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探讨水利水电工程地质中基覆界面的建模技巧
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作者 刘昊 《科技创新与应用》 2023年第16期170-173,共4页
为解决三维地质建模中岸坡覆盖层边界线附近生成的基覆界面网格易超出地面或与地形模型产生重叠的问题,该文通过阐述在岸坡覆盖层边界线附近分别复制岸坡覆盖层边界线向覆盖层深部按不同方式放线作为构造内压线;然后,再以覆盖层边界线... 为解决三维地质建模中岸坡覆盖层边界线附近生成的基覆界面网格易超出地面或与地形模型产生重叠的问题,该文通过阐述在岸坡覆盖层边界线附近分别复制岸坡覆盖层边界线向覆盖层深部按不同方式放线作为构造内压线;然后,再以覆盖层边界线、构造内压线、覆盖层深度元素综合构建基覆界面,以改善覆盖层边界线附近基覆界面建模难度,并提高基覆界面剪切、分离实体的成功率。 展开更多
关键词 覆盖层边界线 构造内压线 放线长度 构造角度 构造方向 地形坡度 基覆界面
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Effect of Catch Cup Geometry on 3D Boundary Layer Flow over the Wafer Surface in a Spin Coating
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作者 Mizue MUNEKATA Seiichi KIMURA +5 位作者 Hiroaki KURISHIMA Jinsuke TANAKA Sohei YAMAMOTO Hiroyuki YOSHIKAWA Kazuyoshi MATSUZAKI Hideki OHBA 《Journal of Thermal Science》 SCIE EI CAS CSCD 2008年第1期56-60,共5页
Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor instruments become more sophisticated. Spin coating is... Recently, development of high technology has been required for the formation of thin uniform film in manufacturing processes of semiconductor as the semiconductor instruments become more sophisticated. Spin coating is usually used for spreading photoresist on a wafer surface. However, since rotating speed of the disk is very high in spin coating, the dropped photoresist scarers outward and reattaches on the film surface. A catch cup is set up outside the wafer in spin coating, and scattered photoresist mist is removed from the wafer edge by the exhaust flow generated at the gap between the wafer edge and the catch cup. In the dry process of a spin coating, it is a serious concern that the film thickness increases near the wafer edge in the case of low rotating speed. The purpose of this study is to make clear the effect of the catch cup geometry on the 3D boundary layer flow over the wafer surface and the drying rate of liquid film. 展开更多
关键词 Rotating disk Spin coating Boundary layer flow Laser Doppler velocimeter Infrared camera
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