提出了一种新型的 Si COIMESFET器件结构 ,即介质槽隔离 Si COIMESFET。模拟结果表明 ,新型结构器件与常规平面 Si COI MESFET器件相比 ,击穿电压得到很大提高 ,从 3 80 V提高到近 1 1 0 0 V,而饱和漏电流和跨导下降。但通过器件结构的...提出了一种新型的 Si COIMESFET器件结构 ,即介质槽隔离 Si COIMESFET。模拟结果表明 ,新型结构器件与常规平面 Si COI MESFET器件相比 ,击穿电压得到很大提高 ,从 3 80 V提高到近 1 1 0 0 V,而饱和漏电流和跨导下降。但通过器件结构的优化设计可以保障在击穿电压提高的同时漏电流和跨导不会发生大的退化。该器件结构为高温、抗辐照和大功率集成电路研制打下基础。展开更多
We present novel Schottky barrier field effect transistors consisting of a parallel array of bottom-up grown silicon nanowires that are able to deliver high current outputs. Axial silicidation of the nanowires is used...We present novel Schottky barrier field effect transistors consisting of a parallel array of bottom-up grown silicon nanowires that are able to deliver high current outputs. Axial silicidation of the nanowires is used to create defined Schottky junctions leading to on/off current ratios of up to 106. The device concept leverages the unique transport properties of nanoscale junctions to boost device performance for macroscopic applications. Using parallel arrays, on-currents of over 500 gA at a source-drain voltage of 0.5 V can be achieved. The transconductance is thus increased significantly while maintaining the transfer characteristics of single nanowire devices. By incorporating several hundred nanowires into the parallel arra36 the yield of functioning transistors is dramatically increased and device- to-device variability is reduced compared to single devices. This new nanowire- based platform provides sufficient current output to be employed as a transducer for biosensors or a driving stage for organic light-emitting diodes （LEDs）, while the bottom-up nature of the fabrication procedure means it can provide building blocks for novel printable electronic devices.展开更多
文摘提出了一种新型的 Si COIMESFET器件结构 ,即介质槽隔离 Si COIMESFET。模拟结果表明 ,新型结构器件与常规平面 Si COI MESFET器件相比 ,击穿电压得到很大提高 ,从 3 80 V提高到近 1 1 0 0 V,而饱和漏电流和跨导下降。但通过器件结构的优化设计可以保障在击穿电压提高的同时漏电流和跨导不会发生大的退化。该器件结构为高温、抗辐照和大功率集成电路研制打下基础。
文摘We present novel Schottky barrier field effect transistors consisting of a parallel array of bottom-up grown silicon nanowires that are able to deliver high current outputs. Axial silicidation of the nanowires is used to create defined Schottky junctions leading to on/off current ratios of up to 106. The device concept leverages the unique transport properties of nanoscale junctions to boost device performance for macroscopic applications. Using parallel arrays, on-currents of over 500 gA at a source-drain voltage of 0.5 V can be achieved. The transconductance is thus increased significantly while maintaining the transfer characteristics of single nanowire devices. By incorporating several hundred nanowires into the parallel arra36 the yield of functioning transistors is dramatically increased and device- to-device variability is reduced compared to single devices. This new nanowire- based platform provides sufficient current output to be employed as a transducer for biosensors or a driving stage for organic light-emitting diodes （LEDs）, while the bottom-up nature of the fabrication procedure means it can provide building blocks for novel printable electronic devices.
