超细金粉在电子浆料中的应用

讨论了#1和#2两种超细金粉在电子浆料中的应用。#1超细金粉用于印刷型金导体浆料中，线分辨率高，性能稳定。#2超细金粉应用于焊接型金导体浆料，满足欧姆接触和附着力的要求。

微电子技术用高分散性超细金粉

研制用于微电子技术的印刷型球形金粉和焊接型片状金粉。球形表面光滑的金粉PAuC-3粒度分布范围窄，粒度小，用于印刷型金导体，具有良 好的导电性、印刷性和线分辨率，膜表面平整度、清晰度、背光孔隙度高，收缩率、流延率以及厚膜切面密度小。鳞片状金粉粒度较大，且粒度分布范围宽，用于焊接型金导体浆料中形成欧姆接触，满足焊接强度的要求。

化学还原法制备纳米金溶胶方法研究

采用水作分散介质，聚乙烯基吡咯烷酮（PVP）为保护剂，抗坏血酸作还原剂，较高浓度的氯金酸溶液为原料，在弱酸性条件下通过化学还原法制得球状、最大粒径为20nm的金溶胶。考察了还原剂用量、介质pH值、分散剂用量、温度等因素对金粒径的影响，并得到制备稳定的纳米金溶胶的较优条件：pH=3～5，PVP／HAuCl4=1，抗坏血酸，Au（摩尔比）=3，常温。此方法具备不用搅拌、金不返溶、成本低的优点。

纳米金溶胶制备研究

以水为分散介质，PVP为分散剂，抗坏血酸作还原剂，用较高浓度的氯金酸溶液，在弱酸性条件下，通过化学还原法制得球状、最大粒径为20 nm的金溶胶。结果表明，还原剂用量为抗坏血酸／Au(摩尔比）＝3，PVP的用量取PVP／HAuCl4（质量比）＝1，还原体系自身pH值3-5,常温293K为金溶胶制备的最佳条件。在此条件下制得的金粉粒度小，分散性好，且十分稳定，无反溶现象。

Effect of milling time on microstructure of Ti35Nb2.5Sn/10HA biocomposite fabricated by powder metallurgy and sintering

A new β-Ti based Ti35Nb2.5Sn/10 hydroxyapitite（HA） biocompatible composite was fabricated by mechanical milling and pulsed current activated sintering（PCAS）.The microstructures of Ti35Nb2.5Sn/10HA powder particles and composites sintered from the milled powders were studied.Results indicated that α-Ti phase began to transform into β-Ti phase after the powders were mechanically milled for 8 h.After mechanical milling for 12 h,α-Ti completely transformed into β-Ti phase,and the ultra fine Ti35Nb2.5Sn/10HA composite powders were obtained.And ultra fine grain sized Ti35Nb2.5Sn/10HA sintered composites were obtained by PCAS.The hardness and relative density of the sintered composites both increased with increasing the ball milling time.