Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is ...Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.展开更多
基金The Natural Science Foundation of Jiangsu Province(No.BK2012559)Qing Lan Project of Jiangsu Province
文摘Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.
