The novel reactive transfer printing of silk was carried out through a hot-press adhesion and steaming. The special transfer paper was prepared by coating the paste mainly containing hot-melt adhesive hlgh-substituted...The novel reactive transfer printing of silk was carried out through a hot-press adhesion and steaming. The special transfer paper was prepared by coating the paste mainly containing hot-melt adhesive hlgh-substituted hydroxypropyl cellulose （H-HPC） and printing thickener earboxymethyl cellulose （CMC）. The effects of each ingredient in the paste on color yield of the prints and dye penetration were investigated. The major results indicate that, color yield is chiefly governed by the adhesion extent imparted by H-HPC, the type of fixing alkaline agent, and the content of urea. Trichloroacetic acid （TCAA） as the fixing alkaline agent and adding 5% urea can enhance the color depth obviously. Dye penetration depends on the coating quantity on the transfer paper, the contents of urea and dicyandiamide. The printed silk possesses a higher color yield, color fastness of grade 3 or above, clear sharpness, and good handle when the paste contains 3 % H-HPC, 0. 7 % CMC, 3 % TCAA, 5 % urea, 3 % dicyandiamide, and 0. 5 % physical sorbent nano-silica.展开更多
Recent breakthrough in eutectic gallium-indium alloy has revealed its great potential in modern electronic engineering. Here, we established a general method towards super-fast fabrication of flexible electronics via ...Recent breakthrough in eutectic gallium-indium alloy has revealed its great potential in modern electronic engineering. Here, we established a general method towards super-fast fabrication of flexible electronics via semi-liquid metal and adhesion-selection enabled rolling and transfer (SMART) printing on various substrates. Based on the semiliquid metal and its adhesion-difference on specifically designed target materials, we demonstrated that the rolling and transfer printing method could serve to rapidly manufacture a wide variety of complicated patterns with high resolution and large size. The process is much faster than most of the currently existing electronic fabrication strategies including liquid metal printing ever developed, and the cost either in time or consumption rate is rather low. As illustrated, a series of functional flexible and stretchable electronics such as multiple layer and large area circuits were fabricated to show their superior merit in combination with electrical conductivity and deformability. In addition, it was also demonstrated that the electronics fabricated in this way exhibited good repeatablity. A most noteworthy advantage is that all the fabrication processes could be highly automatic in the sense that user-friendly machines can thus be developed. This method paves a practical way for super-fast soft electronics manufacture and is expected to play an important role in the coming industry and consumer electronics.展开更多
基金Jiangsu Province Project of Postgraduate Innovation Engineering,China(No.CXZZ12_0821)Industry-academic Joint Technological Innovations Fund Project of Jiangsu Province,China(No.BY2012120)Suzhou Project of Scientific and Technical Supporting,China(No.ZXS2012001)
文摘The novel reactive transfer printing of silk was carried out through a hot-press adhesion and steaming. The special transfer paper was prepared by coating the paste mainly containing hot-melt adhesive hlgh-substituted hydroxypropyl cellulose （H-HPC） and printing thickener earboxymethyl cellulose （CMC）. The effects of each ingredient in the paste on color yield of the prints and dye penetration were investigated. The major results indicate that, color yield is chiefly governed by the adhesion extent imparted by H-HPC, the type of fixing alkaline agent, and the content of urea. Trichloroacetic acid （TCAA） as the fixing alkaline agent and adding 5% urea can enhance the color depth obviously. Dye penetration depends on the coating quantity on the transfer paper, the contents of urea and dicyandiamide. The printed silk possesses a higher color yield, color fastness of grade 3 or above, clear sharpness, and good handle when the paste contains 3 % H-HPC, 0. 7 % CMC, 3 % TCAA, 5 % urea, 3 % dicyandiamide, and 0. 5 % physical sorbent nano-silica.
基金partially supported by the National Natural Science Foundation of China Key Project (91748206)Dean’s Research Funding and the Frontier Project of the Chinese Academy of Sciences
文摘Recent breakthrough in eutectic gallium-indium alloy has revealed its great potential in modern electronic engineering. Here, we established a general method towards super-fast fabrication of flexible electronics via semi-liquid metal and adhesion-selection enabled rolling and transfer (SMART) printing on various substrates. Based on the semiliquid metal and its adhesion-difference on specifically designed target materials, we demonstrated that the rolling and transfer printing method could serve to rapidly manufacture a wide variety of complicated patterns with high resolution and large size. The process is much faster than most of the currently existing electronic fabrication strategies including liquid metal printing ever developed, and the cost either in time or consumption rate is rather low. As illustrated, a series of functional flexible and stretchable electronics such as multiple layer and large area circuits were fabricated to show their superior merit in combination with electrical conductivity and deformability. In addition, it was also demonstrated that the electronics fabricated in this way exhibited good repeatablity. A most noteworthy advantage is that all the fabrication processes could be highly automatic in the sense that user-friendly machines can thus be developed. This method paves a practical way for super-fast soft electronics manufacture and is expected to play an important role in the coming industry and consumer electronics.
