。秸秆覆盖栽培可使产沙量下降59.32%,径流含沙率下降54.87%,较传统种植方式增产13.15%。 展开更多
关键词 旱坡地 聚流沟 种植技术
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Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via(TSV) application 被引量:1
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作者 DING YingTao YAN YangYang +3 位作者 CHEN QianWen WANG ShiWei CHEN Xiu CHEN YueYang 《Science China(Technological Sciences)》 SCIE EI CAS 2014年第8期1616-1625,共10页
Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process bas... Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process based on experiments and numerical simulation,and studied the effect of vacuum pressure,viscosity of polymer and aspect-ratio of trench on the filling performance.A 2D axisymmetric model,consisting of polymer partially filled into the trench and void at the bottom of trench,was developed for the computational fluid dynamics(CFD)simulation.The simulation results indicate that the vacuum-assisted polymer filling process goes through four stages,including bubble formation,bubble burst,air elimination and polymer re-filling.Moreover,the simulation results suggest that the pressure significantly affects the bubble formation and the polymer re-filling procedure,and the polymer viscosity and the trench aspect-ratio influence the duration of air elimination. 展开更多
关键词 through-silicon-via (TSV) vacuum process polymer filling computational fluid dynamics (CFD)
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