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EBIC测定GaP的少子扩散长度和表面复合速度
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作者 李永良 杨锡震 +1 位作者 周艳 王亚非 《北京师范大学学报(自然科学版)》 CAS CSCD 北大核心 2001年第1期62-65,共4页
应用扫描电子显微镜 (SEM )对GaP半导体材料的 p n结进行线扫描 ,得到电子束感生电流 (EBIC)的线扫描曲线 .给出一简单模型 ,对GaP样品n区的EBIC线形进行计算 ,拟合实验曲线 。
关键词 少子扩散长度 表面合速度 电子束感生电流 半导体材料 磷化钙 P-N结 测定 EBIC线型
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Influence of high-speed milling parameter on 3D surface topography and fatigue behavior of TB6 titanium alloy 被引量:19
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作者 姚倡锋 武导侠 +3 位作者 靳淇超 黄新春 任军学 张定华 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第3期650-660,共11页
High-speed milling of titanium alloys is widely used in aviation and aerospace industries for its high efficiency and good quality.In order to optimize the machining parameters in high-speed milling TB6 titanium alloy... High-speed milling of titanium alloys is widely used in aviation and aerospace industries for its high efficiency and good quality.In order to optimize the machining parameters in high-speed milling TB6 titanium alloy,experiments of high-speed milling and fatigue were conducted to investigate the effect of parameters on 3D surface topography and fatigue life.Based on the fatigue fracture,the effect mechanism of surface topography on the fatigue crack initiation was proposed.The experiment results show that when the milling speed ranged from 100 m/min to 140 m/min,and the feed per tooth ranged from 0.02 mm/z to 0.06 mm/z,the obtained surface roughness were within the limit(0.8 μm).Fatigue life decreased sharply with the increase of surface equivalent stress concentration factor.The average error of fatigue life between the established model and the experimental results was 6.25%.The fatigue cracks nucleated at the intersection edge of machined surface. 展开更多
关键词 TB6 titanium alloy high-speed milling surface roughness surface topography fatigue life fatigue fracture
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Research on ultrasonic detection of complex surfaces
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作者 江健 周晓军 +1 位作者 郭天太 吴思源 《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 SCIE EI CAS CSCD 2005年第10期1146-1151,共6页
Parts of complex surface are widely used now in many fields, and their detection has caused much concern. In China many manufactories still carry on the traditional way of manual detection, which requires highly skill... Parts of complex surface are widely used now in many fields, and their detection has caused much concern. In China many manufactories still carry on the traditional way of manual detection, which requires highly skilled personnel and efficiency is low. Some large manufactories have imported auto-detecting equipments, which require CAD data on the parts, or just divide the surface into several approximate planes for automatic detection. Phased-array system is seldom used, and the cost is high. Besides, most of the systems have not considered the automatic sensitivity compensation of parts with varying thickness. To improve the detection quality and efficiency of nondestructive test (NDT) of parts of complex surface, this paper puts forward an integrated ultrasonic NDT system characterized by: (1) Use of ultrasonic measurement and reverse of curved surface to solve the CAD data problem; (2) Use of an automatic sensitivity compensation algorithm (based on the part’s modelling information obtained in surface reverse) to fit the variety of the thickness; (3) Use of template matching and pseudo-color imaging to improve the quality of detection results. The system features integration of low cost mature technologies, and is suitable for detection of various parts of different complex surfaces in medium-and-small enterprises. The test results showed that the system can automatically detect parts of complex surface successfully, and that the inspection result is good and reliable. 展开更多
关键词 Ultrasonic NDT Complex surface Automatic sensitivity compensation Ultrasonic measurement Surface reverse Template matching Pseudo-color imaging
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Optical and photo-carrier characterization of ultra-shallow junctions in silicon 被引量:2
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作者 HUANG QiuPing LI BinCheng REN ShengDong 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2013年第7期1294-1300,共7页
Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implanta... Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implantation at energies of 0.5-5 keV, at a dose of 1×1015 As+ /cm 2 and spike annealing. Experimentally the damaged layer of the as-implanted wafer and the recrystallization and activation of the post-annealed wafer were evaluated by SE in the spectral range from 0.27 to 20 m. The PCR amplitude decreased monotonically with the increasing implantation energy. The experimental results also showed that the PCR amplitudes of post-annealed USJ wafers were greatly enhanced, compared to the non-implanted and non-annealed substrate wafer. The PL measurements showed the enhanced PCR signals were attributed to the band-edge emissions of silicon. For explaining the PL enhancement, the electronic transport properties of USJ wafers were extracted via multi-wavelength PCR experiment and fitting. The fitted results showed the decreasing surface recombination velocity and the decreasing diffusion coefficient of the implanted layer contributed to the PCR signal enhancement with the decreasing implantation energy. SE, PCR and PL were proven to be non-destructive metrology tools for characterizing ultra-shallow junctions. 展开更多
关键词 photocarrier radiometry spectroscopic ellipsometry PHOTOLUMINESCENCE ultra-shallow junctions SILICON
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