The exfoliation corrosion （EFC） behavior of 7050-T6 aluminum alloy treated with various quench transfer time after solution heat treatment was investigated by standard EFC immersion tests, strength loss measurements...The exfoliation corrosion （EFC） behavior of 7050-T6 aluminum alloy treated with various quench transfer time after solution heat treatment was investigated by standard EFC immersion tests, strength loss measurements after EFC tests and electrochemical impedance spectroscope （EIS） technique. The results showed that EFC resistance of the alloy decreased with increasing quench transfer time. Backscattered electron scanning electron microscope （SEM） together with transmission electron microscope （TEM） observations revealed that the coverage ratio and microstructure of precipitates at grain boundary area are the most important factors which influence the EFC susceptibility of the alloy, while precipitate-free zone （PFZ） near grain boundary has no or only a minor effect on it. In addition, galvanostatic measurements of the alloy present a good correlation between EFC resistance and transients in potential. The cumulated number of transients in potential can be used to evaluate EFC resistance of the alloy.展开更多
Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is ...Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.展开更多
基金Project(2012CB619502)supported by the National Basic Research Program of China
文摘The exfoliation corrosion （EFC） behavior of 7050-T6 aluminum alloy treated with various quench transfer time after solution heat treatment was investigated by standard EFC immersion tests, strength loss measurements after EFC tests and electrochemical impedance spectroscope （EIS） technique. The results showed that EFC resistance of the alloy decreased with increasing quench transfer time. Backscattered electron scanning electron microscope （SEM） together with transmission electron microscope （TEM） observations revealed that the coverage ratio and microstructure of precipitates at grain boundary area are the most important factors which influence the EFC susceptibility of the alloy, while precipitate-free zone （PFZ） near grain boundary has no or only a minor effect on it. In addition, galvanostatic measurements of the alloy present a good correlation between EFC resistance and transients in potential. The cumulated number of transients in potential can be used to evaluate EFC resistance of the alloy.
基金The Natural Science Foundation of Jiangsu Province(No.BK2012559)Qing Lan Project of Jiangsu Province
文摘Based on an avalanche photodiode（ APD） detecting array working in Geiger mode（ GM-APD）, a high-performance infrared sensor readout integrated circuit（ ROIC） used for infrared 3D（ three-dimensional） imaging is proposed. The system mainly consists of three functional modules, including active quenching circuit（ AQC）, time-to-digital converter（ TDC） circuit and other timing controller circuit. Each AQC and TDC circuit together constitutes the pixel circuit. Under the cooperation with other modules, the current signal generated by the GM-APD sensor is detected by the AQC, and the photon time-of-flight（ TOF） is measured and converted to a digital signal output to achieve a better noise suppression and a higher detection sensitivity by the TDC. The ROIC circuit is fabricated by the CSMC 0. 5 μm standard CMOS technology. The array size is 8 × 8, and the center distance of two adjacent cells is 100μm. The measurement results of the chip showthat the performance of the circuit is good, and the chip can achieve 1 ns time resolution with a 250 MHz reference clock, and the circuit can be used in the array structure of the infrared detection system or focal plane array（ FPA）.
