The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management ...The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management materials.In this work,after the modification of polyimide(PI)fibers through oxidation and amination,the obtained PDA@OPI fibers(polydopamine(PDA)-modified pre-oxidized PI fibers)with abundant amino groups were mixed into graphene oxide(GO)to form uniform GO-PDA@OPI composites.Followed by evaporation,carbonization,graphitization and mechanical compaction,the G-gPDA@OPI films with a stable three-dimensional(3D)long-range interconnected covalent structure were built.In particular,due to the rich covalent bonds between GO layers and PDI@OPI fibers,the enhanced synergistic graphitization promotes an ordered graphitized structure with less interlayer distance between adjacent graphene sheets in composite film.As a result,the optimized G-gPDA@OPI film displays an improved tensile strength of 78.5 MPa,tensile strain of 19.4%and thermal conductivity of 1028 W/(m·K).Simultaneously,it also shows superior flexibility and high resilience.This work provides an easily-controlled and relatively low-cost route for fabricating multifunctional graphene heat dissipation films.展开更多
Two aromatic polyimides were prepared by two- step way. Firstly, the poly（amic acid）s were synthesized from 1, 3 - bis（4 - aminophenoxy）benzene and two different aromatic dianhydrides. Secondly, polyimides were pr...Two aromatic polyimides were prepared by two- step way. Firstly, the poly（amic acid）s were synthesized from 1, 3 - bis（4 - aminophenoxy）benzene and two different aromatic dianhydrides. Secondly, polyimides were prepared via thermal imidization of poly（amic acid） precursors. The polyimides prepared were insoluble in common organic solvents such as tetrahydrofuran, chloroform and N, N- dimethyiformamide. The inherent viscosities of poly（amic acid）s were 1.82 dL/g and 2.67 dL/g. The high inherent viscosities were due to the strong intra- or intermolecular hydrogen interaction. The polyimides were characterized by mechanical and thermal analysis. It was found that the samples are of excellent thermal stability, higher glass-transition temperature and excellent dynamic mechanical and thermal properties.展开更多
基金Projects(51971089, 51872087) supported by the National Natural Science Foundation of ChinaProject(2020JJ5021)supported by the Natural Science Foundation of Hunan Province,ChinaProject(kq1804010) supported by the Major Science and Technology Program of Changsha,China。
文摘The integration of electronic components and the popularity of flexible devices have come up with higher expectations for the heat dissipation capability and comprehensive mechanical performance of thermal management materials.In this work,after the modification of polyimide(PI)fibers through oxidation and amination,the obtained PDA@OPI fibers(polydopamine(PDA)-modified pre-oxidized PI fibers)with abundant amino groups were mixed into graphene oxide(GO)to form uniform GO-PDA@OPI composites.Followed by evaporation,carbonization,graphitization and mechanical compaction,the G-gPDA@OPI films with a stable three-dimensional(3D)long-range interconnected covalent structure were built.In particular,due to the rich covalent bonds between GO layers and PDI@OPI fibers,the enhanced synergistic graphitization promotes an ordered graphitized structure with less interlayer distance between adjacent graphene sheets in composite film.As a result,the optimized G-gPDA@OPI film displays an improved tensile strength of 78.5 MPa,tensile strain of 19.4%and thermal conductivity of 1028 W/(m·K).Simultaneously,it also shows superior flexibility and high resilience.This work provides an easily-controlled and relatively low-cost route for fabricating multifunctional graphene heat dissipation films.
基金the Key Natural Science Foundation of Shanghai (No.02ZA14004)
文摘Two aromatic polyimides were prepared by two- step way. Firstly, the poly（amic acid）s were synthesized from 1, 3 - bis（4 - aminophenoxy）benzene and two different aromatic dianhydrides. Secondly, polyimides were prepared via thermal imidization of poly（amic acid） precursors. The polyimides prepared were insoluble in common organic solvents such as tetrahydrofuran, chloroform and N, N- dimethyiformamide. The inherent viscosities of poly（amic acid）s were 1.82 dL/g and 2.67 dL/g. The high inherent viscosities were due to the strong intra- or intermolecular hydrogen interaction. The polyimides were characterized by mechanical and thermal analysis. It was found that the samples are of excellent thermal stability, higher glass-transition temperature and excellent dynamic mechanical and thermal properties.
