A novel joining method,double-stage diffusion-brazing of an AZ31 magnesium alloy and a 304L austenitic stainless steel,was carried out using a pure copper interlayer.The solid-state diffusion bonding of 304L to copper...A novel joining method,double-stage diffusion-brazing of an AZ31 magnesium alloy and a 304L austenitic stainless steel,was carried out using a pure copper interlayer.The solid-state diffusion bonding of 304L to copper was conducted at 850 ℃ for 20 min followed by brazing to AZ31 at 520 ℃ and 495 ℃ for various time.Microstructural characteristics of the diffusion-brazed joints were investigated in detail.A defect free interface of Fe-Cu diffusion area appeared between the Cu alloy and the 304L steel.Cu-Mg reaction products were formed between AZ31 and Cu alloys.A layered structure including AZ31/Cu-Mg compounds/Cu/Fe-Cu diffusion layer/304L was present in the joint.With time prolonging,the reduction in the width of Cu layer was balanced by the increase in the width of Cu-Mg compounds zone.Microhardness peaks in the zone between AZ31 and Cu layer were attributed to the formation of Mg-Cu compounds in this zone.展开更多
基金Project(51205428) supported by the National Natural Science Foundation of ChinaProject(CDJRC10130011) supported by the Fundamental Research Funds for the Central Universities,China
文摘A novel joining method,double-stage diffusion-brazing of an AZ31 magnesium alloy and a 304L austenitic stainless steel,was carried out using a pure copper interlayer.The solid-state diffusion bonding of 304L to copper was conducted at 850 ℃ for 20 min followed by brazing to AZ31 at 520 ℃ and 495 ℃ for various time.Microstructural characteristics of the diffusion-brazed joints were investigated in detail.A defect free interface of Fe-Cu diffusion area appeared between the Cu alloy and the 304L steel.Cu-Mg reaction products were formed between AZ31 and Cu alloys.A layered structure including AZ31/Cu-Mg compounds/Cu/Fe-Cu diffusion layer/304L was present in the joint.With time prolonging,the reduction in the width of Cu layer was balanced by the increase in the width of Cu-Mg compounds zone.Microhardness peaks in the zone between AZ31 and Cu layer were attributed to the formation of Mg-Cu compounds in this zone.
