为满足工程领域对耐高温树脂基透波复合材料的需求,研究石英纤维(QF)增强新型含硅改性聚芳炔(PSA)树脂基复合材料(QF/PSA)的制备方法及其性能。首先对树脂的黏度进行分析,确定了树脂在不同温度和时间下的黏度变化预测模型,适宜的树脂传...为满足工程领域对耐高温树脂基透波复合材料的需求,研究石英纤维(QF)增强新型含硅改性聚芳炔(PSA)树脂基复合材料(QF/PSA)的制备方法及其性能。首先对树脂的黏度进行分析,确定了树脂在不同温度和时间下的黏度变化预测模型,适宜的树脂传递模塑工艺(Resin Transfer Molding,RTM)注胶温度在70~100℃范围;对树脂固化过程中的放热量、红外光谱和流变特性进行分析,确定了树脂的固化温度和固化过程,在250℃可以实现树脂的固化。基于上述分析进行了复合材料的高质量制备,并进一步对复合材料的微观形貌、力学性能、热膨胀性能、介电性能和耐高温性能进行分析和试验验证。材料的玻璃化转变温度(T_(g))大于500℃,5%热失重温度(T5%)高达625℃,石英灯试验表明耐高温能力可达520℃/1000 s;介电常数稳定在3.1~3.2,介电损耗稳定在0.003以下;力学性能满足功能材料的使用要求。上述研究表明,该新型含硅聚芳炔树脂基透波复合材料在航空航天领域具有重要的应用价值。展开更多
Poly（silanylenediethynylanthracene） （PSDEA） exhibits a hole-transporting ability experimentally. In order to simulate the property of PSDEA, a series of silanylenediethynylanthracene oligomers were designed. The s...Poly（silanylenediethynylanthracene） （PSDEA） exhibits a hole-transporting ability experimentally. In order to simulate the property of PSDEA, a series of silanylenediethynylanthracene oligomers were designed. The structures of these oligomers were optimized by using density function theory at B3LYP/6-31G（d） level. The energy gaps of the oligomers decrease with the increase in the chain length. The energy gaps of the oligomers also decrease in the presence of the electron-withdrawing group on the anthracene ring. The 13C chemical shifts and nucleus independent chemical shifts （NICS） at the anthracene ring center in the oligomers were calculated at B3LYP/6-31G level. The chemical shifts of the carbon atoms connected with the nitryl group changed upfield, compared with those of the carbon atoms without the nitryl group. The aromaticity at the anthracene ring center decreases in the presence of the electron-withdrawing group, whereas increases with the increase in the number of the silanylene units. The most sensitive location for calculating the NICS values is 0.1 nm above the anthracene plane.展开更多
文摘为满足工程领域对耐高温树脂基透波复合材料的需求,研究石英纤维(QF)增强新型含硅改性聚芳炔(PSA)树脂基复合材料(QF/PSA)的制备方法及其性能。首先对树脂的黏度进行分析,确定了树脂在不同温度和时间下的黏度变化预测模型,适宜的树脂传递模塑工艺(Resin Transfer Molding,RTM)注胶温度在70~100℃范围;对树脂固化过程中的放热量、红外光谱和流变特性进行分析,确定了树脂的固化温度和固化过程,在250℃可以实现树脂的固化。基于上述分析进行了复合材料的高质量制备,并进一步对复合材料的微观形貌、力学性能、热膨胀性能、介电性能和耐高温性能进行分析和试验验证。材料的玻璃化转变温度(T_(g))大于500℃,5%热失重温度(T5%)高达625℃,石英灯试验表明耐高温能力可达520℃/1000 s;介电常数稳定在3.1~3.2,介电损耗稳定在0.003以下;力学性能满足功能材料的使用要求。上述研究表明,该新型含硅聚芳炔树脂基透波复合材料在航空航天领域具有重要的应用价值。
文摘Poly（silanylenediethynylanthracene） （PSDEA） exhibits a hole-transporting ability experimentally. In order to simulate the property of PSDEA, a series of silanylenediethynylanthracene oligomers were designed. The structures of these oligomers were optimized by using density function theory at B3LYP/6-31G（d） level. The energy gaps of the oligomers decrease with the increase in the chain length. The energy gaps of the oligomers also decrease in the presence of the electron-withdrawing group on the anthracene ring. The 13C chemical shifts and nucleus independent chemical shifts （NICS） at the anthracene ring center in the oligomers were calculated at B3LYP/6-31G level. The chemical shifts of the carbon atoms connected with the nitryl group changed upfield, compared with those of the carbon atoms without the nitryl group. The aromaticity at the anthracene ring center decreases in the presence of the electron-withdrawing group, whereas increases with the increase in the number of the silanylene units. The most sensitive location for calculating the NICS values is 0.1 nm above the anthracene plane.
