光学零件超精密加工机理及新技术

本文较全面阐述了光学零件超精密加工机理及新技术,反映了国外最新技术进展与水平。

Ultra-precision machining of reflector array for laser diode beam shaping

Ultra-precision machining is an effective approach to achieve high dimension accuracy and surface finish required in optical and laser components. An extensive study using a two-axis diamond turning machine is conducted to machine the reflector arrays used for laser diode beam shaping. To position the workpiece precisely, theoretical analysis is made so that the dimensional accuracy can be achieved. Investigations into machining burr reduction are carried out. With the process developed, reflectors with optical surface finish of 8 nm in Ra and minimized burr size of less than 0.5 μm have been achieved.

Fully Integrated Machine Control for Ultra Precision Machining

To meet the demands for highly advanced components with ultra precise contour accuracy and optical surface quality arising in the fields of photonics and optics, automotive, medical applications and biotechnology, consumer electronics and renewable energy, more advanced production machines and processes have to be developed. As the complexity of machine tools rises steadily, the automation of manufacture increases rapidly, processes become more integrated and cycle times have to be reduced significantly, challenges of engineering efficient machine tools with respect to these demands expand every day. Especially the manufacture of freeform geometries with non-continuous and asymmetric surfaces requires advanced diamond machining strategies involving highly dynamic axes movements with a high bandwidth and position accuracy. Ultra precision lathes additionally equipped with Slow Tool and Fast Tool systems can be regarded as state-of-the-art machines achieving the objectives of high quality optical components. The mechanical design of such ultra precision machine tools as well as the mechanical integration of additional highly dynamic axes are very well understood today. In contrast to that, neither advanced control strategies for ultra precision machining nor the control integration of additional Fast Tool systems have been sufficiently developed yet. Considering a complex machine setup as a mechatronic system, it becomes obvious that enhancements to further increase the achievable form accuracy and surface quality and at the same time decrease cycle times and error sensitivity can only be accomplished by innovative, integrated control systems. At the Fraunhofer Institute for Production Technology IPT a novel, fully integrated control approach has been developed to overcome the drawbacks of state-of-the-art machine controls for ultra precision processes. Current control systems are often realized as decentralized solutions consisting of various computational hardware components for setpoint generation, machine control, HMI （human machine interface）, Slow Tool control and Fast Tool control. While implementing such a distributed control strategy, many disadvantages arise in terms of complex communication interfaces, discontinuous safety structures, synchronization of cycle times and the machining accuracy as a whole. The novel control approach has been developed as a fully integrated machine control including standard CNC （computer numerical control） and PLC （programmable logic controller） functionality, advanced setpoint generation methods, an extended HMI as well as an FPGA （field programmable gate array）-based controller for a voice coil driven Slow Tool and a piezo driven Fast Tool axis. As the new control system has been implemented as a fully integrated platform using digital communication via EtherCAT, a continuous safety strategy could be realized, the error sensitivity and EMC susceptibility could be significantly decreased and the overall process accuracy from setpoint generation over path interpolation to axes movements could be enhanced. The novel control at the same time offers additional possibilities of automation, process integration, online data acquisition and evaluation as well as error compensation methods.

Micro water dissolution machining principle and its application in ultra-precision processing of KDP optical crystal

In this paper, a micro water dissolution machining （MWDM） principle is proposed for machining potassium dihydrogen phosphate （KDP） crystal using water-in-oil micro-emulsion as an abrasive-free polishing fluid. In addition, two instances of the application of this principle to ultra-precision machining of KDP crystals are presented. Computer-controlled optical surfacing （CCOS） and diamond wire cutting （DWC） process were carried out according to the MWDM principle. In the case of the CCOS technology, it is found that the micro-waviness was removed completely by following the MWDM principle. The surface undulation decreased from 40 nm to less than 10 nm, and the surface root-mean-square （rms） roughness obviously reduced from 8.147 to 2.660 nm. In the case of the DWC process, the surface rms roughness reduced from 8.012 to 2.391 gm, and the cutting efficiency was improved. These results indicate that the MWDM principle can efficiently improve the machining quality of KDP optical crystal and has a great potential to machine water-soluble materials.

Investigation on the cleaning of KDP ultra-precision surface polished with micro water dissolution machining principle

A potassium dihydrogen phosphate(KDP) optical crystal was machined to an ultra-precision surface with water-in-oil(W/O) micro emulsion polishing fluid. The micro water dissolution principle utilized in the machining process is discussed, its planarization mechanism is illustrated, and an ultra-precision polished surface with 2.205 nm RMS roughness is obtained. However, a substantial quantity of residual contamination remained on the polished surface after machining. This can seriously impact the optical performance of the crystal, and so it must be removed. Fourier transform infrared(FTIR) spectroscopy was used to conduct an investigation into the composition of the surface residue, and the results showed that the residue was comprised of organic chemicals with hydrocarbon chains and aromatic ether, i.e., mostly the polishing fluid. The cleaning method and the principle on which the KDP ultra precision surface investigation is based are discussed in detail, and the cleaning experiments with selected KDP-compatible organic solvents were then performed. FTIR transmittance spectra measurement and microscopic observations were employed to assess the effects of the cleaning process on the surface of the KDP crystal. The results showed that toluene cleaning achieved the most desirable results. This cleaning method produced a surface roughness of 1.826 nm RMS, which allows the KDP crystal to be applied to subsequent engineering applications.