Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact...Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic(SH) coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.展开更多
This article introduces the concepts relating to deep-cut vacuum distillation and its suitability,and analyzes the deep-cut vacuum distillation technique licensed by the KBC Advanced Technologies to the 10 Mt/a CDU/VD...This article introduces the concepts relating to deep-cut vacuum distillation and its suitability,and analyzes the deep-cut vacuum distillation technique licensed by the KBC Advanced Technologies to the 10 Mt/a CDU/VDU of the Qingdao refinery and makes comparison on the test run data after commissioning of the distillation unit. The test results have confirmed that the operation of the CDU/VDU had reached the expected goal to achieve good social and economic benefits.展开更多
The general steam-injection pressing is mainly used for produce particleboards and medium density fiberboard. However, it is difficult to produce soft fiberboard with desired strength. However, the closing steam-injec...The general steam-injection pressing is mainly used for produce particleboards and medium density fiberboard. However, it is difficult to produce soft fiberboard with desired strength. However, the closing steam-injection pressing that based on the steam-injection pressing could. The wooden frame sealing up the slab could prevent the steam from emitting when the steam injected into the slab. The caloric released by steam condensation make the slab reach high temperature level for a short period. This method is very appropriate for making thick panels in theory, especially for the soft fiberboard. It makes a great leap forward on the hot pressing process that for wood-based panels. Moreover, it will be a meaningful technological breakthrough in developing new products and improving wood utilization.展开更多
基金the support of the National High-Tech Research and Development Program of China (863 Program) (2015AA03A101)
文摘Modeling vapor pressure is crucial for studying the moisture reliability of microelectronics, as high vapor pressure can cause device failures in environments with high temperature and humidity. To minimize the impact of vapor pressure, a super-hydrophobic(SH) coating can be applied on the exterior surface of devices in order to prevent moisture penetration. The underlying mechanism of SH coating for enhancing device reliability, however, is still not fully understood. In this paper, we present several existing theories for predicting vapor pressure within microelectronic materials. In addition, we discuss the mechanism and effectiveness of SH coating in preventing water vapor from entering a device, based on experimental results. Two theoretical models, a micro-mechanics-based whole-field vapor pressure model and a convection-diffusion model, are described for predicting vapor pressure. Both methods have been successfully used to explain experimental results on uncoated samples. However, when a device was coated with an SH nanocomposite, weight gain was still observed, likely due to vapor penetration through the SH surface. This phenomenon may cast doubt on the effectiveness of SH coatings in microelectronic devices. Based on current theories and the available experimental results, we conclude that it is necessary to develop a new theory to understand how water vapor penetrates through SH coatings and impacts the materials underneath. Such a theory could greatly improve microelectronics reliability.
文摘This article introduces the concepts relating to deep-cut vacuum distillation and its suitability,and analyzes the deep-cut vacuum distillation technique licensed by the KBC Advanced Technologies to the 10 Mt/a CDU/VDU of the Qingdao refinery and makes comparison on the test run data after commissioning of the distillation unit. The test results have confirmed that the operation of the CDU/VDU had reached the expected goal to achieve good social and economic benefits.
基金special research of nonprofit industry "Reseach on the Energy-saving and Sound Insulation Wall of PrefabricatedWooden Frame and Structural Materials"(No.200704013)
文摘The general steam-injection pressing is mainly used for produce particleboards and medium density fiberboard. However, it is difficult to produce soft fiberboard with desired strength. However, the closing steam-injection pressing that based on the steam-injection pressing could. The wooden frame sealing up the slab could prevent the steam from emitting when the steam injected into the slab. The caloric released by steam condensation make the slab reach high temperature level for a short period. This method is very appropriate for making thick panels in theory, especially for the soft fiberboard. It makes a great leap forward on the hot pressing process that for wood-based panels. Moreover, it will be a meaningful technological breakthrough in developing new products and improving wood utilization.
